Heat-resistant adhesive - Company Ranking(4 companyies in total)
Last Updated： Aggregation Period:Jul 16, 2025〜Aug 12, 2025
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Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| - Crystal Bond 509: Thermoplastic temporary adhesive. Flow point is 74°C. - Crystal Bond 555: Low melting point thermoplastic temporary adhesive. Flow point is 48°C. - Crystal Bond 590: Thermoplastic temporary adhesive. Flow point is 150°C. | - Metal piece processing inspected with an electron microscope - Dicing processing of semiconductors - Dicing processing of ceramics and quartz materials - Dicing of optical components and semiconductors - Rough polishing and finishing processing of optical components - Dicing processing of optical glass fibers and single crystal materials - Temporary adhesion to backup blocks during grinding and polishing work. | ||
| ■Main Features - Maximum heat resistance is 1760°C - Ideal for assembly, insulation of high-temperature sensors, instrumentation, and use in thermal resistance elements - A one-component, water-soluble adhesive based on aluminum oxide that also functions as a coating agent - Excellent mechanical and electrical properties ■Physical Properties - Strength: 24.0 ft-lbs - Insulation: 182 volts per mil (at room temperature) - Coefficient of thermal expansion: 7.7×10^-6 in/in/°C - Suitable for use on substrates including ceramics, steel, and non-ceramics such as stainless steel - Can be easily applied using a brush or dispenser - Can be cleanly removed with warm water and soap before curing ■For more details, please contact us. | ■Main Uses - Assembly and bonding of high-temperature thermocouple cases used in heating furnaces and boilers - Suitable for assembly, insulation of high-temperature sensors, instrumentation, and use in thermal resistance elements - Suitable for use on substrates including ceramics, steel, stainless steel, and non-ceramics | ||
| Heat-resistant adhesive / Heat-resistant epoxy adhesive (organic) ■ For high temperature range from -65℃ to 300℃ - Alembond 526N - Alembond 570 ■ For general applications at high temperatures - Alembond 631 - Alembond 657 - Alembond 820 - Alembond 2150 ■ For management and repair at high temperatures - Alembond 2200 - Alembond 2210 - Alembond 2220 ■ For strong adhesives - Alembond 2300 - Alembond 2310 | ● Adhesion of ceramic electronic components (through-nozzle) ● Adhesion of aluminum or copper parts and heat sinks for electrical, electronic, and heat exchangers ● Adhesion of copper nozzles to ceramic insulation materials in oxygen/acetylene welding torches ● Adhesion of sight glasses for high vacuum devices ● Repair of corroded aluminum molds and worn metal surfaces | ||
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オーデック
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- Featured Products
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Heat-resistant adhesive | Temporary adhesive "Crystal Bond" series
- overview
- - Crystal Bond 509: Thermoplastic temporary adhesive. Flow point is 74°C. - Crystal Bond 555: Low melting point thermoplastic temporary adhesive. Flow point is 48°C. - Crystal Bond 590: Thermoplastic temporary adhesive. Flow point is 150°C.
- Application/Performance example
- - Metal piece processing inspected with an electron microscope - Dicing processing of semiconductors - Dicing processing of ceramics and quartz materials - Dicing of optical components and semiconductors - Rough polishing and finishing processing of optical components - Dicing processing of optical glass fibers and single crystal materials - Temporary adhesion to backup blocks during grinding and polishing work.
Heat-resistant adhesive | Ceramic adhesive (inorganic) Ceramabond 671
- overview
- ■Main Features - Maximum heat resistance is 1760°C - Ideal for assembly, insulation of high-temperature sensors, instrumentation, and use in thermal resistance elements - A one-component, water-soluble adhesive based on aluminum oxide that also functions as a coating agent - Excellent mechanical and electrical properties ■Physical Properties - Strength: 24.0 ft-lbs - Insulation: 182 volts per mil (at room temperature) - Coefficient of thermal expansion: 7.7×10^-6 in/in/°C - Suitable for use on substrates including ceramics, steel, and non-ceramics such as stainless steel - Can be easily applied using a brush or dispenser - Can be cleanly removed with warm water and soap before curing ■For more details, please contact us.
- Application/Performance example
- ■Main Uses - Assembly and bonding of high-temperature thermocouple cases used in heating furnaces and boilers - Suitable for assembly, insulation of high-temperature sensors, instrumentation, and use in thermal resistance elements - Suitable for use on substrates including ceramics, steel, stainless steel, and non-ceramics
Heat-resistant adhesive | Epoxy adhesive (organic) "Alemco Bond" series
- overview
- Heat-resistant adhesive / Heat-resistant epoxy adhesive (organic) ■ For high temperature range from -65℃ to 300℃ - Alembond 526N - Alembond 570 ■ For general applications at high temperatures - Alembond 631 - Alembond 657 - Alembond 820 - Alembond 2150 ■ For management and repair at high temperatures - Alembond 2200 - Alembond 2210 - Alembond 2220 ■ For strong adhesives - Alembond 2300 - Alembond 2310
- Application/Performance example
- ● Adhesion of ceramic electronic components (through-nozzle) ● Adhesion of aluminum or copper parts and heat sinks for electrical, electronic, and heat exchangers ● Adhesion of copper nozzles to ceramic insulation materials in oxygen/acetylene welding torches ● Adhesion of sight glasses for high vacuum devices ● Repair of corroded aluminum molds and worn metal surfaces
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