Ultrasonic Cutting Machine - Company Ranking(5 companies in total)
Last Updated： Aggregation Period:Sep 17, 2025〜Oct 14, 2025
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Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| ■Basic Specifications - Maximum workpiece size that can be cut: φ100mm (75mm square) - Maximum workpiece height that can be cut: 9mm -... | Smartphone, camera module, ultra-small chips (0402, 0201, etc.), mounting boards, MEMS, PCB, LSI packages, TSV (Through-Silicon Via, silicon... | ||
| ■Basic Specifications ・Compatible Work Sizes: 6 inches, 8 inches ・Conveying Mechanism: In-house manufactured conveying mechanism ・Devi... | Composite materials such as glass and resin from difficult-to-cut materials like SiC wafers and LTCC. | ||
| ■Basic Specifications ・Maximum Work Size: Φ200mm ・Maximum Frame: 6.8-inch Ring ・X-axis Cutting Range: 220mm, Maximum Cutting Speed: 50... | Various materials such as SiC wafers, alumina substrates, AIN substrates, PZT substrates, glass substrates, sapphire substrates, quartz, and... | ||
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JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
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- Featured Products
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Ultrasonic cutting device for cross-sectional observation 'CSX-100Lab'
- overview
- ■Basic Specifications - Maximum workpiece size that can be cut: φ100mm (75mm square) - Maximum workpiece height that can be cut: 9mm -...
- Application/Performance example
- Smartphone, camera module, ultra-small chips (0402, 0201, etc.), mounting boards, MEMS, PCB, LSI packages, TSV (Through-Silicon Via, silicon...
Takeda Industrial's ultrasonic cutting device 'CSX-400 Series'
- overview
- ■Basic Specifications ・Compatible Work Sizes: 6 inches, 8 inches ・Conveying Mechanism: In-house manufactured conveying mechanism ・Devi...
- Application/Performance example
- Composite materials such as glass and resin from difficult-to-cut materials like SiC wafers and LTCC.
Takeda Industrial's ultrasonic cutting device 'CSX501'
- overview
- ■Basic Specifications ・Maximum Work Size: Φ200mm ・Maximum Frame: 6.8-inch Ring ・X-axis Cutting Range: 220mm, Maximum Cutting Speed: 50...
- Application/Performance example
- Various materials such as SiC wafers, alumina substrates, AIN substrates, PZT substrates, glass substrates, sapphire substrates, quartz, and...
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JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
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