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  3. DNPハイパーテック
  4. 【Product Information Update】For attacks that cannot be prevented by obfuscation alone! App protection tool CrackProof.
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  • Jun 22, 2023
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Jun 22, 2023

【Product Information Update】For attacks that cannot be prevented by obfuscation alone! App protection tool CrackProof.

DNPハイパーテック DNPハイパーテック
We have updated the product information. One of the security measures applied to apps is "obfuscation." In the manufacturing industry, some companies are implementing it as a method of app protection. However, is obfuscation alone sufficient for app security measures? We would like to introduce our security tool, CrackProof, which protects apps from attacks that cannot be fully defended against by obfuscation alone, providing multi-faceted protection. If you are concerned about security measures for your app, including obfuscation, please take a look.
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【製品ページ表紙画像】難読化だけで防げない攻撃に.jpg

An attack that cannot be prevented by obfuscation alone! App protection tool CrackProof.

Many companies implement "obfuscation" as a method of app protection. Can we say that obfuscation alone is sufficient for app security measures?

One of the security measures applied to apps is "obfuscation." Apps that do not implement security measures are at a significantly higher risk of actions that can bring disadvantages to the distributing company, such as the theft of proprietary technology or the creation of unauthorized copy apps. Obfuscation is a technique that makes it difficult to analyze source code and similar materials to prevent such fraudulent activities, and some companies in the manufacturing industry also implement it as a method of app protection. However, is obfuscation alone sufficient for app security measures? Obfuscation has a certain effect on app protection, but it is merely a "technique to make things difficult to read" and is just one of the measures, so it cannot be said that it is sufficient on its own. By combining it with other security measures and protecting the app from multiple angles, it will be possible to distribute it more safely. Our security tool, CrackProof, protects apps from various attacks. Therefore, it becomes possible to protect the app from attacks that cannot be fully defended against by obfuscation alone. If you are concerned about security measures for your app, including obfuscation, please feel free to contact us.

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DNPハイパーテック
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Metal Crack Repair: MS Method for Repairing Cracks and Fractures in Machinery Equipment

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Metal cracks are one of the concerns in equipment maintenance operations. Conventional welding methods for repairs can change the base material around the crack due to heat, leading to residual stress and deformation, which always carries the risk of "crack recurrence" and "secondary damage." Hinode Waterworks Equipment Co., Ltd.'s "Mechanical Stitching Method" is a new technique that allows for metal crack repairs without applying heat. By using special bolts and reinforcement plates, the crack is physically removed without affecting the base material at all. Repairs can be made even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. For more details, please contact us or download the catalog.

Jul 24, 2026

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Hyper CLT flooring panel

Impressing the site with the presence of wood | Hyper CLT flooring

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In civil engineering sites, there are many instances where temporary roads, access roads, heavy machinery work yards, and material storage areas use ground plates. While conventional steel plates are practical, they can sometimes fail to leave a lasting impression when it comes to the appearance of the site and conveying the company's initiatives. Hyper CLT ground plates are civil engineering materials that utilize wood CLT. As ground plates with the texture of wood, they can be used as a substitute for steel plates, for mud prevention, ground protection, and ensuring pedestrian pathways. By introducing them in visible areas such as site entrances, morning assembly locations, and around break areas, it becomes easier to create an impact that differs from traditional sites. The 5×10 plate weighs about 230 kg, and the 5×20 plate weighs about 460 kg, making them lightweight and easy to handle even with small machinery, which helps reduce construction burdens. They also offer advantages such as glare reduction, noise reduction, and environmental considerations unique to wood, making them suitable for innovative public works projects. Registered as a Ministry of Land, Infrastructure, Transport and Tourism NETIS technology "TH-250021-A," they are recommended for companies aiming to create a distinctive impression at their sites. We can also provide consultation for small lot introductions and suggest usage methods tailored to site conditions. Why not add a clear change to your civil engineering site with these new wooden ground plates?

Jul 24, 2026

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AAEON ArrowLake equipped industrial COM module Type 6 standard [COM-ARHC6]

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Features: ● Equipped with Intel Core Ultra 9 285H/7 255H/5 225H ● DDR5 SODIMM x 2 (up to 128G) (sold separately) ● VGA Switch DDI x 1, LVDS colay eDP x 1, DDI x 2 ● USB 2.0 x 8, USB 3.2 Gen 2 x 4 ● PCIe [x1] x 4, PCIe [x4] x 1, PEG [x8] + [x4] + [x4] ● 2.5GbE x 1 ● COMe Type6 standard, 95mm x 95mm size ● Operating temperature -20~70℃ ● Sold separately ECB-920A: Development carrier board COM-MTHC6-FAN01: CPU fan COM-MTHC6-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)

Jul 23, 2026

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AAEON ArrowLake equipped COM-HPC R1.2 Mini specification【HPC-ARHm】

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Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Jul 23, 2026

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AAEON Industrial COM Express with Qualcomm QCS6490【uCOM-Q6490】

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Features: ● Processor: Qualcomm QCS6490 with Arm Cortex-A78 ×4 + Cortex-A55 ×4 (Octa-core) up to 2.7GHz ● LPDDR5 onboard memory (up to 8GB) ● Display: MIPI-DSI (4 lanes) ×1, DisplayPort ×1 ● USB 2.0 ×4 (one port supports OTG), Gigabit Ethernet ×2

Jul 23, 2026

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  • 排気熱風なく 気温-4.1℃の冷風を 工事不要で暑さ対策 店舗・工場の 安全対策に! 気化式スポットクーラー Pure Drive ピュアドライブ
  • 令和8年度 ゼロエミ製品 開発助成金 電子申請 受付中 ゼロエミッションを推進する製品開発、改良、 規格等適合化に要する経費の一部を助成します。 助成金額 単独 1,500万円 共同 3,000万円
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