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  1. Home
  2. Electronic Components and Semiconductors
  3. Ito Corporation
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Electronic Components and Semiconductors
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Ito Corporation

EstablishmentOctober 1946
capital5000Ten thousand
number of employees27
addressTokyo/Chuo-ku/1-6-3 Nihonbashi Bakurocho
phone03-3668-3222
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last updated:Feb 29, 2024
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Glove Glove
class="retina-image"

Desktop ACF Alignment Bonding Machine (Front and Rear Stage Type 2)

This is a desktop alignment press developed by Ito with a Y-axis driven front and rear stage. It is equipped with two cameras (or four cameras).

■Device Overview■ The TTAB-2525A series developed by Ito is a desktop alignment press machine with a Y-axis driven front and rear stage. It uses a manual alignment method with either a 2-camera or 4-camera view to mount and crimp the device onto the substrate. The heating method is a ceramic-based "Active Heat" specification. ■Production Capacity 200 UPH (assuming 10 seconds for alignment + 6 seconds for crimping) ■Safety Specifications CE certified

  • Welding Machine

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Desktop ACF Alignment Bonding Machine (Rotary Stage Type)

This is a desktop top alignment press with a rotary stage designed for tact-up, equipped with two cameras (or four cameras).

■Device Overview■ The TTAB-1008CR/2525AR developed by Ito is a desktop alignment press with a rotary stage designed for takt time improvement. It uses a manual alignment process with either a 2-camera or 4-camera field of view to mount and press-fit devices onto the substrate. You can choose between a constant heat specification or an "Active Heat" specification for the heating method. By setting a special module, it is also possible to press-fit onto three-dimensional substrates like camera modules. ■Production Capacity 400 UPH (assuming 10 seconds for alignment + 6 seconds for pressing) ■Safety Specifications CE certification obtained

  • Welding Machine

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Desktop ACF Attachment Machine

High performance at a low price! The desktop ACF laminator developed by Ito is targeted for prototype/small batch production! ACF length can be adjusted!

■Device Overview■ The desktop ACF laminating machine TTL-6010 developed by Ito is designed to attach ACF to substrates for prototype and small-scale production. It primarily attaches ACF at one location per substrate, and the length of the ACF can be changed via programming! ■Production Capacity 600 UPH (assuming an attachment time of 1 second) ■Safety Specifications CE certification obtained

  • Welding Machine

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Glove for glove box

Gloves for glove boxes that are resistant to radiation.

These are various types of gloves for glove boxes, including butyl, CSM, and EPDM.

  • others
  • Other energy equipment

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Atmospheric Pressure Argon Plasma ARP Series

This is a head unit for atmospheric pressure plasma using argon gas.

This is a plasma unit that uses only 3L/min of argon gas for every 100mm of head length, making it highly cost-effective. It operates at low power and generates stable glow plasma. The generation of ozone and nitrogen oxides is also very low, so exhaust equipment is not required. Its very lightweight and simple structure allows for easy installation in your production equipment. It is available in widths ranging from 60mm to 2500mm. By connecting to the I/O port of the control box, automatic operation with the main equipment is also possible.

  • Organic EL
  • Touch Panel
  • Other FPD related

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Tabletop Argon Atmospheric Pressure Plasma Device

A simple structure argon plasma device! For the modification of small-sized samples.

The "MyPL Series" is an atmospheric pressure direct plasma device that uses argon gas. It is a simple tabletop model with a front-and-back sliding stage, making it suitable for research and development purposes, such as the modification of small-sized samples. Even for warped films, it can be fixed using an air suction stage, allowing for the treatment of the sample surface. 【Features】 ■ Equipped with a moving stage ■ Suitable for the modification of small-sized samples ■ Modification time can be set ■ Compatible with warped films *For more details, please refer to the PDF document or feel free to contact us.

  • Organic EL
  • Touch Panel
  • Other FPD related

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Long-distance irradiation N2 plasma unit [capable of irradiation on uneven workpieces]

It is possible to irradiate surfaces with curves and unevenness! Plasma can be irradiated from heights that were not achievable with conventional atmospheric pressure plasma!

This is a bar-type atmospheric pressure plasma unit using N2. It can maintain a distance of up to approximately 8mm for irradiation, allowing plasma treatment of curved or uneven workpieces. Additionally, due to its low temperature, there is no thermal damage to the workpieces. 【Features】 ■ Capable of irradiation on curved and uneven workpieces ■ Can maintain a distance of up to approximately 8mm for irradiation ■ No thermal damage to workpieces due to low temperature *For more details, please request documentation or view the PDF data available for download.

  • Other electronic parts
  • Other FPD related
  • Fine Ceramics

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Heat press machine

TCP crimping machine

User-friendly standalone type

  • Other painting machines

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Hot press machine

Flip Chip Bonder for IC Cards

Supports everything from user-friendly standalone types to inline systems.

  • Other painting machines

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ACF bonding machine

ACF bonding machine

We accommodate everything from tabletop manual devices to fully automatic machines.

  • Other painting machines

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