Takeda Industrial's ultrasonic cutting device 'CSX501'

Equipped with fully automatic and enhanced device functions, as well as remote monitoring capabilities! Contributing to increased productivity in the dicing process!

The "CSX501" is an ultrasonic cutting device equipped with a dual-end support mechanism that enables high-speed cutting, enhancing productivity and adding new functionalities. With the addition of equipment monitoring capabilities, it is now possible to recover from unexpected troubles with minimal equipment downtime through remote support. ■Features - Achieves high-speed, high-quality cutting of a wide range of materials, from difficult-to-cut materials like SiC, alumina, and PZT to composites such as glass and resin! - By adding ultrasound to blade cutting, it significantly reduces blade wear! - The development of a unique spindle and special ultrasonic blade that maximizes ultrasonic effects enables mass production-level cutting of SiC wafers at an 80µm street! *Demo units are available for sample evaluation. *We can also propose the semi-auto type "CSX-400." *For more details, please refer to the PDF document or feel free to contact us.

Wafer processing/polishing equipmentOther semiconductor manufacturing equipment