日本サイエンティフィック List of Products and Services

The "FB200" is a testing device equipped with a manual probe function that allows for quick measurements with simple operations. By reading the data of devices measured in advance, it automatically resets the measurement conditions, enabling comparisons with reference data when measuring new sample devices. In automatic mode, it determines OK/NG based on tolerance values, while in manual mode, it points out areas with significant deviations. 【Features】 ■ Equipped with manual probe function ■ Open/short test function for input/output pins ■ Pin assignment possible using external power supply ■ Compact design ■ Results can be saved as numbers and graphs *For more details, please refer to the catalog or feel free to contact us.

• Machine elements

The "Contract IC Opening Service ED Lab" is a service provided by Japan Scientific Corporation that opens epoxy-based plastic molded IC packages using fuming nitric acid, fuming sulfuric acid, and concentrated sulfuric acid. We open the lead section, chip front, and partial openings according to your requests for size and location. Additionally, we perform open short checks for sea defects and measure diode characteristics. 【Features】 ■ Reliable and rapid IC opening ■ Uses fuming nitric acid, fuming sulfuric acid, and concentrated sulfuric acid ■ Opens according to requested size and location *For more details, please refer to the catalog or feel free to contact us.

• Other contract services

The "PL101" is a laser IC decapsulation device that allows for the decapsulation of Cu wire ICs with minimal damage through laser and chemical opening. With the IR sensor, laser decapsulation can be performed with high reproducibility, and the Z-axis position is automatically adjusted to maintain the same focal distance throughout the process, in line with the progress of the laser decapsulation. Additionally, based on the extensive decapsulation know-how cultivated through sample processing and IC contract decapsulation services (ED lab), we provide the most suitable decapsulation conditions for the purpose of sample decapsulation. The processing time and chemical usage are significantly reduced by using laser decapsulation as a pretreatment. 【Features】 ■ Compact ■ Safe design ■ Easy operation ■ Time-saving ■ High reproducibility *For more details, please refer to the catalog or feel free to contact us.

• Machine elements
• Other contract services

The IC package will be opened using fuming nitric acid, fuming sulfuric acid, and concentrated sulfuric acid. The opening will be done in the size and location as per your request. 【Lead Part Opening】: This is suitable for confirming the condition of the bonding wires. (The maximum area that can be opened is 20 mm square.) 【Full Chip Opening】: Care will be taken to ensure operational status. This is suitable for conducting power-on tests and FIB processing after opening. 【Partial Opening】: This is suitable for conducting power-on tests while minimizing damage to the inherent electrical characteristics of the IC. Opening samples will only be accepted for epoxy-based plastic molded ICs that can be opened with fuming nitric acid, fuming sulfuric acid, and concentrated sulfuric acid. To ensure reliable opening, please prepare the necessary number of samples for condition testing of the same type. 【Delivery Time】 Normal delivery: Shipped within 3 days from the day after the arrival of the requested items. Express delivery: Shipped within 24 hours from the day after the arrival of the requested items. (Note: Weekends and holidays are not included.) If the number of samples exceeds 20, we will discuss delivery times and other details in advance.

• Other semiconductors
• Surface treatment contract service

Plastic Mold IC Opener

• Other inspection equipment and devices

Laser IC decapsulation device that can remove the plastic part of plastic-molded ICs down to less than 100 microns from the surface of the IC chip, without damaging the chip. 【Features】 ○ As a pre-treatment for decapsulation using chemical solutions, it minimizes the impact of the chemical solution on ICs with Cu wiring, etc. ○ Decapsulation can be performed simply by dropping the chemical solution onto the surface of the chip; it is also possible to use a decapsulation device, and the amount of chemical solution used is extremely minimal. ○ Effective in reducing decapsulation time as a pre-treatment for dry decapsulation. ○ Removal processing in a short time; the processing time for an area of 10mm x 10mm is about 2 minutes. ○ The processing range can be set from a computer screen, and it is easy to operate by simply turning on the switch. ○ Compact design that can be installed on a desk. ● For other functions and details, please download the catalog.

• Other semiconductor manufacturing equipment

This is a curve tracer that allows for easy operation and data usage by connecting to a computer. ◆ Comparing good samples with sample data is also easy through computer connection. ◆ Equipped with open/short test function for input/output pins. ◆ Voltage is applied slowly, allowing visual confirmation of current changes. ◆ Results are displayed in numerical and graphical form, and saving is easy. ◆ Setting conditions can be saved in a text file and used at any time. ◆ Manual probe included. ◆ Automatic measurement is possible up to 64 pins (standard) and 128 pins (optional) when using a DUT board.

• Other semiconductor manufacturing equipment
• Image Processing Equipment
• Voltage Meter