Shinwa Co., Ltd. Product Lineup

【Top-Class Capability in the Dispensing Industry】 - Semiconductor back-end process / LED back-end process → Supports high-density mounting. Achieves micro-dispensing in extremely small spaces. → Reduces the number of equipment investments through high-speed dispensing. → Increases stability of dispensing amount with room temperature discharge! → Significantly reduces yield loss and improves production efficiency! 【Applications】 ◆ Flip-chip Underfill ◆ General LED Phosphors (SMD/Side View/Flip-chip LED, etc.) ◆ Cream Solder ◆ Ag Paste ◆ Moisture-proof materials (Conformal Coating) ◆ UV Curing Resin　　　　　　　　　　　　　　 Others

The JET Dispenser 'SPJ-22A' from Shinwa boasts top-class performance in the dispensing industry. Even with continuous operation, the application shape remains stable, enabling production that maintains high quality and high precision. It achieves industry-leading micro-dispensing with dot sizes of φ150μm and φ110μm. It is adaptable to various materials, but particularly excels with cream solder, having a wealth of proven results. Being non-contact, it is suitable for a wide range of applications. We also conduct free sample tests regularly, so please feel free to contact us. 【Application Products】 ■ Flexible substrates (difficult-to-print bases such as warping and expansion) ■ Component mounting inside connectors (three-dimensional structures) ■ 0402/0201 chip component mounting ■ Various modules / LED modules, etc. 【Main Contents of Free Sample Tests】 ■ Dispensing weight accuracy / Dispensing shape / Cycle time, etc. *For more details, please refer to the PDF materials or contact us directly.

Introducing the jet dispenser (QJC3300A) capable of handling a wide range of applications across various industries (semiconductors/LED post-processing/smartphone component assembly). It precisely applies high-viscosity materials that tend to become unstable. Additionally, it is equipped with micro-dispensing and speed capabilities, enhancing productivity. 【Features】 ◆ Dispensing capability of less than 0.001mg ◆ Achieves room temperature dispensing of high-viscosity materials using piezo technology 　→ Reduces liquid splatter onto flip chips and substrates ◆ Realizes high-speed dispensing ◆ Achieves low running costs ◆ Simple software programming 【Applications】 ◆ Flip chip underfill / BGA underfill ◆ LED phosphors in general (SMD/side view/flip chip LEDs, etc.) ◆ Cream solder ◆ Ag paste ◆ Moisture-proof materials (conformal dispensing) ◆ UV-curable resins, etc. We offer free sample testing for those considering a purchase. For more details, please request documentation or refer to the catalog.

Dot dispensing, free line dispensing, and circular dispensing compatible 【Features】 ■ Achieves dispensing of φ0.20 mm or less ■ Realizes high-speed dispensing with piezoelectric drive system ■ Achieves low running costs 【Introduction of some contents of free sample test】 ■ Dispensing weight accuracy / Dispensing shape / Cycle time, etc. *For more details, please refer to the PDF document or contact us directly.

This document provides detailed foundational knowledge and mechanisms for solving dispensing position issues, accommodating uneven substrates, and improving yield by switching from the "screen printing method" to the "solder jet dispense method." It serves as a textbook-like resource that can address various problems faced by production sites. 【Target Audience】 Printed circuit board manufacturers, various module manufacturers, implementation in three-dimensional structures, FPC manufacturers, etc. 【Contents】 ■ Advantages / Disadvantages of the screen printing method ■ List of technologies made possible by jet dispensers ■ List of applied products (target applications) *For more details, please refer to the PDF document or contact us directly.