[Exhibition Participation Announcement] We will be exhibiting at the 38th Nepcon Japan - Electronics Development and Implementation Exhibition.

Programming for FPGAs and special performance tests such as BST can be handled with a flying probe tester.

This is an option that equips the underside operating axis of the APT-1600FD series with a dedicated fixture lifting mechanism. It allows for special inspections connected to external devices, such as Boundary Scan Tests (BST), as well as writing to and reading logs from ICs, to be performed in parallel with in-circuit testing. *For an image of the operation, please refer to the YouTube video.

• Circuit Board Inspection Equipment

The Takaya APT series is a board inspection device capable of industry-leading ultra-fast in-circuit testing.

One method for efficiently mass-producing products is the "line production method," which arranges machinery in order of the production process. This method excels in the productivity of single products and is adopted in many manufacturing sites. The incorporation of an inspection process into this line production method is referred to as "inline inspection." Takaya's flying probe testers have models that can accommodate this "inline inspection" by automatically transporting circuit boards on a conveyor. By collaborating with loaders, unloaders, and inversion machines through SMEMA, it enables automated and unmanned inspection even with large quantities of circuit boards. Additionally, when used in conjunction with other companies' 3D-AOI (automated optical inspection machines), the flying probe testers can detect issues such as microbridges that cannot be identified through visual inspection alone. This synergy leverages the strengths of each system, resulting in the elimination of false reports, improved inspection capabilities, and increased speed. If you are facing challenges with full electrical inspection (ICT) of mass-produced circuit boards, please consider Takaya's APT series, which allows for easy line switching without the need for fixtures.

• Circuit Board Inspection Equipment

Functions specialized for lending and returning operations are templated. IC tags are attached to managed items, enabling lending, returning, and inventory checks using RFID.

This is a management system for tracking items using IC tags. It reliably records the history of items taken out and returned, preventing omissions and errors in ledger entries, while also supporting the early detection of forgotten returns and losses. Additionally, it enables efficient inventory checks through bulk reading with RFID handheld devices. In traditional item management operations, the following issues often arise: ♦ Handwriting or Excel input into the ledger The process of recording in the ledger or entering data into Excel during item check-out and return is cumbersome, leading to discrepancies due to entry errors. ♦ Individual confirmation during inventory checks It is necessary to take items out one by one from boxes or shelves for verification, which consumes a significant amount of time for inventory tasks. ♦ Management through ledgers Due to management via paper or Excel ledgers, it is difficult to detect unreturned items or losses early and respond quickly. This system addresses these challenges.

• IC tag

We have created a video explaining tool management using the RFID asset management system from Takaya's Solution Division!

We will solve the challenges of tool management, namely "When?", "Who?", and "Which tool?" using RFID. 【Overview of the Outgoing Management System】 - Attach IC tags to managed items to enable outgoing, returning, and inventory management using RFID. - Ensure accurate recording of outgoing and returning history and enable efficient inventory management using handheld devices.

• IC tag reader/writer

We are releasing the UHF version of the HF shelf antenna, which has a sales record of over 2,000 units!

This is a shelf antenna system operating in the UHF band (920MHz). It allows for bulk reading of books and equipment located on shelves. By placing items with RF tags on the shelf antenna, it can be utilized for location management, inventory tracking, and recording check-out and return histories. *UHF band RFID: Frequency 920MHz, International standard ISO/IEC18000-63, compliant with GS1 EPCglobal Gen2. Features: 1. Compliant with UHF band RFID ISO/IEC 18000-63 and GS1 EPCglobal Gen2. 2. Type of specific low-power radio station that does not require a license application (*output below 250mW). 3. One reader/writer can control up to 8 shelf antennas. 4. Location management for each shelf is possible. 5. Reduces the spread of radio waves around the antenna to prevent misreads. 6. Installation on metal shelves is also acceptable. 7. Middleware for constant monitoring is available (sold separately). (*Direct control from the upper system without using middleware is also possible). 8. The middleware includes a dashboard function bundled as a sample application.

