[FerRobotics] Exhibiting at the 2023 International Robot Exhibition! Displaying multiple types of robotic systems for polishing automation solutions! Achieving the automation of skilled tasks in polishing and grinding, which has been deemed impossible until now, along with reduced cycle times and high-quality finishes.

Dramatic improvement in cycle time. Solutions to the hiring issues of skilled workers and 3K workers. Reduction in costs of consumables and abrasives. Automation of polishing with high-speed autonomous correction control of contact force!

FerRobotics' Active Compliant Technology automatically corrects the "difference" in contact pressure (force) generated during polishing and grinding processes, which require skilled techniques, at high speed. This technology allows for consistent polishing/grinding at the set contact force, unaffected by variations in processing speed or gravitational load differences due to angles. With the end effector (ACF) utilizing ACT technology, it instantly adjusts to changes in the dimensional tolerances, curved shapes, and non-flat surfaces of the workpiece through rapid automatic correction of stroke extension and contraction, maintaining contact with the workpiece at the set force. This technology can increase the speed of the device or robot's trajectory, thereby enhancing processing speed and improving cycle times. Additionally, in robotic polishing and grinding, the ACF controls the contact pressure through the extension and contraction of its stroke, eliminating the need to move the heavy robot arm for corrections, which further assists in improving processing speed. Moreover, it automatically corrects tool load variations caused by gravity changes due to the robot's angle, ensuring a consistent contact pressure from any angle and enabling a finish without processing inconsistencies.

• Welding robot

Weld bead removal and complete automation from rough cutting to finishing polishing can be achieved with a single machine. With the integration of a tool exchange system and high-speed autonomous pressure correction technology, full automation is possible!

Equipped with an auto tool changer function, the pressing force high-speed autonomous correction technology achieves a reduction in cycle time for skilled labor and complete automation of high-quality finishing. Using ACT technology, the end effector autonomously corrects the force applied to the workpiece in response to variations in dimensions and warping by instantaneously adjusting the stroke extension and contraction, maintaining contact with the set force. Additionally, gravity compensation is autonomously performed, ensuring a consistent pressing force from any angle, and allowing for easy settings to maintain finishing quality on R-shaped workpieces. This technology enables the robot to maintain a constant contact force even when increasing the trajectory speed, improving cycle time and achieving high-quality finishing with high repeatability. Furthermore, automation allows for increased pressing force and reduces the frequency of changing abrasive grits by maintaining a consistent force, significantly contributing to the extension of abrasive lifespan and reduction of running costs. The tools include holders compatible with almost all types of grinding, from grinders to double-action sanders and brushing. The motor speed can be controlled in 10 rpm increments, broadening the scope of automation in grinding operations. Additionally, it is compatible with an auto paper changer.

• Welding robot

Automation of labor-intensive R-shaped and complex-shaped masking tasks without wrinkles or bubbles. Enabling automation of processes that were previously impossible to automate with high-speed operations.

This product enables the automation of masking and taping tasks that were previously impossible. FerRobotics' Active Compliant Technology (ACT) automatically corrects the "difference" in contact pressure (force) at high speed, allowing it to maintain constant contact with the target object at the set pressing force, regardless of variations in processing speed or gravitational load differences due to angles. With the end effector (ATK) utilizing this technology, taping and masking tasks can be finished with the highest quality, free of wrinkles and bubbles. It also allows for increased robot speed, enhancing work speed and improving cycle time. The tool load caused by gravity, which changes with the robot's angle, is automatically corrected, ensuring a consistent pressing pressure from any angle, enabling high-quality taping with high repeatability even on R-shaped and complex geometries.

