Shinwa Co., Ltd. Product Lineup

We introduce a photonic debonding device that accelerates the peeling process from temporary bonding, starting with semiconductor manufacturing processes. This device converts light into heat and achieves fast and clean debonding through unique technology. Since it does not apply stress to the device, it meets various debonding needs, including delicate devices like thin wafers. 【Main Benefits】 ▶ Capable of irradiating and debonding a wide area at once, suitable for large substrates ▶ No ash generation, simplifying the cleaning process ▶ Limited heat transfer to the device, almost no stress ▶ Reusable carrier ▶ Easy maintenance If you are interested in usage images or actual application examples, please take a look at the materials.