Shinwa Co., Ltd. List of Products and Services

A new model of our ultra-precision dispenser device, the 'Quspa' series, widely adopted in various manufacturing processes in semiconductors, has been launched. In addition to improvements in speed, precision, and miniaturization, our proprietary features and basic specifications can be customized as needed, providing overwhelming flexibility. 【Features】 ■ Custom-Made We propose specifications and functions tailored to your needs, such as Clean 100 and wafer transport compatibility. Dedicated designs are also available. ■ Achieving Incredible Miniaturization Maximizing the performance of the jet dispenser to achieve cream solder at 110μm, epoxy thermosetting resin at 80μm, UV adhesive at 100μm, and more. ■ Leave Complex Teaching to Us Smartly creating teaching for random application positions. Furthermore, the accuracy of non-stop application has dramatically improved. ■ Open Network Affordable and capable of connecting to various industrial networks. Enables integration of a wide range of products.

☆☆☆ Shinwa Ultra-Precision Dispenser MsB ☆☆☆ - LED Post-Processing / Semiconductor Post-Processing → Achieves high precision and high-speed processing! (X-Y Repetition Accuracy: ±10μm) → Reduction in the number of equipment investments through high-speed dispensing (Equipped with jet pump or screw pump) → Increased stability of application amount through room temperature discharge! → Significant reduction in yield loss and substantial increase in production efficiency 【Applications】 ◆ Flip-chip Underfill / BGA Underfill ◆ General LED Phosphors (SMD/Side View/Dam & Fill, etc.) ◆ Cream Solder (MIN: φ150μm) ◆ Ag Paste (MIN: φ120μm) ◆ UV Curing Resin, etc.

Sinwa Ultra-Precision Dispenser 【MsL】 - Semiconductor back-end processes (mainly Flip-chip Underfill) → Achieves high precision/high-speed processing! (X-Y repeat accuracy: ±5μm) → Reduction in the number of equipment investments through high-speed dispensing (Equipped with jet pump or screw pump) → Improved stability of application amount due to room temperature discharge! → Significant reduction in yield loss, greatly improved production efficiency 【Applications】 ◆ Flip-chip Underfill ◆ MEMS & HDD ◆ General LED phosphors (SMD/side view/Dam & Fill, etc.) ◆ Cream solder (MIN: φ150μm) ◆ Ag paste ◆ UV curing resin, among others

☆☆☆Shinwa Precision Dispenser GP2☆☆☆ - Circuit Board Assembly Process & Post-LED Process → Achieves high precision and high-speed processing! (X-Y repeat accuracy: ±30μm) → Reduction in the number of equipment investments through high-speed dispensing (Equipped with jet pump or screw pump) → Improved stability of application amount due to room temperature discharge! → Significant reduction in yield loss and substantial increase in production efficiency 【Applications】 ◆ General LED phosphors (SMD/Side View/Dam & Fill, etc.) ◆ Cream solder ◆ Ag paste ◆ UV curing resin　　　　　　　　　　　　　　Others