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Electronic Components and Semiconductors
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グロース

Establishment2008 year
capital3Ten thousand
number of employees17
addressKanagawa/Naka-ku, Yokohama-shi/6-84-2 Ota Town, Daiki Life Yokohama Building
phone045-680-4722
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last updated:Sep 16, 2025
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グロース List of Products and Services

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FPGA design and development FPGA design and development
Power supply unit design and development Power supply unit design and development
Wireless communication module development Wireless communication module development
Artwork design Artwork design
Noise countermeasures in artwork design Noise countermeasures in artwork design
Heat management in artwork design Heat management in artwork design
High-speed transmission line design in artwork design High-speed transmission line design in artwork design
Large-scale circuit design in artwork design. Large-scale circuit design in artwork design.
Circuit design support Circuit design support
Substrate manufacturing Substrate manufacturing
Bear chip implementation Bear chip implementation
BGA rework BGA rework
Substrate

Substrate manufacturing

Our circuit board manufacturing service realizes the production of high-quality printed circuit boards that meet diverse needs, focusing on small quantities. We can accommodate various types of boards, including thick copper boards, multilayer boards, and flexible boards, by introducing the latest technologies that enhance design flexibility. In particular, thick copper boards are suitable for high current applications and excel in heat dissipation and durability. We also support miniaturization and high-density mounting of circuit boards, allowing for flexible responses to complex circuit designs. Under a strict quality control system, we deliver reliable products and strongly support our customers' product development and mass production. ■ Types of Boards Handled - Multilayer boards (FR-4) - Flexible boards (FPC) - Rigid-flex boards - Build-up boards - High-frequency boards - Glass boards - Ceramic boards

High-frequency substrate

Many production achievements and a rich lineup! We also accommodate small quantities and short delivery times.

"High-frequency substrates" are one of the areas in which our company excels, and we have a wealth of production experience. We offer a wide range of low dielectric constant and low loss materials that are essential for substrates transmitting GHz band and Gbps high-speed signals. We can accommodate small production quantities and respond with short lead times, so please feel free to consult with us. 【Materials we handle (example)】 ■R-5775 (MEGTRON6) ■CCL-HL950SK TypeSK ■MCL-LX-67Y ■NPC-F220 ■CGP-500 ■CS-3376B *For more details, please refer to the related links or feel free to contact us.

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Substrate manufacturing

High quality, short delivery times, and responsiveness that can only be achieved by a fabless company!

Our company is capable of producing various specifications of circuit boards, primarily focusing on small quantities, with a short lead time. We accommodate not only rigid-flex boards, build-up boards, flexible boards, and through-hole boards (standard boards), but also special materials such as high-frequency boards and glass boards. As a fabless company, we have established a production system that balances quality and delivery times by collaborating with domestic manufacturers that possess high technical capabilities through our unique network. 【Examples of Circuit Boards We Handle】 ■ Multilayer boards (FR-4) ■ Flexible boards (FPC) ■ Rigid-flex boards ■ Build-up boards ■ High-frequency boards ■ Ceramic boards *For more details, please refer to the related links or feel free to contact us.

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[Artwork Design/Circuit Board Design Work] Motor Driver, Sensing Circuit Board

Supports IMX series CMOS image sensor evaluation IF boards and QSFP 40Gbps optical transceiver modules!

Our company has a track record in artwork design and PCB design work for robot motor drivers and sensing boards. We can accommodate requests such as transitioning from an old PCB (QFP) to a new PCB (BGA) while keeping the number of layers and dimensions the same as the current design, and we can also handle the implementation of paired chips and the mounting of optical lenses within budget. Please feel free to contact us when you need our services. 【Overview of Achievements in Robot Motor Drivers and Sensing Boards】 ■ Gate driver chip compatible with 3-phase brushless motors ■ High-voltage MOSFET driving at 48V, with current sensing and overcurrent monitoring using a 16-bit ADC ■ PWM frequency of 100 kHz, with a measured driving current of 2A ■ Microcontroller, serial bus, GPIO, level shifter ■ Designed to be more compact than previous PCBs, with heat dissipation measures and improved stability of the serial bus operation *For more details, please download the PDF or feel free to contact us.

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[Artwork Design/Circuit Board Design Work] OPV-driven Sensor Node Terminal

Support for the development of 28.5GHz band ICs for 5G base stations, as well as compatibility with M.2 extension cables (400mm) for PCIe Gen5!

Our company has a track record in artwork design and circuit board design for OPV-driven sensor node terminals. We have developed COB evaluation boards for bare ICs, prototypes for QFN packages, and evaluation boards for packages, as well as a 28.5GHz DC characteristics and S-parameter automatic measurement system for shipping inspection. Additionally, we handle everything from structural considerations to circuit design, SIM, circuit board design, and manufacturing. 【Overview of Achievements in OPV-Driven Sensor Node Terminals】 ■ Development of OPV-driven sensor nodes equipped with temperature, humidity, and illuminance sensors ■ We have also created an iPhone app that allows users to check the numerical values organic photovoltaic *For more details, please download the PDF or feel free to contact us.

