デリクソンテクノロジージャパン List of Products and Services

We handle "wafer handling products" manufactured by Perlast. Since the material is composed entirely of organic substances, it does not cause particle contamination when in contact with wafers. Additionally, we can custom design end effector pads. This type of design ensures that the pads are securely captured by the counterpart hardware, making assembly easier. 【Features】 ■ Composed entirely of organic substances ■ Does not cause particle contamination when in contact with wafers ■ Optimizes low contact force solutions ■ Custom design of end effector pads available ■ Pads are securely captured by the counterpart hardware, making assembly easier *For more details, please refer to the PDF document or feel free to contact us.

• Sealing

We handle the "Bonded Gate" manufactured by Perlast. By using this product as a drive valve, it can prevent physical damage to the seal that occurs at the groove edge. It minimizes the stress on the seal interior and provides a profile that maximizes seal life and integrity. 【Features】 ■ Custom-made to meet requirements ■ Optimization of concave seal shape ■ Excellent design ■ Extended lifecycle ■ Reduced ownership costs *For more details, please refer to the PDF document or feel free to contact us.

• Sealing

We handle Perlast's "O-rings." All standard AS/metric sizes are available. We treat any O-ring size as a standard product. Additionally, by optimizing the diameter and cross-section of the O-rings, we provide reliable installation and high performance for each application. 【Features】 ■Manufacturing O-rings in various sizes and quantities ■All standard AS/metric sizes available ■Providing reliable installation and high performance for each application *For more details, please refer to the PDF document or feel free to contact us.

• Sealing

The "PT150/200/300" is a device that automatically transports wafers non-contact from ultra-thin wafers to standard wafers using a Bernoulli end effector, and packages and unpacks coin stacks (horizontal orientation). It can automatically refill between coin stack (horizontal orientation) shipping boxes and carriers (FOUP, cassette). It is compatible with various coin stack (horizontal orientation) packaging boxes and inserts (protective paper, films, etc.) regardless of the manufacturer. 【Features】 - Supports thin wafers - Compatible with various coin stack (horizontal orientation) packaging boxes and inserts regardless of the manufacturer - Can be specified as a coin stack loader and unloader for grinders, analyzers, and defect inspection devices *For more details, please refer to the PDF document or feel free to contact us.

• Binding/Packing Machine

The "TWH150/200/300" enables fully automated transfer and refilling between cassettes, from cassette to pod, from pod to cassette, and from pod to pod, as an independent transfer device compatible with ultra-thin wafers. It can fully automate the transport of thin wafers as an integrated module system with analytical instruments and process equipment. It is also suitable for the transport and automation of MEMS wafers and compound semiconductor wafers, which require non-contact transport, not limited to thin or silicon wafers. [Features] - Compatible with ultra-thin wafers - Enables fully automated refilling transport - Suitable for automation *For more details, please refer to the PDF document or feel free to contact us.

• Other conveying machines

We would like to introduce the "Ultra-thin Wafer Handling End Effectors" manufactured by Mechatronic System Technik in Austria, which we handle. These include the "Bernoulli Vacuum End Effector," the "Top Grip End Effector," and the "Contactless End Effector." By utilizing these three types of end effectors, we achieve safe and highly reliable handling of ultra-thin wafers. 【Types】 ■ Bernoulli Vacuum End Effector ■ Top Grip End Effector ■ Contactless End Effector *For more details, please refer to the PDF document or feel free to contact us.

• Transport and handling robots

Mechatronic Corporation designs and manufactures equipment platforms (enclosures) using automation technology and thin wafer transport technology. We provide comprehensive transport solutions for the entire equipment.

• Other semiconductor manufacturing equipment

Typically, the polymer material used for O-rings, perfluoroelastomer, employs a reinforcing material called filler to achieve rigidity and resistance. The K13X new material polymer has a molecular structure that enhances rigidity within the material itself, allowing for a filler-free structure.

• Other semiconductor manufacturing equipment