High connection reliability electroless copper plating process for semiconductor package substrates
Ensuring crystal continuity at the interface between the inner copper layer and the upper plating layer, achieving advanced reliable connectivity required by cutting-edge packages.
OPC FLET Copper is an electroless copper plating solution of the noncyanide Rochelle salt type, adapted for semi-additive processes. It excels in low film thickness and uniform deposition on material surfaces and within via holes, reducing circuit width narrowing during flash etching. Additionally, it suppresses deposition on copper surfaces, achieving continuity of crystals between inner layer copper and upper layer plated copper, making it an ideal plating solution for fine pattern and micro via hole formation in IC substrates. 【Features】 - Excellent connection reliability between upper layer plated copper and inner layer copper - Achieves low film thickness with uniform and stable deposition on material surfaces and via hole walls - Suppresses blister formation on low roughness materials, providing excellent peel strength - The film demonstrates high purity and low resistance values, not hindering subsequent pattern plating even at low film thickness
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basic information
With the high performance, miniaturization, and lightweight nature of electronic devices, semiconductor package substrates are becoming increasingly dense. As a result, printed circuit boards used in semiconductor packages are advancing in circuit miniaturization, reducing via hole diameters, and thinning inner layer copper. In via holes, there are three types of copper: inner layer copper, electroless copper plating, and electrolytic copper plating, viewed from the bottom. In conventional methods, as miniaturization progresses, delamination occurs at the interface between the inner layer copper and the electroless copper plating, leading to a decrease in connection reliability. The "OPC FLET process" can form a copper seed layer with excellent coverage and electrical conductivity at a low film thickness. Furthermore, it demonstrates excellent adhesion to low roughness materials. Additionally, by reducing the thickness of the electroless copper plating film, it significantly improves the circuit thinning that occurs during the etching of electroless copper plating, enabling the formation of ultra-fine wiring with L/S=5/5μm or less. Moreover, we are also focusing on the development of technologies that respond to new materials such as plating chemicals and processes for semiconductor package substrates and semiconductor packaging substrates, as well as low roughness insulating materials. If you have any concerns regarding surface treatment of printed circuit boards and electronic components, please feel free to consult us.
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Semiconductor package plating Semiconductor package substrate plating Semiconductor package substrate manufacturing Semiconductor package substrate plating process Semiconductor packaging substrate manufacturing IC substrate manufacturing IC substrate plating process
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Company information
Our company is a research and development-oriented enterprise that supports global manufacturing through science in the fields of surface treatment, inorganic materials, and food. 【Surface Treatment Division】 - We launched a new brand of surface treatment chemicals for semiconductor back-end processes called "TORYZA," offering various plating chemicals and equipment such as copper plating additives for ultra-fine wiring and electroless plating processes for UBM formation. - We propose surface treatment chemicals for plastic plating that provide high added value, such as beautiful metallic appearance, luxury feel, and antibacterial and antiviral properties. - We offer process chemicals for anodizing and dyeing aluminum alloys that beautifully enhance the appearance of casings for smartphones and other devices. We also have environmentally friendly processes and surface treatment chemicals for antibacterial and antiviral applications in our lineup. - We provide electroless nickel plating chemicals and various environmentally friendly products, including low-temperature and long-life types, that impart new functions to materials, such as corrosion resistance, wear resistance, and lubricity. 【Inorganic Materials Division】 Total production from design, processing, to mass production of glass. Contributing to the enhancement of design and functionality with high-quality glass materials. 【Food Division】 Bringing "deliciousness" and "safety" to the dining table. Challenging the development of high-function products composed of food ingredients.