Ultrasonic cutting device for cross-sectional observation 'CSX-100Lab'
High-Tech Industrial Manufacturing Co., Ltd. Ultrasonic Cutting Device for Cross-Section Observation 'CSX-100Lab'
By performing "cutting" and "polishing" in one process, we achieve a significant reduction in cross-section cutting work time and high-quality cuts! It can be easily operated by anyone without any skills!
The Takeda Industrial's 'CSX-100Lab' is an automatic cutting device specifically designed for the preparation of cross-sectional observation samples. It significantly reduces the time required to prepare cross-sectional observation samples for both development and mass production, achieving improved operational efficiency and high-quality sample cross-sections! ■ Features - The cutting surface has a beautiful mirror finish due to ultrasonic effects. - Capable of cutting composite materials with varying hardness, including solder and ceramics. - The blade extension can be up to 10mm, accommodating thick samples. - Even beginners can obtain cross-sectional samples for observation without any skill. - After setting the cutting conditions, it operates automatically, allowing for effective use of time. - When combined with the skeleton cut (optional), it can target and cut inside molded electronic components. - There are many successful implementations as a preprocessing device (reducing milling time) such as ion milling. * A demo unit is available, so sample evaluation is possible. * For more details, please refer to the PDF document or feel free to contact us.
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basic information
■Basic Specifications - Maximum workpiece size that can be cut: φ100mm (75mm square) - Maximum workpiece height that can be cut: 9mm - Device dimensions (WxDxH): 650x905x1,350mm - Device weight: 380kg *For more details, please refer to the PDF document or feel free to contact us.*
Price range
Delivery Time
※Negotiable
Applications/Examples of results
Smartphone, camera module, ultra-small chips (0402, 0201, etc.), mounting boards, MEMS, PCB, LSI packages, TSV (Through-Silicon Via, silicon through electrode), etc.
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Company information
In this department, we provide total solutions for assembly by offering a diverse range of products and high technical capabilities to meet the challenges of our customers, who are globally expanding primarily in China, Thailand, Malaysia, and Vietnam. We focus on excellent assembly equipment from Panasonic Connect (formerly Panasonic Smart Factory Solutions) to support high performance, miniaturization, and lightweight electronics products, as well as peripheral equipment, technical support, and maintenance. Please take a look at our introduction video. https://www.youtube.com/watch?v=efdEd2BVT-A