Electronic Components and Semiconductors

グロース

Establishment2008 year
capital3Ten thousand
number of employees17
addressKanagawa/Naka-ku, Yokohama-shi/6-84-2 Ota Town, Daiki Life Yokohama Building
phone045-680-4722
last updated：
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グロース List of Products and Services

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FPGA design and development FPGA design and development
Power supply unit design and development Power supply unit design and development
Wireless communication module development Wireless communication module development
Artwork design Artwork design
Noise countermeasures in artwork design Noise countermeasures in artwork design
Heat management in artwork design Heat management in artwork design
High-speed transmission line design in artwork design High-speed transmission line design in artwork design
Large-scale circuit design in artwork design. Large-scale circuit design in artwork design.
Circuit design support Circuit design support
Substrate manufacturing Substrate manufacturing
Bear chip implementation Bear chip implementation
BGA rework BGA rework
Bear

Bear chip implementation

Our company has established a consistent production system from circuit board design to bare chip mounting, and we have a wealth of experience in high-difficulty projects. Utilizing technologies such as wire bonding and flip chip mounting to ensure the overall characteristics of the module, we provide support with a focus on cost and delivery time from the planning stage. We accommodate a wide range of tasks, including bonding with Au, Al, and Cu wires, various bump formations, ACF connections, die bonding, and resin encapsulation. We are also capable of designing and implementing special optical axis alignment optical element die mounts and multi-chip packages. There is a possibility that we can solve projects that other companies have declined, thanks to our extensive know-how. If you have any concerns regarding bare chip mounting, please feel free to consult us.

Bear chip implementation

Consistent production from circuit board design to bare chip mounting! Abundant experience with high-difficulty projects.

We provide consistent support from circuit board design to ensure the characteristics of the entire module, rather than just partial implementation work, through wire bonding and flip chip mounting. We possess extensive know-how in the fields of wire bonding and flip chip using bare chips, and we may be able to resolve cases that other companies have declined. We are always mindful of cost and delivery time, and we can assist from the planning stage, so if you are a development manager facing challenges with bare chip mounting, please feel free to consult with us. 【Features】 ■ Support for small lots (from 1 piece) ■ Quick turnaround ■ Capable of mixed mounting with SMT components and leaded components *For more details, please refer to the related links or feel free to contact us.

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