Enhancing edge AI solutions for robotics and video analysis with NVIDIA Jetson AGX Orin, Orin NX, and Orin Nano.

Equipped with NVIDIA Jetson AGX Orin | Ultra-compact design | Achieves robust I/O and connectivity

The ultra-compact edge AI system "AIR-030," equipped with Advantech's NVIDIA Jetson AGX Orin, features a small design of just 200 x 220 x 74mm and achieves low-power computing with powerful AI inference capabilities utilizing the NVIDIA Jetson AGX Orin. The "AIR-030" is ideal for edge AI applications such as traffic monitoring, defect inspection, AGV/AMR, people counting, and medical imaging. 【Key Features of This Product】 ■ Compact and high-performance AI box PC ■ Equipped with NVIDIA Jetson AGX Orin ■ Wide range of power input & broad operating temperature range ■ Multiple I/O ports: LAN, DIO, COM, USB 3.2, USB Type-C ■ Diverse expandability with M.2 B key, M.2 E key, SD, PCIe x16 (optional) ■ Supports Linux Ubuntu 20.04 LTS and JetPack 5.0.1 ■ WISE-DeviceOn support for rapid deployment of large-scale AI

• Industrial PCs
• Embedded Board Computers

Equipped with NVIDIA Jetson Orin NX | Barebone type that makes embedded development easy from the Jetson development kit.

AI technology is being rapidly adopted across various industries such as robotics, healthcare, manufacturing, logistics, and retail. Advantech has developed an industrial-grade barebone PC with a super compact footprint (152x137x42mm) that can accommodate Jetson modules (including NVIDIA Jetson Orin NX) and offers various options for I/O interface boards, tailored to user needs. This "EPC-R7200" is expected to facilitate rapid prototyping and scaling up to mass production. 【Key Features of This Product】 ■ Compatible with NVIDIA Jetson modules ■ Supports NVIDIA Jetson Orin NX and Orin Nano ■ Additional customization of I/O with UIO40-Express I/O expansion cards ■ Robust barebone PC housing provides a wide operating temperature range (-20 to 60ºC) and power input of DC 9 to 24V ■ AIM-Linux software service integrated with peripheral drivers for NVIDIA JetPack SDK

• Industrial PCs

Advantech's latest embedded product guide leading the new wave of embedded IoT. We hope it will assist you in your solution development.

Table of Contents ◆ About Embedded IoT ◆ Embedded Design-In Services ◆ Embedded Boards - Computer-on-Module / Embedded Single Board Computers / Industrial Motherboards / RISC ARM Computing Platforms ◆ Embedded Systems - Embedded PCs / High-Reliability Fanless Embedded Computers / In-Vehicle, Railway, Roadside Systems / Smart Digital Signage Solutions ◆ Embedded IoT Solutions - Wireless Electronic Paper Solutions / Edge Intelligence Solutions / Edge AI Solutions ◆ Industrial Peripherals - Industrial Display Systems / Embedded IoT Wireless Modules / Industrial Flash & Memory Solutions ◆ Embedded & IoT Software - Wise-Paas/DeviceOn / Microsoft IoT Solutions / Security Software Applications / Embedded BIOS, OS, API ◆ Embedded Design & Manufacturing Services

• Industrial PCs

Packed with the latest embedded IoT information! A product guide for embedded systems that includes company overview, roadmap, and a wealth of case studies.

Table of Contents ◆ About Advantech An overview of Advantech Co., Ltd. and its service structure. ◆ Notable Embedded Technologies We are advancing research and development, productization, and proposals for embedded technologies that can contribute to solving societal and customer challenges. ◆ Latest Product Roadmap We are committed to promoting pioneering development and productization in the industry, contributing to our customers' product innovation, value enhancement, and Time To Market. ◆ Recommended Products We introduce products recommended by Advantech for 2022. Our lineup includes products that meet the needs of the times, such as the "EI-52," which is equipped with the notable 11th generation (Tiger Lake) CPU and supports 5G/Wi-Fi/AI. ◆ Case Studies from Japan and Around the World We can propose solutions in a wide range of areas, including the medical field, such as ultrasound diagnostic devices that require server-grade specifications, factory automation like AGV/AMR, and testing solutions to prevent the spread of the novel coronavirus.

• Industrial PCs
• Embedded Board Computers

A collection of case studies showcasing the use of Advantech's edge intelligence solutions. It is filled with numerous examples not only from Japan but also from various countries around the world.

【Catalog Table of Contents】 ■Smart Factory A total of 11 cases, including a worker behavior monitoring system (Indonesia) and an AI-based tablet defect inspection device (Japan). ■Transportation A total of 8 cases, including a bicycle rental system with an LTE module (Taiwan) and an airport flight information display system (China). ■Smart City A total of 5 cases, including efficient remote control and monitoring of sluices (Japan) and an AI facial recognition system for preventing COVID-19 infections in schools (Taiwan). ■Indoor Facilities such as Buildings A total of 3 cases, including a kiosk terminal capable of measuring body temperature (South Korea). ■Energy & Mining A total of 3 cases, including remote monitoring examples in mining sites (China). ■Kiosks & Retail A total of 3 cases, including digital signage in drugstores (United Kingdom).

• Industrial PCs
• Embedded Board Computers

Features: ● Equipped with ARM MediaTek Genio 700 / 510 ● Onboard LPDDR4 8GB ● HDMI 2.0 x 1, DP 1.4 x 1 ● eDP 2 lanes x 1, MIPI-DSI 4 lanes x 1 ● GbE x 1 ● USB 3.0 + 2.0 x 1, USB 2.0 x 5 ● UART x 4, GPIO x 12, MIPI CSI x 2, TPM 2.0 ● Fan-equipped heatsink, heatsink available separately ● Carrier board available separately

Features: ● Equipped with Intel Core Ultra 5 125H/7 155H ● LPDDR5 16GB onboard memory ● NVMe 128GB onboard storage ● eDP x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen2 x 2 ● PCIe 4.0[x1] x 4 ● 2.5GbE x 1 ● COMe Type10 standard, size 84mm x 55mm ● Optional items ECB-920A-0001: Development carrier board NANOCOM-MTU-FAN: CPU fan NANOCOM-MTU-HSP: Heat spreader (Note: Heat dissipation is required in the enclosure)

Features: ● Equipped with Intel Core Ultra 9 185H / 7 155H / 5 125H processors ● DDR5 5600MHz Dual Channel SODIMM x2 (up to 96GB) (sold separately) ● VGA switch DDI x1, LVDS colay eDP x1, DDI x2 ● USB 2.0 x8, USB 3.2 Gen 2 x4 ● PCIe [x1] x4, PCIe [x4] x1, PEG [x8] + [x4] + [x4] ● 2.5GbE x1 ● DC 9~16V input ● COM Express Type 6, 3.75 inches x 3.75 inches (95mm x 95mm)

By digitizing contract operations, you can reduce many costs, including stamp duty and mailing fees. ◆ Four Benefits of Electronic Contracts - Cost reduction for printing, stamp duty, mailing fees, and original document storage - Improved business efficiency through system-based sending and stamping - Prevention of tampering with timestamps - Enhanced document searchability 【Many Benefits for the Other Party as Well!】 - Both parties can confirm that the document has not been tampered with - No worry about losing the original paper documents - Increased operational efficiency due to the absence of mailing and binding hassles - Quick contract conclusion through email or system verification ◆ Disadvantages of Electronic Contracts - Costs for implementing and operating the service - Need to ensure that business partners understand electronic transactions ----------------------------------------------------- 　　Consult with paperlogic for electronic contract services! -----------------------------------------------------

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.