AI system for final appearance inspection of substrates 'TY-VISION XAIS'

◎FPC (Flexible Printed Circuit Board): Under the theme of "Discovering Applications for FPC," you can experience the characteristics of FPC in four zones: lightweight, flexible, fine, and special. 1. Comparison of weight between rigid boards and FPC 2. FPC that you can actually touch and bend 3. Reduction of board area due to high-density wiring 4. FPC with special features such as transparent, high-frequency, and pressure-resistant types Additionally, we are also showcasing next-generation circuit technologies such as stack vias and via fills. It's not just about FPC! We have live demonstrations of 'FA Automation' and the latest appearance inspection system using AI technology! ◎FA Automation: By achieving teaching-less automation through visual feedback control, we eliminate the burden of calibration and realize high-precision, high-speed operation. We have prepared a demonstration for the transport of rigid boards. ◎The latest final appearance inspection system, the AI system 'TY-VISION XAIS,' is now in Chapter 2! In addition to improving efficiency by reducing false positives in the final appearance inspection process, it also supports defect detection using AI. It is effective for defects with minimal brightness differences that are difficult to detect with inspection devices, even though they can be identified visually.

◎FPC (Flexible Printed Circuit Board): Under the theme of "Discovering Applications for FPC," you can experience the characteristics of lightweight, flexible, fine, and special FPCs in four different zones. 1. Comparison of weight between rigid boards and FPCs 2. FPCs that you can actually touch and bend 3. Reduction of board area due to high-density wiring 4. FPCs with special features such as transparent, high-frequency, and pressure-resistant types Additionally, we are also showcasing next-generation circuit technologies such as stack vias and via fills. Not only FPCs! We also have a live demonstration of the latest appearance inspection system using AI technology in the fields of FA and automation! ◎FA Automation: By achieving teaching-less operation through visual feedback control, we eliminate the burden of calibration and realize high-precision, high-speed automation. We have prepared a demonstration of rigid board transport and are waiting for you. ◎The latest final appearance inspection system, the AI system "TY-VISION XAIS," is now in Chapter 2! In addition to improving efficiency by reducing false reports in the final appearance inspection process, it also supports defect detection using AI. It is effective for defects with low brightness differences that are difficult to detect with inspection equipment, even though they can be identified visually.

The order status of our group's mirror polishing machine business and test system business for the fiscal year ending December 2024 is showing a steady trend. Please see the PDF file below.

We are advancing the development of high-performance for our appearance inspection system "TY-VISION series," and we are pleased to announce the completion of the appearance inspection device "TY-VISION M111SC," which is equipped with an optical system featuring an optical resolution of 2.5μm. In recent years, the semiconductor market has continued to thrive against the backdrop of further expansion of DX and IoT, the spread of 5G communication networks, the advancement of digitalization in society, and the transformation of the automotive industry with the progress of autonomous driving and electrification. The quality levels of various substrates have been rising, especially for high-definition substrates, prompting us to develop the "TY-VISION M111SC" to meet market demands. Please refer to the attached file for more details. *This is the press release, and we would like to inform you that it has been featured in the only specialized magazine in the printed circuit board industry, "Printed Circuit Journal." (We have received consent for the publication in the magazine.)