Exhibiting with the theme of OKUNO's surface treatment technology contributing to the development of the semiconductor field.
Okuno Pharmaceutical Industry, a top-class company in surface treatment and plating chemicals, offers surface treatment chemicals and process technologies for wafers and package substrates!
■Exhibiting at SEMICON JAPAN 2023■ Okuno Pharmaceutical Industry will be exhibiting at SEMICON JAPAN 2023, which will be held at Tokyo Big Sight from December 13 (Wednesday) to December 15 (Friday), 2023. We will showcase a variety of new products, including plating technologies for wafers and semiconductor package substrates, as well as plating processes for power modules that contribute to device connection reliability. Please visit our booth at Tokyo Big Sight, East Hall 1, [1131]. Latest information about the exhibition and more can be found on our company website. Please check the related links. All of our employees look forward to your visit. *For more details, please download the PDF or contact us directly.
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■Introducing Our Latest Products for Wafer and Package Substrates■ To help you learn more about us, we would like to introduce our latest products for wafers and semiconductor package substrates. If you have any questions about surface treatment, please feel free to consult with us. Copper Sulfate Plating Additive for TSV Filling - TORYZA LCN SV https://premium.ipros.jp/okuno/product/detail/2001038746/ Copper Sulfate Plating Additive for Copper Pillar Formation - TORYZA LCN SP https://premium.ipros.jp/okuno/product/detail/2000810072/ Copper Sulfate Plating Additive for Low Aspect Ratio Via and Trench Filling - TORYZA LCN SD https://premium.ipros.jp/okuno/product/detail/2000810075/ Copper Sulfate Plating Additive with Excellent In-Plane Uniformity, Suitable for Rewiring Layer Formation - TORYZA LCN FRV https://premium.ipros.jp/okuno/product/detail/2001037113/
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Our company is a research and development-oriented enterprise that supports global manufacturing through science in the fields of surface treatment, inorganic materials, and food. 【Surface Treatment Division】 - We launched a new brand of surface treatment chemicals for semiconductor back-end processes called "TORYZA," offering various plating chemicals and equipment such as copper plating additives for ultra-fine wiring and electroless plating processes for UBM formation. - We propose surface treatment chemicals for plastic plating that provide high added value, such as beautiful metallic appearance, luxury feel, and antibacterial and antiviral properties. - We offer process chemicals for anodizing and dyeing aluminum alloys that beautifully enhance the appearance of casings for smartphones and other devices. We also have environmentally friendly processes and surface treatment chemicals for antibacterial and antiviral applications in our lineup. - We provide electroless nickel plating chemicals and various environmentally friendly products, including low-temperature and long-life types, that impart new functions to materials, such as corrosion resistance, wear resistance, and lubricity. 【Inorganic Materials Division】 Total production from design, processing, to mass production of glass. Contributing to the enhancement of design and functionality with high-quality glass materials. 【Food Division】 Bringing "deliciousness" and "safety" to the dining table. Challenging the development of high-function products composed of food ingredients.