グロース List of Products and Services

"High-frequency substrates" are one of the areas in which our company excels, and we have a wealth of production experience. We offer a wide range of low dielectric constant and low loss materials that are essential for substrates transmitting GHz band and Gbps high-speed signals. We can accommodate small production quantities and respond with short lead times, so please feel free to consult with us. 【Materials we handle (example)】 ■R-5775 (MEGTRON6) ■CCL-HL950SK TypeSK ■MCL-LX-67Y ■NPC-F220 ■CGP-500 ■CS-3376B *For more details, please refer to the related links or feel free to contact us.

Our company is capable of producing various specifications of circuit boards, primarily focusing on small quantities, with a short lead time. We accommodate not only rigid-flex boards, build-up boards, flexible boards, and through-hole boards (standard boards), but also special materials such as high-frequency boards and glass boards. As a fabless company, we have established a production system that balances quality and delivery times by collaborating with domestic manufacturers that possess high technical capabilities through our unique network. 【Examples of Circuit Boards We Handle】 ■ Multilayer boards (FR-4) ■ Flexible boards (FPC) ■ Rigid-flex boards ■ Build-up boards ■ High-frequency boards ■ Ceramic boards *For more details, please refer to the related links or feel free to contact us.

Our company has a track record in artwork design and PCB design work for robot motor drivers and sensing boards. We can accommodate requests such as transitioning from an old PCB (QFP) to a new PCB (BGA) while keeping the number of layers and dimensions the same as the current design, and we can also handle the implementation of paired chips and the mounting of optical lenses within budget. Please feel free to contact us when you need our services. 【Overview of Achievements in Robot Motor Drivers and Sensing Boards】 ■ Gate driver chip compatible with 3-phase brushless motors ■ High-voltage MOSFET driving at 48V, with current sensing and overcurrent monitoring using a 16-bit ADC ■ PWM frequency of 100 kHz, with a measured driving current of 2A ■ Microcontroller, serial bus, GPIO, level shifter ■ Designed to be more compact than previous PCBs, with heat dissipation measures and improved stability of the serial bus operation *For more details, please download the PDF or feel free to contact us.

Our company has a track record in artwork design and circuit board design for OPV-driven sensor node terminals. We have developed COB evaluation boards for bare ICs, prototypes for QFN packages, and evaluation boards for packages, as well as a 28.5GHz DC characteristics and S-parameter automatic measurement system for shipping inspection. Additionally, we handle everything from structural considerations to circuit design, SIM, circuit board design, and manufacturing. 【Overview of Achievements in OPV-Driven Sensor Node Terminals】 ■ Development of OPV-driven sensor nodes equipped with temperature, humidity, and illuminance sensors ■ We have also created an iPhone app that allows users to check the numerical values organic photovoltaic *For more details, please download the PDF or feel free to contact us.

We handle suitable "build-up substrates" for interposers. The minimum line and space are L/S = 20/20μm. It supports LVH diameter/land diameter = 60/90μm with an LVH pitch of 150μm. Using a core of 25μm and prepreg of 20μm allows for thin board construction. 【Application Areas】 ■ Wireless modules ■ Interposers ■ Smartphones ■ Tablet devices ■ Digital cameras ■ Communication base stations *For more details, please download the PDF or feel free to contact us.

We would like to introduce our "Rigid Flexible Circuit Boards." Traditionally, connections were made using B to B connectors, but with the rigid-flex design, both the area and height have been reduced to less than half. These can be applied in fields such as automotive, tablet devices, smartphones, and medical equipment. 【Board Specifications】 ■ 8-layer through-hole board (Rigid Flexible Circuit Board) ■ Board thickness t = 0.7mm ■ Flexible part thickness t = 0.28mm ■ Minimum L/S: 0.1/0.1mm ■ Minimum Via: hole diameter 0.25mm ■ Land diameter surface layer 0.45mm, inner layer 0.5mm *For more details, please download the PDF or feel free to contact us.

Our company specializes in "circuit board design and pattern design." Our circuit designers create boards that reliably function in a single prototype for high-speed circuit boards and analog circuit boards. We have strengths in hardware development and circuit design, honed over many years in the set manufacturing industry. 【Strengths in Circuit Board Design】 ■ Extensive experience in developing analog circuits such as amplifiers and power supplies ■ Expertise in hardware development and circuit design cultivated over many years in the set manufacturing industry ■ Knowledge of pattern design that delivers performance and is resistant to noise ■ Knowledge of measures for signal standards and safety standards ■ Proven track record from product planning to design and mass production launch *For more details, please download the PDF or feel free to contact us.

We provide transparent FPC with excellent transparency in a short delivery time. We can use low-cost PET material "Polyethylene Terephthalate," and we also adopt PEN material "Polyethylene Naphthalate" for the insulation layer, enabling low-temperature reflow mounting. Additionally, we support the transparency of the resist. 【Features】 ■ Achieving short delivery times from order to delivery, possible only with our company ■ Use of low-cost PET material "Polyethylene Terephthalate" ■ Adoption of PEN material "Polyethylene Naphthalate" for the insulation layer, enabling low-temperature reflow mounting ■ Support for the transparency of the resist *For more details, please download the PDF or feel free to contact us.

We create "heat dissipation substrates" that allow for the selection of substrate materials and configurations tailored to specific applications and heat dissipation challenges. Thick copper plated substrates form circuits for heat dissipation from heat-generating components directly to conductors and the back surface of the substrate through copper plating. In metal base substrates, a dielectric (insulation layer) and copper foil are laminated on copper or aluminum, and by connecting to copper or aluminum plates through filled vias, high heat dissipation is achieved. Additionally, we have extensive experience in the mechanical design and manufacturing of various heat dissipation carriers and enclosures, as well as the selection and assembly of heat sinks and TIM materials, allowing us to provide consistent support. 【Application Fields】 ■ High Frequency ■ Automotive ■ Power Modules ■ High Power LEDs ■ Inverters *For more details, please download the PDF or feel free to contact us.