• Articulated Robot

We will hold an online seminar as follows. The corporate perspective on the introduction of monitoring systems is changing year by year. We will explain the monitoring systems for machine tools that are currently needed, using various case studies to discuss the changes in the industry environment, what challenges customers perceive, their expectations for monitoring systems, and the effects of their implementation. This seminar will provide insights into specific approaches for your company's introduction of monitoring systems. Date and Time: February 12, 2025 (Thursday) 14:00 - 15:00 Instructor: Monitoring System Representative, ARTIS (MARPOSS Corporation Sales Development Department) Target Audience: - Customers considering the introduction of monitoring systems who want to know the specific process leading to implementation. - Customers interested in what challenges other companies have identified that led to the introduction of monitoring systems. - Customers researching the latest trends in monitoring systems for machine tools. We sincerely look forward to your participation.

■Title: "Fluorine-Free Water and Oil Repellent Treatment Technology Achievable - Guidelines and Examples for Surface Design to Improve Wetting Fundamentals and Liquid Sliding Properties" As PFAS regulations accelerate, surface designs that achieve water and oil repellency without fluorine are gaining attention. This seminar will systematically explain the fundamentals of wetting, dynamic wettability evaluation, design guidelines for improving sliding properties, and the latest examples of fluorine-free surface treatments by leading researchers. ■Date and Time: April 14, 2026 (Tuesday) 13:30 - 16:30 ■Target Audience for the Seminar - Individuals engaged in surface treatment and modification operations - Those involved in research and development related to imparting water and oil repellency, stain resistance, and anti-adhesion properties to various substrate surfaces - Individuals engaged in research and development of fluorine (PFAS) alternative technologies and fluorine-free surface treatment and modification technologies ■Knowledge Gained from the Seminar - Fundamental knowledge/theory regarding wettability - Correct knowledge of wettability evaluation techniques (static/dynamic contact angle, contact angle hysteresis, sliding/falling angle) - Know-how for creating surfaces/interfaces with excellent water and oil repellency, stain resistance, and anti-adhesion properties without fluorine

The "Jumbo Surprise Exhibition," which solves the challenges faced by the manufacturing industry all at once, will be held again this year. In the FA zone, the latest FA equipment, control and drive devices, and energy-saving and labor-saving proposals will be displayed all in one place. You can experience concrete solutions that are immediately useful on-site, such as automation, productivity improvement, equipment renewal, and maintenance efficiency. Representatives from each manufacturer will be available to provide direct explanations, making it a great opportunity to learn about the latest trends and case studies. If you are looking for hints to solve your challenges or considering new equipment investments, please come and visit us. We will provide encounters that will lead your business to the next stage.

■Title: "Flexible Substrates and FPC Formation Technology for 5G/6G - LCP-FCCL and Its Development" ――A must-see for developers of high-frequency FPCs. Provides knowledge useful for future FPC substrate design, from the key technologies for LCP multilayering to examples of new low-dielectric films. ■Date and Time: April 15, 2026 (Wednesday) 13:30 - 16:30 ■Target Audience for the Seminar 　Development engineers engaged in the development of high-frequency FPCs and their substrates ■Knowledge Gained from the Seminar 　・Basic properties required for FPC substrates 　・Reasons for using LCP and polyimide films in FPCs 　・Key technologies for LCP multilayering 　・Points to consider when processing LCP films 　・Examples of hybridization methods between LCP and low-dielectric materials

A systematic explanation from the basics of semiconductor packaging to the design and evaluation of encapsulation materials. A leading expert thoroughly organizes practical perspectives from WLP/PLP to high thermal conductivity materials. ■ Title: Basic Information on Semiconductor Packaging Technology: Comprehensive Explanation ■ Date and Time: April 10, 2026 (Friday) 10:30 AM - 4:30 PM ■ Target Audience for the Seminar - Individuals involved in semiconductor packaging (sales, technology) - Those interested in semiconductor packaging technology - Those interested in semiconductor resin encapsulation and encapsulation materials ■ Knowledge Gained from the Seminar - Development history of semiconductor packaging (PKG) - Development history of semiconductor packaging technology (methods, materials) - Specifications of semiconductor encapsulation materials (raw materials, composition, manufacturing equipment, evaluation methods, etc.)