Notice of participation in the "APCS (Advanced Packaging and Chiplet Summit)" from December 14 (Wednesday) to December 16 (Friday), 2022.

It can transport and store the purity of liquids as is. A clean container that achieves low leaching and high levels of cleanliness.

"Clean Polycon" refers to containers made from specially designed high-density polyethylene that minimizes the leaching of components into the internal solution by suppressing additives. These containers achieve a high level of cleanliness through a unique blow molding process. They are widely used as transport containers for high-purity chemicals, cleaning agents, and resists used in processes such as semiconductors, liquid crystals, and electronic materials. We deliver clean containers with thorough cleanliness management in our high-clean factories. 【Features】 ■ Consistent production in our domestic high-clean factory ■ Thorough management of fine particles ■ Production through fully automated and unmanned manufacturing processes, with complete inspection of all products ■ Use of carefully selected low-leaching materials only *For more details, please refer to the PDF materials or feel free to contact us.

• Plastic utensils and containers
• Other laboratory equipment and containers

Exhibiting at APCS (Advanced Packaging and Chiplet Summit)!

Sekisui Chemical Co., Ltd. will exhibit at the APCS (Advanced Packaging and Chiplet Summit) held from December 14 to December 16. December 14 (Wednesday) - 16 (Friday) 10:00-17:00 at Tokyo Big Sight (East Halls 1, 2, 3) Sekisui Chemical Co., Ltd. exhibition area: East Hall 3 side (3850) Sekisui Chemical offers a wide range of functional resin products in various forms, including tapes, films, thermal interface materials, fine particles, encapsulants, and clean containers, which can be used in semiconductor backend processes and various substrates (PCB, FPC, package substrates). In response to the increasingly advanced needs of the semiconductor industry, such as fine wiring, high-density design, 3D integration, and thin film technology, we provide high-performance products based on technologies such as adhesive control, uniform particle synthesis, thin film coating, and precision multilayer extrusion. Exhibited products: - High-adhesion, easy-peel UV tape SELFA - High thermal conductivity heat dissipation sheet MANION series - Clean UN bottle series - Water-soluble polymer for surface protection We have prepared various products to meet the cutting-edge needs related to semiconductors. Please feel free to visit our booth.

• Plastic utensils and containers

Introducing a compact clean bottle that meets UN standards! We support everything from research and development to mass production.

Introducing the "Small Clean Bottle" handled by Sekisui Chemical Co., Ltd. Since it uses the same materials as the 20L and 200L Sekisui Clean containers, it eliminates the hassle of performance evaluation during scale-up for mass production. Additionally, it uses the same materials as the Sekisui Clean containers that have a proven track record in various fields, minimizing the leaching of components into the contents. 【Features】 ■ Seamless transition from research and development to mass production ■ Easy scale-up from lab to mass production ■ Reduced lead time ■ Excellent clean performance that maintains the quality of the contents ■ Complies with UN standards required for the transport of hazardous materials *For more details, please refer to the PDF document or feel free to contact us.

• Other laboratory equipment and containers

Yamawa Manufacturing Co., Ltd. will exhibit at "JIMTOF 2026, the 33rd Japan International Machine Tool Fair," which will be held at Tokyo Big Sight from October 26 (Monday) to October 31 (Saturday), 2026. We will be showcasing two new products from our highly acclaimed ultimate professional tool "Z-PRO," optimized for machining! Don’t miss this opportunity to visit our booth. 【Highlights】 We will display two new products from the "Z-PRO" brand. We have prepared many short videos to solve tapping troubles! We will thoroughly explain examples of failures and successes in tapping. Live demonstrations using the precision tapping machine 'TTTsystem' will be available.

[Speaker] Masanori Hayashi Evangelist, NTT Docomo Business, Inc. Visiting Researcher, GLOCOM, International University [Key Lecture Content] The application areas of AI are expanding from generative AI to AI agents and physical AI, while the main battlefield of AI infrastructure is shifting from learning-centric to inference-centric. Against the backdrop of rapidly growing AI demand, investments and entries into AI data centers by various businesses are accelerating. However, new challenges are emerging, such as increasing power and cooling demands, responses to data sovereignty, and the utilization of GX strategy regional systems for data center aggregation. This lecture will overview the latest trends in the AI data center market and investment trends, as well as organize technological innovations such as GPUs, liquid cooling, and all-optical networks, along with policy and institutional trends and industrial challenges. Furthermore, it will envision the future of a decentralized AI infrastructure that connects AI factories, data centers, and the edge, and discuss new industrial foundations and future competitive axes through watt-bit collaboration.

[Speaker] Ren Taro Hayashi, Senior Manager, Environmental, Energy, and Resource Strategy Group, Research and Consulting Division, Japan Research Institute, Ltd. [Lecture Items] 1. Overview of Data Centers 2. Impact of Data Centers on the Power Industry 3. Policy Trends in Data Centers and Power (1) GX2040 Vision (2) Watt-Bit Collaborative Public-Private Discussion (3) GX Industry Location Working Group (4) Japan Growth Strategy 4. Future Approaches to Power Procurement for Data Center Development 5. Q&A / Business Card Exchange

This year, we will be holding the large exhibition "Wood and Living Expo" organized by Nice! Approximately 150 domestic housing and building material manufacturers will gather to showcase the latest equipment and noteworthy new products. Additionally, many specialized seminars will be held to learn about the latest industry trends and future outlooks! It will be a two-day event filled with business tips and seeds for new proposals. We sincerely look forward to your visit. ■ Dates: October 15, 2026 (Thursday) 10:00-17:00 October 16, 2026 (Friday) 10:00-16:00 ■ Venue: Pacifico Yokohama, Hall C&D ■ Organized by: Nice Co., Ltd., Wood and Housing Research Association, and the Trustworthy Renovation Promotion Association ■ Official website: https://woodlivingfair.jp/ ■ Pre-registration: https://www.tenjikai-uketsuke.com/form/wood-living-expo-2026/ *Pre-registration is required for attendance. When registering, please select "R&D Center" as the Nice department.

In November 2025, the revised "Good Manufacturing Practice (GMP) for Medical Devices" in China will be announced, with implementation scheduled for November 2026. Local experts will provide a clear explanation of the key points for compliance. < Seminar Topics > - Overview of China's new GMP - Differences from ISO 13485:2016 - New requirements that require particularly careful measures - Anticipated inspection styles