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  3. セイワ 東京本社、関西支社、名古屋営業所、中国無錫  グループ会社 エレクトロン(長野県松本市)
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セイワ 東京本社、関西支社、名古屋営業所、中国無錫  グループ会社 エレクトロン(長野県松本市)

EstablishmentOctober 1994
capital4500Ten thousand
number of employees45
addressTokyo/Taito-ku/6th Floor, Ueno Chuo Building, 7-11-6 Ueno
phone03-5828-6781
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last updated:Jun 04, 2025
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セイワ Product Lineup

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46~48 item / All 48 items

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Semiconductor (IC) Semiconductor (IC)
Discrete / Passive components (such as capacitors, diodes, etc.) Discrete / Passive components (such as capacitors, diodes, etc.)
Electronic components / Mechanical components (speakers, connectors, encoders, etc.) Electronic components / Mechanical components (speakers, connectors, encoders, etc.)
LED (cannon type, SMD, etc.) LED (cannon type, SMD, etc.)
Crystal device / SAW products Crystal device / SAW products
LCD / Organic EL (OLED) LCD / Organic EL (OLED)
Sensors (temperature and humidity, pressure, Doppler, ultrasonic, CO2, etc.) Sensors (temperature and humidity, pressure, Doppler, ultrasonic, CO2, etc.)
Module (RF, amplifier, GPS, etc.) Module (RF, amplifier, GPS, etc.)
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Thermal jumper chip for GPU heat dissipation for gaming consoles

Solving GPU heat issues! A thermal jumper chip that balances insulation and thermal conductivity.

In the gaming console industry, addressing the heat generated by high-performance GPUs is a critical issue that affects product performance and reliability. Especially during high-load gameplay, the rise in GPU temperature can lead to performance degradation or failure. Our thermal jumper chip, which combines high thermal conductivity and insulation, solves the heat problems of GPUs even in areas where installing heat sinks is difficult. 【Application Scenarios】 - GPU - Power semiconductors such as MOSFETs and IGBTs - Ceramic resistors 【Benefits of Implementation】 - Reduces temperature rise of key components - Improves system-level reliability

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Thermal jumper chip for wearable devices

Contributing to the miniaturization and reliability improvement of wearable devices.

In the field of wearable devices, miniaturization and high functionality are progressing, and as a result, thermal management has become an important issue. Heat inside the device can lead to performance degradation and failures, potentially shortening the product's lifespan. The BTJ thermal jumper chip achieves both high thermal conductivity and insulation, enabling efficient heat dissipation within limited space. This contributes to the miniaturization and reliability improvement of wearable devices. 【Usage Scenarios】 - Wearable devices that require miniaturization - Devices with high-density mounting - Electronic components that require thermal management 【Effects of Implementation】 - Suppression of device temperature rise - Improvement of product reliability - Increased design flexibility

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Solder-based heat dissipation materials for industrial robots

Solder-based thermal materials that achieve high precision.

In the industrial robot industry, high precision in operation and longevity are required. In particular, thermal management in areas prone to heat generation, such as the robot's drive components and control boards, is essential for maintaining performance. Deterioration of components due to heat can lead to operational failures and malfunctions, potentially resulting in decreased productivity. Our McDermid solder-based thermal materials solve thermal issues in industrial robots with high thermal conductivity and reliability. [Application Scenarios] - Robot arms requiring high-precision positioning - Robots performing precise electronic component mounting - Robots equipped with high-output motors [Benefits of Implementation] - Improved operational stability of robots - Extended lifespan of components - Reduced maintenance costs

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