We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Plating process.
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Plating process - Company Ranking(5 companies in total)

Last Updated： Aggregation Period:Oct 01, 2025〜Oct 28, 2025
This ranking is based on the number of page views on our site.

Company Name Featured Products
Product Image, Product Name, Price Range overview Application/Performance example
奥野製薬工業 奥野製薬工業 大阪・放出、東京、名古屋など
Electroless copper plating process for glass substrates for TGV surface treatment
Electroless copper plating process for glass substrates for TGV surface treatment

Other

 Our company, in collaboration with Panasonic Environmental Engineering Co., Ltd., has developed an electroless copper plating process called... Interposer material (glass substrate)
Aluminum electrode on wafer UBM formation plating process
Aluminum electrode on wafer UBM formation plating process

Other

 We are developing various plating and surface treatment chemicals and high-performance products for automobiles, electric vehicles, home app... Semiconductor wafer
High connection reliability electroless copper plating process for semiconductor package substrates
High connection reliability electroless copper plating process for semiconductor package substrates

Other

 With the high performance, miniaturization, and lightweight nature of electronic devices, semiconductor package substrates are becoming incr... Semiconductor package plating Semiconductor package substrate plating Semiconductor package substrate manufacturing Semiconductor pack...
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  1. 奥野製薬工業 奥野製薬工業 大阪・放出、東京、名古屋など
    Featured Products
    Electroless copper plating process for glass substrates for TGV surface treatmentElectroless copper plating process for glass substrates for TGV surface treatment
    overview
    Our company, in collaboration with Panasonic Environmental Engineering Co., Ltd., has developed an electroless copper plating process called...
    Application/Performance example
    Interposer material (glass substrate)
    Aluminum electrode on wafer UBM formation plating processAluminum electrode on wafer UBM formation plating process
    overview
    We are developing various plating and surface treatment chemicals and high-performance products for automobiles, electric vehicles, home app...
    Application/Performance example
    Semiconductor wafer
    High connection reliability electroless copper plating process for semiconductor package substratesHigh connection reliability electroless copper plating process for semiconductor package substrates
    overview
    With the high performance, miniaturization, and lightweight nature of electronic devices, semiconductor package substrates are becoming incr...
    Application/Performance example
    Semiconductor package plating Semiconductor package substrate plating Semiconductor package substrate manufacturing Semiconductor pack...
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