Comparison of Infrared Spectroscopy and Raman Spectroscopy

By conducting two analyses, it is possible to obtain more detailed and accurate results!

This document introduces the characteristics of each spectroscopy method and the spectra obtained when comparing infrared spectroscopy and Raman spectroscopy. Both infrared spectroscopy and Raman spectroscopy are vibrational spectroscopies that investigate the vibrational energy of molecules, but the shapes of the spectra obtained from each method differ even when measuring the same substance. Infrared spectroscopy and Raman spectroscopy are complementary; information that cannot be obtained through a single analysis can be acquired more detailed and accurately by conducting both analyses. For more details, please refer to the catalog provided. 【Characteristics of Infrared Spectroscopy】 ■ Infrared absorption occurs when the dipole moment changes with vibration (infrared active). ■ Vibrations that cause a distortion in the symmetry of the molecule (leading to an electronic dipole) are highly infrared active. *For more information, please refer to the PDF materials or feel free to contact us.

• Vibration Testing

Spectroscopic analysis is suitable for component analysis and qualitative analysis of foreign substances.

We will introduce the comparison between Raman spectroscopy analysis by Aites Co., Ltd. and FTIR. Spectroscopic analysis is suitable for component analysis of foreign substances and qualitative analysis. Both Raman and FT-IR can obtain spectra based on the structure of the analysis target. However, since each has its strengths and weaknesses, it is necessary to choose between the two depending on the analysis target. 【Features】 ■ Measurement in the order of several micrometers, which is difficult to analyze with IR, is possible. ■ No sampling is required. *For more details, please refer to the PDF materials or feel free to contact us.

• Testing Equipment and Devices

Detect and analyze the absorption wavelengths of organic molecular groups (functional groups)!

At Aites Co., Ltd., we conduct "FT-IR analysis" to confirm the degradation of resins. The degradation of resins can manifest as visible discoloration or invisible changes. Discoloration can be detected through visual changes, but invisible changes can lead to a decrease in strength and become the source of various issues. IR analysis allows us to understand the changes in molecular structure caused by these alterations. *For more details, please refer to the PDF document or feel free to contact us.*

• Contract Analysis
• Contract Analysis
• Analysis Services

We will suggest appropriate analysis methods based on the condition of polymer materials and samples!

At AITES Co., Ltd., we conduct material degradation analysis. We propose appropriate analytical methods based on the condition of polymer materials and samples. By analyzing the degradation process that the material has undergone and optimizing the polymer materials and usage environment, it is possible to extend the product's lifespan. *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis
• Contract Analysis
• Analysis Services

It is possible to monitor the progress of the adhesive curing reaction (degree of curing)!

FT-IR spectra sensitively reflect the bonding states of organic materials, making it possible to monitor the progress of adhesive curing reactions (degree of curing). The procedure for measuring the degree of curing of the resin involves comparing the spectra of unreacted materials with those of materials after 100% reaction to identify the changing regions. The degree of curing for unreacted materials is set at 0%, and that for reacted materials is set at 100%. The peak intensity of the measurement sample spectrum is interpolated to determine the reaction rate (degree of curing). 【Procedure for Measuring Degree of Curing】 ■ Compare the spectra of unreacted materials with those of materials after 100% reaction to identify the changing regions. ■ Set the degree of curing for unreacted materials at 0% and that for reacted materials at 100%. ■ Interpolate the peak intensity of the measurement sample spectrum to determine the reaction rate (degree of curing). *For more details, please refer to the PDF document or feel free to contact us.

• Contract measurement
• Other contract services

Analysis of inorganic compounds such as metal oxides is also possible! We will introduce the analysis of black spots on the surface of copper-clad laminates.

We would like to introduce a case where discoloration on the surface of a copper-clad laminate was analyzed using Raman spectroscopy. Our Raman spectral analysis can analyze not only organic substances but also inorganic compounds such as metal oxides. Please feel free to contact us when needed. [Analysis Details] ■ Analysis of black spots on the surface of the copper-clad laminate - Slight discoloration is observed on the surface - Upon magnification, a condition resembling black stains is seen - A spectrum of CuO was obtained from the discolored area - The nature of the discoloration is believed to be copper oxide formed on the surface of the copper *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis
• Analysis Services

Depth-direction measurements using Raman spectroscopy! Material analysis of each layer is possible from the surface of multilayer films.

Our "Micro Raman Spectrophotometer" employs a confocal optical system, allowing for the adjustment of the focal position in the depth direction, similar to a microscope, enabling material analysis of each layer from the surface of multilayer films. Using the confocal function of the micro Raman spectrophotometer, the focus of the Raman laser light can be varied in the depth direction. Additionally, by continuously changing the focal position, it is possible to obtain spectra continuously in the depth direction. 【Features】 ■ Adoption of a confocal optical system ■ Enables material analysis of each layer from the surface of multilayer films ■ Capable of varying the focus of the Raman laser light in the depth direction ■ Allows for continuous spectral acquisition in the depth direction *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices
• Spectroscopic Analysis Equipment
• Contract Analysis

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed

Features: ● Equipped with Intel Atom x7835RE/x7433RE ● LPDDR5x 8GB/16GB onboard ● eMMC 32GB/64GB onboard ● LVDS x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe x1 x 4 ● COMe Type 10 standard, 84mm x 55mm size ● Operating temperature -40 to 85℃ ● Optional items ECB-920A-0001: Development carrier board NANOCOM-ADN-FAN01: CPU fan NANOCOM-ADN-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)