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Build-up substrate

Fine pitch, fine pattern, slim type! Dramatically improved wiring flexibility.

We handle suitable "build-up substrates" for interposers. The minimum line and space are L/S = 20/20μm. It supports LVH diameter/land diameter = 60/90μm with an LVH pitch of 150μm. Using a core of 25μm and prepreg of 20μm allows for thin board construction. 【Application Areas】 ■ Wireless modules ■ Interposers ■ Smartphones ■ Tablet devices ■ Digital cameras ■ Communication base stations *For more details, please download the PDF or feel free to contact us.

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Rigid-flexible substrate

A "trump card" for miniaturization and low profile! Applicable to digital cameras, robots, and more.

We would like to introduce our "Rigid Flexible Circuit Boards." Traditionally, connections were made using B to B connectors, but with the rigid-flex design, both the area and height have been reduced to less than half. These can be applied in fields such as automotive, tablet devices, smartphones, and medical equipment. 【Board Specifications】 ■ 8-layer through-hole board (Rigid Flexible Circuit Board) ■ Board thickness t = 0.7mm ■ Flexible part thickness t = 0.28mm ■ Minimum L/S: 0.1/0.1mm ■ Minimum Via: hole diameter 0.25mm ■ Land diameter surface layer 0.45mm, inner layer 0.5mm *For more details, please download the PDF or feel free to contact us.

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Circuit board design and pattern design

Guaranteed operation with a single prototype! Proven track record from product planning to design and mass production launch.

Our company specializes in "circuit board design and pattern design." Our circuit designers create boards that reliably function in a single prototype for high-speed circuit boards and analog circuit boards. We have strengths in hardware development and circuit design, honed over many years in the set manufacturing industry. 【Strengths in Circuit Board Design】 ■ Extensive experience in developing analog circuits such as amplifiers and power supplies ■ Expertise in hardware development and circuit design cultivated over many years in the set manufacturing industry ■ Knowledge of pattern design that delivers performance and is resistant to noise ■ Knowledge of measures for signal standards and safety standards ■ Proven track record from product planning to design and mass production launch *For more details, please download the PDF or feel free to contact us.

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Transparent flexible substrate

Ideal for wearable devices! Applicable to medical and smartphones, etc.

We provide transparent FPC with excellent transparency in a short delivery time. We can use low-cost PET material "Polyethylene Terephthalate," and we also adopt PEN material "Polyethylene Naphthalate" for the insulation layer, enabling low-temperature reflow mounting. Additionally, we support the transparency of the resist. 【Features】 ■ Achieving short delivery times from order to delivery, possible only with our company ■ Use of low-cost PET material "Polyethylene Terephthalate" ■ Adoption of PEN material "Polyethylene Naphthalate" for the insulation layer, enabling low-temperature reflow mounting ■ Support for the transparency of the resist *For more details, please download the PDF or feel free to contact us.

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Heat dissipation substrate

Achieving both heat dissipation measures for high-heat-generating components and ensuring transmission characteristics! Application to low-loss materials is also possible.

We create "heat dissipation substrates" that allow for the selection of substrate materials and configurations tailored to specific applications and heat dissipation challenges. Thick copper plated substrates form circuits for heat dissipation from heat-generating components directly to conductors and the back surface of the substrate through copper plating. In metal base substrates, a dielectric (insulation layer) and copper foil are laminated on copper or aluminum, and by connecting to copper or aluminum plates through filled vias, high heat dissipation is achieved. Additionally, we have extensive experience in the mechanical design and manufacturing of various heat dissipation carriers and enclosures, as well as the selection and assembly of heat sinks and TIM materials, allowing us to provide consistent support. 【Application Fields】 ■ High Frequency ■ Automotive ■ Power Modules ■ High Power LEDs ■ Inverters *For more details, please download the PDF or feel free to contact us.

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Handbook for Circuit Board Noise Countermeasures

We support product development without setbacks by implementing noise countermeasures from the early design stage.

This document is a "PCB Noise Mitigation Handbook" for circuit designers, FPGA developers, and electronic device developers. It introduces the importance of GND, voltage drop, and the significance of "power/GND reinforcement" in relation to DC analysis and load variations. Additionally, it includes information on "impedance disturbances and countermeasures," such as the disruption of impedance and its solutions. [Contents] ■ Crosstalk suppression and isolation ■ Power/GND reinforcement ■ Impedance matching and equal-length wiring *For more details, please download the PDF or feel free to contact us.

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