Solid-phase diffusion bonding refers to [WELCON Corporation].

We are offering a free document that explains the features and methods of "diffusion bonding," a technology for joining metals without melting them! A must-see for manufacturing beginners!

Since our establishment, we have been working to adapt diffusion bonding technology for mass production, and we are pleased to present a detailed explanation of "diffusion bonding" from our company! The diffusion bonding we conduct is a solid-state bonding technique that joins metals without melting them, which broadens the range of feasible products and functions. For example: - High-pressure, compact, and high-performance heat exchangers (such as those for hydrogen stations) - Water-cooled heat sinks capable of uniform cooling - Vapor chambers (sheet-type heat pipes) that can diffuse localized heat input in a planar direction - Microreactors that efficiently mix minute amounts of two fluids Through the realization of fine and complex structures, we have been working on miniaturization and high performance. Please feel free to consult us, especially for any heat-related issues. This document clearly explains the principles, methods, and features of diffusion bonding! It is designed to be easy to read, even for beginners in manufacturing, using diagrams and photos. You can download the document immediately from "PDF Download." We encourage you to take a look! 【Contents】 - What is diffusion bonding? - Methods of diffusion bonding - Features of diffusion bonding

• Other electronic parts
• Heat exchanger
• air conditioning

Joining different metals is possible! We will propose prototypes suitable for the desired combination of materials and sizes.

We would like to introduce examples of dissimilar material joining that our company has conducted. Joining of stainless steel plates and copper plates, as well as aluminum and copper heat sinks, is possible, allowing for the joining of different metals. This can be applied to designs that leverage the characteristics of the materials. We can propose prototypes suitable for the desired combination of materials and sizes. 【Features】 ■ Condensed knowledge of joining and material evaluation expertise accumulated by WELCON ■ Capability to join different metals ■ Ability to propose prototypes suitable for the desired combination of materials and sizes ■ Well-suited for application to designs that utilize the characteristics of the materials *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts
• Heat exchanger
• air conditioning

Capable of manufacturing complex fine three-dimensional structures! We have a proven track record in various fields such as aerospace and chemical plants.

Solid-phase diffusion bonding is a method of directly joining materials that are to be bonded, which is significantly different from techniques such as welding or brazing. By applying heat and pressure to the materials to be joined, this technique promotes atomic movement at the bonding interface, allowing for bonding without melting the materials. This solid-state bonding expands the range of possible manufacturing methods and functionalities. Through the method of solid-phase diffusion bonding, it is possible to create fluid devices with microchannel structures and complex fine three-dimensional structures. 【Features】 ■ Lamination bonding of thin plates is possible ■ Bonding strength comparable to the base material can be achieved ■ Complex hollow components can be manufactured ■ Precise bonding with minimal deformation is possible ■ Bonding of dissimilar materials is possible *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts
• Heat exchanger
• air conditioning

Thin rib shape allows for internal cooling circuits to be placed even in narrow areas! Suitable for application in molds designed for high cycles.

We would like to introduce examples of the application of "molds with cooling circuits" that our company has implemented. It features uniform temperature control within the mold and an internal cooling circuit design tailored to the product shape. Our company can arrange internal cooling circuits even in thin rib shapes and narrow sections. This can be applied to molds designed for high cycles. 【Features】 ■ Uniform temperature control within the mold ■ Internal cooling circuit design tailored to the product shape ■ Internal cooling circuit for reducing resin cooling time ■ Capability to arrange internal cooling circuits in thin rib shapes and narrow sections *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts
• Heat exchanger
• air conditioning

It is possible to arrange numerous fine holes of 0.01 to 0.03 mm on the surface! Applicable to custom-shaped products according to specifications.

We would like to introduce an example of the application of diffusion bonding for "mold parts gas vent blocks" that our company has conducted. This structure is designed to remove gas generated from the molten resin during resin filling into the mold. Our company is capable of arranging numerous fine holes with diameters of 0.01 to 0.03 mm on the surface. It can be applied to custom-shaped products according to specifications, including hole diameter, shape, size, and arrangement density. 【Features】 ■ High injection surface strength ■ Reduced gas venting resistance ■ Capability to arrange numerous fine holes with diameters of 0.01 to 0.03 mm on the surface ■ A structure that allows gas generated from the molten resin to be removed from the mold during resin filling *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts
• Heat exchanger
• air conditioning

Smooth the walls of the resin channel (internal) to reduce flow resistance! It can be applied to injection molding molds and more.

