KONISHI Mold Engineering Presentation! January 27, 2023 (Friday) Open Innovation Technology Pitch Event Utilizing Go-Tech

KONISHI Mold Engineering will take the stage and present.
On January 27, 2023 (Friday), a hybrid pitch event for open innovation technology utilizing Go-Tech (Support for Innovation) will be held.
Purpose of the event:
Downstream industries, represented by the automotive and electrical/electronic sectors, possess advanced production technologies and have been solving problems internally through "wisdom and improvement." However, with the electrification of vehicles and changes in materials due to environmental considerations, solutions that are not extensions of existing wisdom and improvements are being sought. Additionally, many downstream companies have been placing importance on open innovation utilizing external resources. In response to these needs, we believe that leveraging the development results of the Go-Tech (Support for Innovation) project will be beneficial. The advantages of participation include the ability to quickly and directly gather key points of the development results held by Go-Tech companies. Negotiations and meetings with Go-Tech companies interested in business discussions can be conducted immediately.

Date and time | Friday, Jan 27, 2023 02:00 PM ~ 03:30 PM |
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Capital | Nikkankogyo Shimbun Co., Ltd. West Japan Branch Seminar Room (Chuo Ward, Osaka City) & Online (Webex) Capacity 30 people (in-person attendance) / 100 people (online) Application Deadline January 25, 2023 (Wednesday) *Registration will close as soon as the capacity is reached. |
Entry fee | Free |
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