ニホンゲンマ Product Lineup

The "winDot-F005-NP303" is a solder paste for fine jet dispensing that simultaneously achieves both fine application and meltability. It realizes one of the smallest application diameters in the world, with no clogging issues. It is suitable for components with three-dimensional structures that are difficult to print, as well as for fine components during simultaneous mounting of large and small parts, and for substrates that are challenging to print (such as warping and expansion). 【Application Products】 ■ MID components ■ Component mounting on cavity substrates ■ High-functionality modules ■ Component mounting on flexible substrates, etc. *For more details, please download the PDF or contact us.

• Other consumables

"NP303-FLV-T4" is a flux residue-free solder paste that exhibits excellent wettability even on difficult-to-wet substrates such as nickel. It supports N2 + vacuum reflow, which also suppresses void formation. Please feel free to contact us if you have any inquiries. 【Features】 ■ No cleaning required ■ Good wettability ■ Suppresses void formation *For more details, please download the PDF or contact us.

• Other consumables

"GST" is a solder with a high level of both "wetting properties" and "splash suppression effects," suitable for laser applications (JIS AA type Sn-3.0Ag-0.5Cu). Additionally, we offer the "IJIRAQ" solder with flux, specifically designed for the RZ method, which significantly reduces flux residue and drastically decreases the frequency of nozzle cleaning. Please feel free to contact us if you have any inquiries. 【Basic Characteristics】 ■ Solder Composition: Sn-3.0Ag-0.5Cu ■ Melting Point (°C): 217–219 ■ Halide Content (wt%): 0.07±0.03 *For more details, please download the PDF or contact us.

• Solder

The "NP303-CQV-1K" is a solder paste that achieves ultra-low voiding compared to conventional pastes by significantly enhancing the fluidity of the flux. It is compatible with a variety of components and atmospheric reflow. Please feel free to contact us if you have any requests. 【Basic Characteristics】 ■Solder Composition: Sn-3.0Ag-0.5Cu ■Melting Point (°C): 217–219 ■Halide Content (wt%): 0.06±0.02 ■Powder Type: Type 4 *For more details, please download the PDF or contact us.

• Other consumables

"SAB433-LHS-GQ-1" is a high-strength solder paste that suppresses crack propagation due to the addition of Bi and Sb, while maintaining melting characteristics and improving joint reliability compared to SAC305, thanks to the effects of the added elements. Please feel free to contact us if you have any inquiries. 【Basic Properties】 ■ Solder Composition: Sn-4Ag-3.3Sb-3Bi-1Cu-Ni-Ge ■ Melting Point (°C): 209–233 ■ Halide Content (wt%): ≦0.01 ■ Powder Type: Type 4 *For more details, please download the PDF or contact us.

• Other consumables

"winDot-F005-NP303" is a solder paste for fine jet dispensing that simultaneously achieves both fine application and meltability. It realizes one of the smallest application diameters in the world, with no clogging issues. It is suitable for components that cannot be printed, such as three-dimensional structures, as well as for fine components during simultaneous mounting of large and small parts, and for substrates that are difficult to print (such as those that warp or shrink). 【Application Products】 ■ MID components ■ Component mounting on cavity substrates ■ High-functionality modules ■ Component mounting on flexible substrates, etc. *For more details, please download the PDF or contact us.

• Other consumables

This is an announcement from Nihongenma Co., Ltd. regarding "wire and rod solder."

• Solder