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  1. Home
  2. Electronic Components and Semiconductors
  3. 太洋テクノレックス 本社 和歌山
  4. Announcement regarding the development of an AI-equipped visual inspection system for ceramic substrates for power semiconductors by TAIYO.
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  • Dec 15, 2022
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Dec 15, 2022

Announcement regarding the development of an AI-equipped visual inspection system for ceramic substrates for power semiconductors by TAIYO.

太洋テクノレックス 太洋テクノレックス 本社 和歌山
Defect detection, which has been difficult until now, has become possible with AI implementation. We would like to inform you that the detection of hard-to-distinguish defects has become partially possible. Currently, verification has been completed for ceramic substrates for power semiconductors, and we will continue to improve functionality in defect detection and operational aspects. *For more details, please download the attached document.
Detection flow in AI (excerpt)
Detection flow in AI (excerpt)
TY-VISION A308DC
TY-VISION A308DC
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20221215.pdf[190814]

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Dual-Sided Automatic PCB Final Appearance Inspection Device TY-VISION A308DC

The A300 series, suitable for package and module type boards, finally includes a 2.5µm specification model! 【TY-VISION A308DC】

We have started accepting orders for the optical resolution 2.5μm fully automatic double-sided final appearance inspection system 'TY-VISION A308DC'. It is ideal for the final appearance inspection process in clean rooms! ■ Achieves stable imaging with auto-calibration function and smoothness adjustment mechanism. ■ 【Multi-scan function】 For double-sided inspection: 2 scans per side × front and back; for single-sided inspection: 4 scans per side. ■ The inspection stage can be selected from two types: a versatile type for various board specifications and a dedicated type. ■ Adopts a transport and suction method using a linear actuator, enabling more stable inspections. ■ A rich set of optional features (compatible with dedicated rack specifications, paper insertion and removal function, 2D code reader, production management system integration, etc.) ■ Maximum board size: 200mm × 300mm ■ Standard equipped with FFU #BoardInspection #AppearanceInspection #InspectionEquipment #FinalAppearance #FinalBoardAppearanceInspection #AVI #AFVI #InspectionSystem #InspectionEquipment

  • Visual Inspection Equipment

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M109SC.png

Final Appearance Inspection Machine for Substrates TY-VISION M109SC

We won't miss any minor defects! We will combine according to your requests and propose equipment with specifications suitable for you.

The "M109SC" is a final appearance inspection device for printed circuit boards that accommodates larger-sized products. 【Effective inspection size: 300(W)×500(D)mm】 It employs a high-resolution camera that covers an imaging width at a high resolution of 5µm, and enables comfortable defect detection through a user-friendly inspection setting method. Detailed settings can be tailored to the complex inspection standards of each user. We will determine the inspection specifications according to your requirements and provide the best final appearance inspection system for you. 【Features】 ■ Large inspection stage × high-definition camera ☐ Reduces false positives and automates processes through integration with our unique AI system 'XAIS'! ■ Abundant options ■ Software suitable for products pursuing high quality ■ Detection capability that does not miss minor defects ■ Detailed settings can be customized according to the inspection standards of each product *For more details, please refer to the PDF materials or feel free to contact us. #PCBInspection #InspectionEquipment #AppearanceInspection #FinalAppearance #AI #AFVI #Inspection

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  • Circuit Board Inspection Equipment

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XAIS看板.png

AI system for final appearance inspection of substrates 'TY-VISION XAIS'

Attention companies struggling with final appearance inspection of PCBs! The solution to your problem is "TY-VISION XAIS"! 【Final PCB Appearance + AI System】

Introducing the AI system for final appearance inspection of circuit boards, 'TY-VISION XAIS'. The defect information detected by the AVI (final appearance inspection device for circuit boards) 'TY-VISION' is automatically categorized into "good" and "needs confirmation" by the XAIS (AI system). Only the areas marked as "needs confirmation" received from XAIS are checked by the inspector for the final judgment. We solve the challenges of final appearance inspection before shipment, such as securing inspectors, labor costs, time spent on training, and inspection man-hours to prevent defective products from being shipped. 【Benefits of Implementation】 ■ Reduction of man-hours ■ Reduction of labor costs ■ Stabilization of inspection quality *For more details, please refer to the PDF document or feel free to contact us. #CircuitBoardInspection #InspectionEquipment #AppearanceInspection #FinalAppearance #Efficiency #LaborSaving #AVI #AVFI #Inspection #Defects #DefectDetection

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Substrate Final Appearance Inspection Device TY-VISION A308DC 2.5μm Fully Automatic Machine Product Catalog

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Final Appearance Inspection AI System 'TY-VISION XAIS' Product Catalog

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【Metal Crack Repair】We repair cracks in metal products without applying heat.

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The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Mar 20, 2026

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Aluminum casting repair: Metal crack repair without applying heat.

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The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Mar 20, 2026

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Human Body Day 2025 Event Report - Nack Image Technology

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On November 6th (Thursday) to 7th (Friday), 2025, we held the "Human Body Day 2025" at the NAC Image Technology Akasaka Multi-Purpose Space. We have uploaded videos of the highlights from each company and the presentations that took place on the day to our website. We encourage you to take a look. ---[Report on Human Body Day 2025 is here]------------------- https://info.nacinc.jp/jintaiday2025-report ------------------------------------------------------------------------- On the day of the event, participants were able to experience a wide range of products in a hands-on session format, including motion capture, force plates, eye tracking, and human body analysis software. We received numerous comments from attendees expressing high satisfaction, saying, "It was great to gain various information all at once," which makes us very happy. NAC Image Technology will continue to provide "valuable products to our customers." We hope you will join us for our next event as well.

Mar 20, 2026

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AAEON ArrowLake equipped industrial COM module Type 6 standard

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Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Mar 19, 2026

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AAEON ArrowLake-equipped industrial COM module COM-HPC R1.2 Mini standard

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Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed

Mar 19, 2026

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