セイコーフューチャークリエーション Product Lineup

In this case study collection, we will introduce examples related to "pre-treatment" in analysis and observation. We include numerous examples of pre-treatment for analysis and observation, covering objectives, methods, samples, and results, such as "Introduction to Ion Milling (CP Processing)," "Microsection Processing by Ion Milling," and "SEM Observation Pre-treatment Using Ionic Liquids." Additionally, we also present cross-sectional analysis of various materials, sample overviews, and cross-sectional observation results. We encourage you to read through it. [Contents] ■ Introduction to Ion Milling (CP Processing) ■ Microsection Processing by Ion Milling ■ SEM Observation Pre-treatment Using Ionic Liquids ■ Cooling (Cryo) Ion Milling Cross-section Processing Moreover, there is know-how involved in pre-treatment. Since there are examples not included in this collection, please feel free to contact us.

• Other processing machines
• Contract Analysis
• Processing Contract

Our company considers processing with FIB (Focused Ion Beam processing equipment) to be one of our strengths. In this case study collection, we will introduce examples related to FIB. We have included numerous items such as the following objectives, methods, and results: - Method for discovering abnormal areas within plating layers using FIB - Pattern drawing using FIB - Cross-section fabrication of micro-sized objects using FIB Additionally, we present measurement data, analysis cases, and features. We invite you to read it. [Contents] ■ Method for discovering abnormal areas within plating layers using FIB ■ Pattern drawing using FIB ■ Cross-section fabrication of micro-sized objects using FIB ■ Nano-level high-precision processing ■ Structural analysis through AFM surface measurement and FIB cross-section observation *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis
• Other semiconductors
• Processing Contract

With FIB, we can implement wiring modifications for circuit corrections of ICs and LSIs. Specifically, we assist our customers in the development of ICs and LSIs through: - Cutting of wiring - Connecting of wiring - Creation of test pads for characteristic evaluation It has been about 30 years since we started this service, and we continuously improve our technology to achieve high yield with accuracy, speed, and short delivery times, receiving high praise from our customers. Additionally, FIB not only allows for cross-sectional observation but also offers TEM sample preparation using dicing and lift-out methods, boasting a strong track record. Please make use of Seiko Future Creation's FIB technology.

• Processing Contract
• Other semiconductor manufacturing equipment
• Other semiconductors