Hayashi Pure Chemical Ind., Ltd. List of Products and Services

The features of this product are as follows: - It forms the desired taper shape (taper angle). - It etches Al and Al alloy films effectively. - The etching speed and the in-plane uniformity of the etching shape are good. Keywords: wet etching, aluminum

The features of this product are as follows: - The etching rate is stable. - There is minimal side etching, allowing for the formation of fine patterns. - The in-plane uniformity of etching speed and etching shape is excellent. Keywords: wet etching, silver, APC

The features of this product are as follows: - It forms a good positive taper. - There is minimal side etching, allowing for the formation of fine patterns. - The etching speed and in-plane uniformity of the etching shape are excellent. Keywords: wet etching, copper

The features of this product are as follows: - It has minimal side etching, allowing for the formation of fine patterns. - The etching speed and in-plane uniformity of the etching shape are excellent. - It is suitable for laminated films such as Cu/Ti and W/Ti. Keywords: wet etching, titanium

The features of this product are as follows: - It forms a good positive taper. - There is minimal side etching, allowing for the formation of fine patterns. - The etching speed and in-plane uniformity of the etching shape are good. - There are no residues after etching. Keywords: Wet etching, tungsten

The features of this product are as follows: - It has minimal side etching, allowing for the formation of fine patterns. - The etching speed and in-plane uniformity of the etching shape are excellent. - It is suitable for etching of black matrix (BM) and photo masks made of chromium. Keywords: wet etching, chromium

The features of this product are as follows: - There are no residues after etching. - It has low foaming properties and excellent defoaming capabilities. - The etching speed and the in-plane uniformity of the etching shape are good. Keywords: wet etching, indium tin oxide

The features of this product are as follows: - It allows for processing at low temperatures and in a short time. - The etching speed and in-plane uniformity of the etching shape are excellent. - It is suitable for fine bump formation and pattern formation processes. Keywords: wet etching, gold, plating, seed layer, selective etching solution.

The features of this product are as follows: - It forms a good positive taper. - It has minimal side etching, allowing for the formation of fine patterns. - The etching speed and in-plane uniformity of the etching shape are excellent. Keywords: wet etching, aluminum, molybdenum, AlCu, MAM, multilayer film

The features of this product are as follows: - It allows for processing at low temperatures and in a short time. - By adjusting the composition and processing conditions, full etching is also possible. Keywords: wet etching, silver nanowires, AgNW, SNW

The features of this product are as follows: - The angle difference of the taper angle in the cross-sectional shape can be reduced compared to conventional products. - The etched bottom surface can be etched more flatly than conventional products. - The uniformity of thickness is excellent. Keywords: wet etching, quartz

The features of this product are as follows: - It enables the formation of a smooth etching surface. - Etching can be performed regardless of the metal opening ratio on the device surface. - There is minimal degradation of the etching solution. - It is recommended to use Pure Etch ZE series (Al damage-free insulating film etching solution) as a pretreatment solution. Keywords: wet etching, silicon anisotropic etching

The features of this product are as follows: - Processing at low temperatures and in a short time is possible. - The surface after etching is mirror-like. Keywords: wet etching, silicon isotropic etching, silicon substrate thinning