• IC tag reader/writer

Easily achieve constant monitoring with RFID! It enables real-time understanding of the inventory status and movement of managed items.

This is middleware for easily implementing a "constant monitoring RFID system" that automatically acquires the inventory and movement status of managed items. ■ Advanced Event Processing It processes the read IC tag data and organizes the necessary "inventory information" and "movement information" for constant monitoring into a database. ■ Easy Data Utilization The collected information is stored in a database, allowing users to easily access the necessary information whenever needed. (Database: PostgreSQL) ■ Centralized Management of Reader/Writers It supports multiple readers and multiple antennas, allowing for centralized management of various settings related to the reader/writer. The configuration of the readers and reading settings can also be easily adjusted from the screen.

• IC tag reader/writer

Real-time understanding of changes in project status! From now on, simply placing it will complete the input of achievements.

We introduce the "RFID Utilization Process Progress and Achievement Collection System," which automatically collects achievement information simply by placing or removing various cards on terminals set up in the workspace. Up to 20 cards can be stacked and read simultaneously, and when leaving the workspace, you only need to remove the cards. This allows for real-time understanding of changes in process status. Additionally, the RFID reader/writer with an LCD touch panel suitable for IoT edge devices operates in a standalone mode, eliminating the need for a PC installation. It uses a web server function to directly control the reader/writer from a browser. 【Features】 ■ Up to 20 cards can be stacked and read simultaneously ■ Only need to remove the cards when leaving the workspace ■ Flexible usage - Convenient tray type or slim stand type that takes up little space - The terminal's LCD screen can display errors and allow for direct input of achievements *For more details, please refer to the PDF document or feel free to contact us.

• IC tag reader/writer

Reader/writer with touch panel that does not require a PC.

【Features】 　Built-in antenna 　LCD display with 2.8 inches (320×240d) touch functionality 　Standalone operation, no PC installation required 　Customizable touch panel display functionality 　Direct control of the reader/writer from a browser using web server functionality 　Supports MQTT as well

• IC tag reader/writer

Data read by the RFID reader/writer can be directly input into spreadsheet software. It is possible to replace barcodes with RFID without software development.

Features - RFID can be implemented without software development. - Reading data from RFID tags can be input into the ledger currently in use for business operations, such as spreadsheet software or notepad software. - It is also possible to add fixed characters before and after the reading data, such as a "timestamp" for the reading time, "Enter key" for line breaks, "TAB key" for cell movement, and comma separation. - It is possible to set the timing for starting the reading and the prohibited time for double reading. It also supports EPC code encoding methods. *Only for UHF band RFID readers/writers. *Supports encoding methods for SGTIN-96, GRAI-96, and SSCC-96.

• IC tag

We will be holding the second webinar on aluminum foil, which received great acclaim last time. This is an opportunity to deepen your knowledge about aluminum foil, so please join us. 【Webinar Details】 Content: Introduction to the Manufacturing Methods and Functional Aluminum Foils vol.2 Date: February 20 (Friday) Time: 15:00 - 16:00 Participation Fee: Free How to Participate: A Zoom viewing URL will be sent to those who register by the day before. Capacity: 100 people 【Recommended for the Following Individuals】 - Those who have challenges related to metal foils or resin films - Those interested in joint research with foil manufacturers or new business development - Those interested in functional aluminum foils with high smoothness, high corrosion resistance, high strength, and luxurious designs ▼ Register here (Microsoft Forms) https://forms.cloud.microsoft/r/UA5g4N2fGU (dummy) ▼ If you have any further questions, please contact us at the email address below. foil-marketing@toyal.co.jp

This is a seminar introducing the new features of the latest version, Ver. 30, of the general-purpose 2D CAD system "EASYDRAW." Customers currently using EASYDRAW can achieve further efficiency and utilize convenient features by taking advantage of the new functionalities, so we encourage you to consider attending this seminar.