We would like to introduce an example of the diffusion bonding application for "mold parts manifold" that our company has conducted. It has a flow path structure for injecting molten resin into the interior of the mold. It is suitable for application to injection molding molds and hot runner blocks. 【Features】 ■ Smoothens the wall surface of the resin passage (interior) to reduce flow resistance ■ Has a flow path structure for injecting molten resin into the interior of the mold ■ Well-suited for application to injection molding molds and hot runner blocks *For more details, please refer to the PDF materials or feel free to contact us.

• Other electronic parts
• Heat exchanger
• air conditioning

The hyper CLT flooring has an appeal that is difficult to convey with just the numbers in the catalog. It is a lightweight wooden flooring made using CLT, with a 5×10 panel weighing about 230 kg. Because it is relatively lightweight, it is easy to install, remove, and relocate on-site, and its ease of handling becomes more apparent when actually used. Additionally, the heat reflection and radiant heat during summer, as well as the metallic sounds from vehicle traffic, are points where you can easily notice the differences compared to traditional steel plates. By trying it out in a few specific locations such as temporary roads, delivery routes, and heavy machinery work yards, the unique characteristics of wooden flooring become evident. Furthermore, the hyper CLT flooring is registered as a technology with the Ministry of Land, Infrastructure, Transport and Tourism under NETIS as "TH-250021-A." It can also be an option when considering new technologies for civil engineering sites. Wooden flooring, NETIS, civil engineering, CLT. The hyper CLT flooring is a lightweight wooden flooring that has value that can only be understood through use.

Hotron Inc. has launched its new product, the "Vehicle Count Sensor CCS3"! This product is a ceiling-mounted sensor that combines infrared and radar technology. It reliably detects vehicles in both directions with a single unit, accommodating traffic during congestion and vehicle passing, thus achieving efficient occupancy management in large parking lots. Additionally, it can be utilized for exit warning purposes in addition to vehicle counting, contributing to the safe and smooth operation of parking facilities. 'Features' - Improved detection performance against changes in road surface during rainy weather by using both infrared and radar. - Equipped with IP67 waterproof and dustproof performance, making it effective even in salt damage areas. - Various settings can be configured from a dedicated app (for Android devices), with current settings easily understandable at a glance. - The base dimensions are the same as the previous model "CCS2," allowing for smooth replacement of existing equipment. *For more details, please refer to the product information, catalog download, or contact us.*

In projects directly managed by the Ministry of Land, Infrastructure, Transport and Tourism, the use of new technologies is generally required. Therefore, in future civil engineering sites, it is important not only to consider "whether to use new technologies," but also how to select and utilize technologies that are suitable for the site. One of those options is the "Hyper CLT Board," a wooden lightweight mat that utilizes CLT. It can be used as a wooden mat for temporary roads, access routes, and heavy machinery work yards, and the 5×10 board weighs approximately 230 kg, making it relatively lightweight. In addition to ease of installation, removal, and relocation, it features suppression of glare and metallic sounds, as well as environmental considerations through the use of wood. Furthermore, it can be incorporated into proposals for the utilization of new technologies as a **NETIS registered technology by the Ministry of Land, Infrastructure, Transport and Tourism "TH-250021-A."** NETIS, new technologies, civil engineering, CLT. As public works change, the Hyper CLT Board offers a new option of wooden lightweight mats to the site.

Tokyo, October 16, 2026 - (JCN Newswire) - Global fintech company Bercor has officially announced today the launch of its next-generation financial technology platform brand "BeHive" and revealed plans for a roadshow targeting the Asian market, titled "BeHive Connect 2026 by Bercor." Scheduled for October 2026, this roadshow will showcase Bercor Group's next-generation financial infrastructure and technology deployment plans in key regions of Asia, sharing a vision for building interconnected financial platforms. The Bercor Group has completed its EU trademark applications (BERCOR word mark: No. 019417939, Bercor logo: No. 019418002) to enhance the protection of its brand assets, backed by its unique payment infrastructure technology. The "BeHive" being unveiled is a consumer-oriented user interface (UI) platform currently under development, aimed at achieving efficient linkage between digital assets and fiat currency infrastructure.

Hello! This is Japan Kernel System. Here in Kansai, the signs of autumn are deepening, and it has become a pleasant season with cool winds. In line with the fruitful autumn, we bring you news of achievements in evaluation and development. Please read Issue 55 of the Epsilon Newsletter. ─▼───────────────────────────────────── Table of Contents [1] Added Perovskite Simulation Function! [2] Efficiency Evaluation of Power Conditioners Using Test Facilities [3] Editor's Note ─▲───────────────────────────────────── You can find more on our company website.