◆Yoshida SKT Co., Ltd.◆ NEW "Surface Treatment Case Study Collection 'Prevention of Adhesion of Epoxy Adhesives in Aircraft Parts Manufacturing'" has been released.

Silicone-free, prevents adhesive adhesion to molds with low-temperature processing. By utilizing surface treatment, various production challenges can be solved. Samples and case studies are currently available.

In the production line, we cannot predict when the following troubles will occur: ■ Line stoppage ■ Delay in takt time ■ Increase in defects etc... When such problems arise, while prompt response and investigation of the causes are important, learning preventive measures in advance can help avert emergencies. By imparting "release properties and slip properties" through surface treatment, we are currently offering free "trial sets" of surface treatments that have actually improved production processes, as well as a "case study collection on process improvement." For more details on the cases, please download the "case study collection on process improvement" and check it out. You can apply for a free trial set of surface treatment samples from the "related links." We encourage you to take this opportunity to apply.

• Other surface treatment equipment

Metal cracks are one of the concerns in equipment maintenance operations. Conventional welding methods for repairs can change the base material around the crack due to heat, leading to residual stress and deformation, which always carries the risk of "crack recurrence" and "secondary damage." Hinode Waterworks Equipment Co., Ltd.'s "Mechanical Stitching Method" is a new technique that allows for metal crack repairs without applying heat. By using special bolts and reinforcement plates, the crack is physically removed without affecting the base material at all. Repairs can be made even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. For more details, please contact us or download the catalog.

In civil engineering sites, there are many instances where temporary roads, access roads, heavy machinery work yards, and material storage areas use ground plates. While conventional steel plates are practical, they can sometimes fail to leave a lasting impression when it comes to the appearance of the site and conveying the company's initiatives. Hyper CLT ground plates are civil engineering materials that utilize wood CLT. As ground plates with the texture of wood, they can be used as a substitute for steel plates, for mud prevention, ground protection, and ensuring pedestrian pathways. By introducing them in visible areas such as site entrances, morning assembly locations, and around break areas, it becomes easier to create an impact that differs from traditional sites. The 5×10 plate weighs about 230 kg, and the 5×20 plate weighs about 460 kg, making them lightweight and easy to handle even with small machinery, which helps reduce construction burdens. They also offer advantages such as glare reduction, noise reduction, and environmental considerations unique to wood, making them suitable for innovative public works projects. Registered as a Ministry of Land, Infrastructure, Transport and Tourism NETIS technology "TH-250021-A," they are recommended for companies aiming to create a distinctive impression at their sites. We can also provide consultation for small lot introductions and suggest usage methods tailored to site conditions. Why not add a clear change to your civil engineering site with these new wooden ground plates?

Features: ● Equipped with Intel Core Ultra 9 285H/7 255H/5 225H ● DDR5 SODIMM x 2 (up to 128G) (sold separately) ● VGA Switch DDI x 1, LVDS colay eDP x 1, DDI x 2 ● USB 2.0 x 8, USB 3.2 Gen 2 x 4 ● PCIe [x1] x 4, PCIe [x4] x 1, PEG [x8] + [x4] + [x4] ● 2.5GbE x 1 ● COMe Type6 standard, 95mm x 95mm size ● Operating temperature -20~70℃ ● Sold separately ECB-920A: Development carrier board COM-MTHC6-FAN01: CPU fan COM-MTHC6-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Processor: Qualcomm QCS6490 with Arm Cortex-A78 ×4 + Cortex-A55 ×4 (Octa-core) up to 2.7GHz ● LPDDR5 onboard memory (up to 8GB) ● Display: MIPI-DSI (4 lanes) ×1, DisplayPort ×1 ● USB 2.0 ×4 (one port supports OTG), Gigabit Ethernet ×2