We will be exhibiting at SEMICON JAPAN 2023.

It is the process of forming UBM. It can improve the connection reliability between the aluminum electrode and the package terminal.

UBM stands for Under Bump Metal or Under Barrier Metal, and it is a film formed to join aluminum electrode pads on semiconductor chips with package terminals through wire bonding, soldering, or silver sintering. This film is composed of materials such as electroless nickel/gold plating or electroless nickel/palladium/gold plating. We offer a wide range of products that support the evolution of semiconductors and electronics, so please feel free to consult with us.

• Chemicals

Okuno Pharmaceutical Industry, a top-class company in surface treatment and plating chemicals, offers surface treatment chemicals and process technologies for wafers and package substrates!

■Exhibiting at SEMICON JAPAN 2023■ Okuno Pharmaceutical Industry will be exhibiting at SEMICON JAPAN 2023, which will be held at Tokyo Big Sight from December 13 (Wednesday) to December 15 (Friday), 2023. We will showcase a variety of new products, including plating technologies for wafers and semiconductor package substrates, as well as plating processes for power modules that contribute to device connection reliability. Please visit our booth at Tokyo Big Sight, East Hall 1, [1131]. Latest information about the exhibition and more can be found on our company website. Please check the related links. All of our employees look forward to your visit. *For more details, please download the PDF or contact us directly.

• Surface treatment contract service
• Other contract services

FOWLP, FOPLP, and next-generation semiconductor package substrates, as well as ultra-fine wiring copper sulfate plating additives - TORYZA LCN FRV.

In recent years, semiconductor packaging technology has gained attention with FOWLP and FOPLP, which allow for an increase in the number of terminals relative to chip area by forming a redistribution layer on the wafer and expanding the terminals to the outside of the chip (Fan Out), in contrast to the conventional FC-BGA that is disadvantageous for thinness and cost reduction. Our company has developed a new copper sulfate plating additive for the formation of the redistribution layer in FOWLP and FOPLP. This product excels in film thickness uniformity and rectangularity of pattern shape, and it also accommodates filling of small-diameter vias. Additionally, to support the increase in the number of terminals on the chip side, the formation of ultra-fine wiring layers on the build-up layer of conventional FC-BGA is also being considered. This product is optimal for the formation of ultra-fine wiring in next-generation semiconductor package substrates.

• Chemicals

Supports high aspect ratio filling, copper sulfate plating additive for silicon interposers - TORYZA LCN SV.

With the advancement of semiconductor performance and functionality, packaging technologies related to chiplets that implement multiple chips with different functions on a single substrate and three-dimensional integration are gaining attention. Among these, silicon interposers with wiring formed on silicon are attracting interest because they can miniaturize the length and width of the wiring, thereby enhancing the transmission capability of high-frequency signals. Our company has developed TORYZA LCN SV as an additive for silicon interposers that supports high aspect ratio filling. TORYZA LCN SV excels in embedability into TSVs, achieving void-free and low film thickness high aspect ratio filling.

• Chemicals

Copper sulfate plating additive for semiconductor wafers, high heat dissipation and high current applications - TORYZA LCN SD.

Smartphones are widely used not only for calls but also for content viewing such as music and videos, online shopping, and in industries like automobiles, smart home appliances, and robotics. Mobile communication devices like cell phones and tablets have undergone significant evolution approximately every 10 years, with their maximum communication speeds increasing by about 1,000,000 times over the past 30 years. Additionally, semiconductors used in servers and high-performance computers are required to achieve even higher performance and multifunctionality. Our company has recently developed a new copper sulfate plating additive, TORYZA LCN SD, which is optimal for low aspect ratio via filling. TORYZA LCN SD can be widely applied to microbumps that join semiconductor chips and build-up wiring boards, as well as thermal vias used for heat dissipation in trench wiring on wafers and power semiconductors.

• Chemicals

TORYZA LCN SP, the optimal electroplating solution for forming copper pillars on semiconductor wafers and package substrates.

Solder balls have been widely used in semiconductor packaging. However, due to the increase in pin count (the number of terminals on the substrate), the increase in the number of chips being packaged, and the reduction in bonding area, solder bumps with a diameter of about 100µm are becoming insufficient for high-density packaging. As an alternative, attention is being drawn to a method that involves forming a redistribution layer (RDL) on the semiconductor and using copper pillars for bonding. Our company has developed the optimal additive for copper pillars, TORYZA LCN SP. TORYZA LCN SP can also be used to form ultra-fine electrodes on the build-up layer of the package substrate.

• Chemicals

We will introduce the implementation results of the sensor technology developed by the Hotron Group, which has been cultivated over more than half a century, through customer case studies. In addition to automatic door sensors, we also offer a wide range of vehicle detection sensors and nursing/care sensors. Many implementation examples are also presented, so please take a look at the case study page.

Parking space management refers to the real-time display of parking availability and the management of efficient use of parking spaces. By utilizing Hotron's sensors, drivers can quickly discover available parking spaces, enabling efficient parking lot operations. For large parking lots, we recommend the "Floor Management Method" and "Block Management Method," which focus on cost reduction. Sensors are installed at regular intervals to count and manage the number of passing vehicles. This method offers the advantages of easy installation and low costs. 【Target Products】 - Vehicle Count Sensor CCS2 - Ultrasonic Sensor HM-UX2/UW2 For smaller facilities, we recommend the "Parking Space Management Method," where sensors are installed in each parking space to display availability with high accuracy. By providing reliable occupancy information, this method helps reduce unnecessary entry of new vehicles and ensures safe parking lot operations. 【Target Products】 - Occupancy Detection Sensor HM-UX2/UW2 - Occupancy/Pass Detection Sensor HM-LC6 - Occupancy Detection Sensor HM-LC7/LC7-FLS - Occupancy/Pass Detection Sensor HM-S6 - Occupancy Detection Sensor HM-S8

To everyone who wants to develop new chocolate products without worrying about the soaring cocoa prices. Cluster products that enhance texture, aroma, and appearance while reducing the amount of chocolate used, adding value to the products. We offer three types of cluster manufacturing equipment that can be selected according to your application and goals. We can propose the most suitable equipment based on your objectives. 1) K&S / GFT | One-bite snack & cereal bar molding machine 2) Trkino / Nuts-i | High-end depositor that can deposit ingredients like nuts together 3) Wolf / PORTIOMAT – CLUSTER FORMING | Cluster former equipped with innovative technology

Los Angeles (California, USA) / Paris (France), May 4, 2026 - (JCN Newswire) - Pacific Avenue Capital Partners, a global private equity firm focused on corporate carve-outs and other complex transactions in the mid-market, announced today that its affiliate has entered into exclusive negotiations to acquire ESE World (hereinafter "ESE") from Amcor, one of the world's leading packaging companies. With the support of Pacific Avenue, ESE will focus on responding to customer needs while implementing multiple growth initiatives related to operational improvements, regional expansion, and strategic add-on acquisitions. Pacific Avenue plans to work closely with ESE's existing management team to drive these initiatives and accelerate the company's next phase of growth.

Fukuda Co., Ltd. has been pursuing leak detection for 60 years and is committed to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing properties. We will propose the appropriate testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)