In aerospace, automotive, and other fields, rapid advancements in material development and manufacturing technology are being made to achieve further weight reduction aimed at improving fuel efficiency and reducing carbon dioxide emissions. This seminar will provide an easy-to-understand explanation for beginners about the trends in new material development at advanced companies that are energetically working towards ultra-lightweight solutions using lightweight materials such as carbon fiber, aluminum, and ceramics, as well as various additive manufacturing (AM) and manufacturing technologies and product case studies utilizing these materials through complex shape integration, lattice/honeycomb structure fabrication, porous structure fabrication, and topology optimization with 3D printers, which are impossible with conventional processing methods and technologies. The lightweighting of parts that can significantly differentiate from conventional and competitor parts is an urgent and critical issue, and intense technological development competition is unfolding both domestically and internationally. 3D printers, which are seen as the next-generation manufacturing method, offer a completely new perspective on AM technology, enabling the creation of innovative and attractive lightweight parts that are difficult to achieve with existing processing methods and technologies, as well as realizing short-term, low-cost, and high-quality manufacturing. Development cannot be expected to progress along the lines of existing technologies. By merging lightweight materials with 3D printing and utilizing topology optimization, astonishing weight reduction of parts can be achieved. We encourage you to take on this challenge.

At the beginning of this seminar, we will focus on the research and development related to ceramics 3D additive manufacturing that the National Institute of Advanced Industrial Science and Technology has been working on. We will discuss 3D additive manufacturing, powder preparation for manufacturing, debinding and sintering processes, as well as case studies of ceramics 3D additive manufacturing centered on alumina and reaction-sintered silicon carbide. Next, we will introduce Canon's latest developments in high-performance ceramic materials that significantly reduce "shrinkage" during sintering, which excel in selective laser melting (SLM) for 3D printers. We will also cover the characteristics of parts that can be manufactured using this method, layering technology, target fields, contract manufacturing services, and collaboration with Metal Research Institute, which has started high-precision semi-conductor part manufacturing services using metal 3D printers with these materials. After that, we will have advanced explanations from instructors of Shin-Toh V-Ceramics and As One about the development trends of various ceramics 3D printers from world-leading companies 3DCeram Sinto and Lithoz. We will discuss the latest additive manufacturing technologies that enable the creation of innovative parts, rapid part development, prototyping, and manufacturing, significant reductions in the number of parts, lightweight miniaturization, and reductions in manufacturing processes and workforce through the production of complex shapes, hollow and porous structures, and lattice structures that were previously impossible.

The complex shape manufacturing, integrated manufacturing, lattice/honeycomb structure manufacturing, porous structure manufacturing, hybrid structure manufacturing, direct manufacturing from 3D data, as well as topology optimization and collaboration with generative design, which were difficult with conventional processing methods and technologies, can lead to the creation of innovative aluminum parts that are not found in traditional or other companies. This includes rapid development, prototyping, and manufacturing of parts, dramatic reductions in the number of parts, ultra-lightweight and compact designs, and significant reductions in manufacturing time, costs, processes, and workforce. In this seminar, pioneering users such as J·3D, ODEC, and the pioneers of white copper, who are utilizing metal 3D printers to rapidly develop, prototype, and manufacture complex aluminum parts, will specifically explain the key points and precautions for introduction and utilization, various manufacturing methods and technologies, unique next-generation AM technologies developed in-house, and groundbreaking case studies that significantly differentiate their parts from those of other companies, sharing both success and failure stories. With the remarkable advancements in metal AM technology, the use of metal 3D printers for aluminum parts manufacturing will become commonplace in a few years. The secrets to success will be discussed by instructors with numerous research achievements and extensive manufacturing experience, providing clear and concrete lectures for those considering implementation, beginners with interest, and those who are new to the field.