LSIクーラー List of Products and Services

We are pursuing high performance for heat sinks and radiators. Semiconductor devices (such as transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most heat sinks consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. Cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat management with heat sinks. The P/FP/U series of heat sinks for pin-mounted devices consists of the P/FP series, which is an aluminum extrusion type, and the U series, which is a plate type. *Online meetings are also possible, so please feel free to contact us.

We are pursuing high performance for heat sinks and radiators. The semiconductor devices (such as transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat processing with heat sinks. The SQ series heat sinks for surface-mounted devices are made of extruded aluminum and feature a slit fin design. *Online meetings are also possible, so please feel free to contact us.

We are pursuing high performance in heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air convection or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat processing with heat sinks. The multi-purpose, general-purpose F/H/M series heat sinks are aluminum extruded fin-type heat sinks. *Online meetings are also possible, so please feel free to contact us.

We are pursuing high performance in heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves forcing air to circulate using a fan or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat treatment with heat sinks. The hollow-type heat sink (for medium power forced air cooling) V series is an aluminum extruded type hollow fin heat sink for forced air cooling. *Online meetings are also possible, so please feel free to contact us.

We are pursuing high performance in heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to forcibly circulate air or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat treatment with heat sinks. The S series heat sink for stud-type devices is an aluminum extruded type heat sink designed for stud-type devices. *Online meetings are also available, so please feel free to contact us.

As specialists in thermal dissipation and thermal design, we at LSI Cooler provide custom-made LED heat sinks for high light output. We can accommodate a wide range of needs from prototype production to mass production. 【Product Lineup and Features】 ◆ "Comb Fit Heat Sink YK Series" - By innovating the configuration of the fin unit, we can create high-performance natural convection heat dissipation fins in addition to forced air cooling. - The arrangement of fins on the base is flexible, and circular designs are also possible. ◆ "Heat Dissipation Fins for Driver Circuits P Series" - Heat dissipation fins with mounting terminals for TO-220 packages. - A wide variety of standard lineup is available, and dimension customization is possible. ◆ "Design Support" for fin designs tailored to applications - We propose heat dissipation fins tailored to your needs for outdoor, high ceiling, medical, and plant growth lighting, as well as for display boards, floodlights, and fish attracting lights. *Online meetings are also possible, so please feel free to contact us.

We are pursuing high performance for heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. 【Features】 〇 Radiators for electronic components that prevent device destruction → Quickly transfers heat for cooling 〇 Composed of a base plate for mounting heat-generating devices and fins for dissipating heat from the base plate 〇 High-performance forced air cooling 〇 Comb-fit type 〇 YK series → Fin-joint type single-sided base 〇 YU series → Fin-joint type single-sided base (narrow pitch) 〇 YX series → Fin-stacked type hollow double-sided base *Online meetings are also possible, so please feel free to contact us.

Semiconductor devices (transistors, CPUs, IGBTs, etc.) used in electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or using cooling media such as water. This product uses water for forced cooling and is a water-cooled heat sink that achieves simplicity and low cost by using aluminum profiles and copper pipes. 【Features】 ■ Formed from profiles (custom options and pipe embedding specifications are also possible) ■ Low cost ■ Specification confirmation can be handled with simulation software → If you provide the loss power (W) and the model name of the FAN to be used, we can present it in a graph, which can be used as evidence when conducting prototypes. *If you wish to request a simulation, please contact us via the inquiry button. *Online meetings are also possible, so feel free to reach out to us.

Heat sinks are used as practical and economical cooling methods in various industries. This method is adopted in the semiconductor industry as the most practical and economical cooling solution to prevent reliability and performance degradation, as well as destruction due to temperature rise in semiconductor devices. Additionally, the "heat sink" of LSI coolers is characterized by its resistance to vibration, which can also help reduce initial costs. 【Contents】 - V Series: Hollow type (for medium power forced air cooling) - M Series: Multipurpose, general-purpose fin-type heat sinks - H Series: Multipurpose, general-purpose fin-type heat sinks *This download is a digest version. If you would like the complete version, please contact us. *Online meetings are also possible, so feel free to reach out to us.

With our heat sink design support and a rich lineup, we achieve optimal heat sinks in terms of both performance and cost. ■ For high capacity (Comb Fit) 【YX Series】 - Size adjustments can be freely made according to specifications for each output capacity. - Simple structure that does not require wind tunnel sheet metal. - Both sides of devices such as power modules can be mounted. 【YK Series/YU Series】 - Single-sided base type. - Fin arrangement can be freely configured according to unit composition. ■ For water cooling (Comb Fit) 【YC Series】 - Double-sided base type. - Customization is possible by selecting from the standard lineup. ■ For low to medium capacity 【F Series/V Series】 - Selection from a rich lineup, with customization options available. ■ For pin-mounted devices 【P Series/FP Series】 - Heat sink fins for pin-mounted transistors and diode packages like TO220. - Numerous standard lineup options, with dimension customization possible. ■ For surface-mounted devices 【SQ Series】 - Pin fin type for surface-mounted devices, suitable for air cooling. - Small-scale prototypes can be produced, with dimension and processing customization available.

We offer a "Flexible Heat Sink" that elegantly solves the heat dissipation challenges of curved surfaces. The newly conceived variable base structure heat sink allows for flexible deformation to match the curved shapes of cooling targets, such as perfect circles, partially opened shapes, and ellipses. This innovative structure fits even the curved surfaces that were previously difficult to install on, maximizing the heat dissipation effect. 【Specifications】 ■ Material: Aluminum or aluminum alloy ■ Fin shape and size: Custom-made according to your requirements *For more details, please download the PDF or feel free to contact us.