The A300 series, suitable for package and module type boards, finally includes a 2.5µm specification model! 【TY-VISION A308DC】
We have started accepting orders for the optical resolution 2.5μm fully automatic double-sided final appearance inspection system 'TY-VISION A308DC'. It is ideal for the final appearance inspection process in clean rooms! ■ Achieves stable imaging with auto-calibration function and smoothness adjustment mechanism. ■ 【Multi-scan function】 For double-sided inspection: 2 scans per side × front and back; for single-sided inspection: 4 scans per side. ■ The inspection stage can be selected from two types: a versatile type for various board specifications and a dedicated type. ■ Adopts a transport and suction method using a linear actuator, enabling more stable inspections. ■ A rich set of optional features (compatible with dedicated rack specifications, paper insertion and removal function, 2D code reader, production management system integration, etc.) ■ Maximum board size: 200mm × 300mm ■ Standard equipped with FFU #BoardInspection #AppearanceInspection #InspectionEquipment #FinalAppearance #FinalBoardAppearanceInspection #AVI #AFVI #InspectionSystem #InspectionEquipment
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Fully Automatic PCB Final Appearance Inspection Device 'TY-VISION A308DC' ■ Optical resolution: 3μm/5µm (2.5μm) ■ Maximum substrate size is 200mm × 300mm.
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Started planning in 1985, and after more than 20 years since the announcement of the 'TY-VISION 3000' in 2000, it has been developed for PCB mass production sites.
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![Final Appearance Inspection Device for Substrates 'TY-VISION M111SC' [High Resolution: 2.5μm/3μm]](https://image.mono.ipros.com/public/catalog/image/01/3d1/707248/IPROS52478708147886811742.jpeg?w=120&h=170)
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Taiyo TechnoRex Co., Ltd. continues to operate in the fields of prototype development of flexible printed circuit boards (FPC) and printed circuit board testing systems. Since FPC is fundamentally related to the structure of hardware, both high precision quality and shortened development time are required. We have extensive experience and know-how in the manufacturing processes of single-sided FPC, double-sided FPC, multilayer FPC, and their advanced types, and we continuously improve and enhance our technology, resulting in consistent evaluations of our delivery times and quality. Additionally, while technically advancing further miniaturization and high density, we are also undertaking new initiatives such as bump-type and special material electroplating. On the other hand, our printed circuit board testing systems mainly consist of electrical inspection systems and final appearance inspection systems, which are adopted in the mass production sites of FPCs and package/module-type substrates. They operate day and night in quality control settings for substrates used in smartphones, automotive applications, and various electronic devices. We will continue to respond to the increasingly diverse market needs. *On December 21, 2023, the company name was changed from "Taiyo Kogyo Co., Ltd." to "Taiyo TechnoRex Co., Ltd."*