microscope - Company Ranking(44 companies in total)
Last Updated: Aggregation Period:Mar 25, 2026〜Apr 21, 2026
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Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| By using sound waves, it is possible to observe the internal structure beneath the surface of the sample non-destructively, without being in... | - Defect investigation of semiconductor package products - Defect investigation of internal electronic components - Investigation of voids a... | ||
| By repeatedly performing cross-sectional processing with FIB and observing with SEM, continuous SEM observation results can be obtained. By ... | - Three-dimensional shape evaluation of semiconductor devices - Investigation of voids and disconnections in metal wiring after reliability ... | ||
| For detailed data, please refer to the catalog. | Analysis of LSI and memory. | ||
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- Featured Products
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[C-SAM] Ultrasonic Microscopy Method
- overview
- By using sound waves, it is possible to observe the internal structure beneath the surface of the sample non-destructively, without being in...
- Application/Performance example
- - Defect investigation of semiconductor package products - Defect investigation of internal electronic components - Investigation of voids a...
[Slice&View] Three-Dimensional SEM Observation Method
- overview
- By repeatedly performing cross-sectional processing with FIB and observing with SEM, continuous SEM observation results can be obtained. By ...
- Application/Performance example
- - Three-dimensional shape evaluation of semiconductor devices - Investigation of voids and disconnections in metal wiring after reliability ...
[Analysis Case] Comparison of Secondary Electron Images of Cu Surface Using SEM and SIM
- overview
- For detailed data, please refer to the catalog.
- Application/Performance example
- Analysis of LSI and memory.
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一般財団法人材料科学技術振興財団 MST