LSIクーラー List of Products and Services

The Comb Fit Heat Sink has achieved high-performance heat dissipation through its unique aluminum pressure welding technology. It realizes excellent heat dissipation characteristics and robustness. 【Features】 ● YX Series → Composed of three parts: left, right, and middle fins → The width of the fins can be freely set by changing the number of middle fins (Width: up to 500mm) → For high-performance forced air cooling ● YK/YU Series → Composed of separate parts for the base and fins → Fins can be freely configured → For high-performance forced air cooling ● YC Series → For water cooling ● Comb Fit Joining Principle → The surfaces of the aluminum base and fins that make up the heat sink are covered with a hard oxide film exposed to air. → By instantly removing the hard oxide film and pressing the fresh surfaces of the fins and base together with pressure, the metals adhere to each other, improving thermal conductivity between the base and fins. → The stress generated during press-fitting and work hardening are combined to join the fins and base. → The joining strength is incomparable to simply pushing the fins into the base. *Online meetings are also possible, so please feel free to contact us.

The surfaces of the aluminum materials that make up the heat sink's base and fins are covered with a hard oxide film due to exposure to air. By instantly removing this hard oxide film and pressing the newly formed surfaces of the fins and base against each other with pressure, the metal surfaces bond together, improving the thermal conductivity between the base and fins. *Online meetings are also possible, so please feel free to contact us.*

As specialists in thermal dissipation and thermal design, we at LSI Cooler provide custom-made LED heat sinks for high light output. We can accommodate a wide range of needs from prototype production to mass production. 【Product Lineup and Features】 ◆ "Comb Fit Heat Sink YK Series" - By innovating the configuration of the fin unit, we can create high-performance natural convection heat dissipation fins in addition to forced air cooling. - The arrangement of fins on the base is flexible, and circular designs are also possible. ◆ "Heat Dissipation Fins for Driver Circuits P Series" - Heat dissipation fins with mounting terminals for TO-220 packages. - A wide variety of standard lineup is available, and dimension customization is possible. ◆ "Design Support" for fin designs tailored to applications - We propose heat dissipation fins tailored to your needs for outdoor, high ceiling, medical, and plant growth lighting, as well as for display boards, floodlights, and fish attracting lights. *Online meetings are also possible, so please feel free to contact us.

With our heat sink design support and a rich lineup, we achieve optimal heat sinks in terms of both performance and cost. ■ For high capacity (Comb Fit) 【YX Series】 - Size adjustments can be freely made according to specifications for each output capacity. - Simple structure that does not require wind tunnel sheet metal. - Both sides of devices such as power modules can be mounted. 【YK Series/YU Series】 - Single-sided base type. - Fin arrangement can be freely configured according to unit composition. ■ For water cooling (Comb Fit) 【YC Series】 - Double-sided base type. - Customization is possible by selecting from the standard lineup. ■ For low to medium capacity 【F Series/V Series】 - Selection from a rich lineup, with customization options available. ■ For pin-mounted devices 【P Series/FP Series】 - Heat sink fins for pin-mounted transistors and diode packages like TO220. - Numerous standard lineup options, with dimension customization possible. ■ For surface-mounted devices 【SQ Series】 - Pin fin type for surface-mounted devices, suitable for air cooling. - Small-scale prototypes can be produced, with dimension and processing customization available.

LSI Cooler Co., Ltd. supports thermal design from the outset to provide appropriate products. We have established a system to support thermal design by offering analysis through simulation software and actual measurement data to enable proper thermal countermeasures. We provide more reliable data more quickly, including power-temperature rise characteristics, wind speed-temperature rise characteristics, transient thermal resistance characteristics, pressure loss characteristics, and thermal distribution. We propose suitable costs while shortening development time. 【Features】 〇 Providing more reliable data more quickly → Power-temperature rise characteristics → Wind speed-temperature rise characteristics → Transient thermal resistance characteristics → Pressure loss characteristics → Thermal distribution, etc. 〇 Shortening development time and proposing appropriate costs, etc. *Online meetings are also possible, so please feel free to contact us.

Semiconductor devices (transistors, CPUs, IGBTs, etc.) used in electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or using cooling media such as water. This product uses water for forced cooling and is a water-cooled heat sink that achieves simplicity and low cost by using aluminum profiles and copper pipes. 【Features】 ■ Formed from profiles (custom options and pipe embedding specifications are also possible) ■ Low cost ■ Specification confirmation can be handled with simulation software → If you provide the loss power (W) and the model name of the FAN to be used, we can present it in a graph, which can be used as evidence when conducting prototypes. *If you wish to request a simulation, please contact us via the inquiry button. *Online meetings are also possible, so feel free to reach out to us.

We are pursuing high performance for heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. 【Features】 〇 Radiators for electronic components that prevent device destruction → Quickly transfers heat for cooling 〇 Composed of a base plate for mounting heat-generating devices and fins for dissipating heat from the base plate 〇 High-performance forced air cooling 〇 Comb-fit type 〇 YK series → Fin-joint type single-sided base 〇 YU series → Fin-joint type single-sided base (narrow pitch) 〇 YX series → Fin-stacked type hollow double-sided base *Online meetings are also possible, so please feel free to contact us.