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  1. Home
  2. Industrial Machinery
  3. 名菱テクニカ 三菱電機グループ
  4. Improving Productivity? Invitation to the PCB Manufacturing Equipment Webinar
SEMINAR_EVENT
  • Dec 28, 2023
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Dec 28, 2023

Improving Productivity? Invitation to the PCB Manufacturing Equipment Webinar

名菱テクニカ 名菱テクニカ 三菱電機グループ
【January WEB Seminar (Duration: 30 minutes)】 You can easily participate for free in this WEB seminar using ZOOM! In January, we will hold the following two courses. [Course 1] A turntable-type substrate splitting machine that allows parallel operation with external setup, enabling productivity improvement without increasing the number of operators, along with teaching methods. [Course 2] A substrate marking device that does not require an external flipping device due to its built-in flipping mechanism, saving space and allowing for double-sided printing, along with tips on 2D codes and QR codes. ----▼ Click here to apply ▼--------------------------------------------- By clicking the "Details & Application" button below, you can check the details and apply! ------------------------------------------------------------------------
Date and time Wednesday, Jan 31, 2024
01:00 PM ~ 03:00 PM
If the schedule does not work for you, we will hold individual seminars, so please feel free to contact us.
Capital
Entry fee Free
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(社外秘)基板分割機.png

Supports automation! Achieves high productivity with the 'turntable-type circuit board separator'.

Improvement of productivity through parallel setup in the printed circuit board division process, also accommodating inline production processes!

By being able to prepare the next workpiece in parallel during substrate processing, we can eliminate waiting time during substrate exchanges. Additionally, by shortening the cycle time, productivity can be improved without increasing the number of operators. The entire process of supplying printed circuit boards, cutting the substrates, and palletizing the cut substrates onto discharge trays can also be automated. (Substrate cutting machine + robot transport system) 【Features】 ■ Equipped with a dual-table automatic turn system that allows for parallel setup ■ Adaptable to general inline specifications through the use of robots ■ Reduction of cutting time through Z-axis height settings for each router location ■ Improved operating rate by monitoring the usage distance of bits and automatically replacing them ■ Built-in dust collector for compact device size *For more details, please download the PDF or contact us. ★ For those interested in the single type, click here▽ https://mono.ipros.com/product/detail/2000569194 ★ Free seminar here▽ http://www.mtco-web.co.jp/products/web_seminar.html

  • Printed Circuit Board
  • Other processing machines
  • Circuit board processing machine

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(社外秘)MR2535H2T-IN.png

Automation of factory production leads to labor saving! Circuit board separator "Robot Transport System"

【Monthly Web Seminars Now Held!】Automating the processes from PCB supply to PCB cutting, palletizing onto output trays, and PCB discharge!

The "PCB Cutting Machine Robot Transport System" can accommodate inline PCB cutting by connecting with the preceding and following processes. Additionally, it can handle batch processing by consisting of a magazine for loading PCBs and a magazine for storing the cut PCBs in trays. With the turntable PCB cutting machine (MR2535H2T) and a robot with a traveling axis, it contributes to reducing takt time, while also expanding the flexibility of the line layout and tray packing of printed circuit boards after cutting, thereby aiding in the automation and labor-saving of factory production. 【Features】 - The line configuration can flexibly adapt to factory layouts, including straight, U-shaped, and L-shaped arrangements. - The multi-joint robot allows for the discharge of cut PCBs, enabling the setting of PCB placement positions in the discharge tray, which is effective for PCB positioning in the next automation process. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Other processing machines
  • Circuit board processing machine

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基板分割機.jpg

Router-type circuit board separator "MR2535H2"

Standalone type with high rigidity and quality, equipped with e-F@ctory utilization error prevention features, automatic router bit exchange, and image teaching capabilities.

The "MR2535H2" is a device that divides multiple small and complex-shaped circuit boards using a router method. It can cut printed circuit boards with low stress, thereby reducing the risk of damage to mounted components (such as multilayer ceramic capacitors) caused by stress in traditional hand-breaking or pressing methods. By utilizing automation and IT technologies cultivated at Mitsubishi Electric's Nagoya Works for equipment design and manufacturing, it supports improvements in factory productivity and quality. 【Features】 ■ Cuts unnecessary parts of complex-shaped printed circuit boards after mounting using a router bit ■ Improves setup efficiency by widening the opening width of the device's access door ■ Achieves space-saving by incorporating a dust collector within the device's lower section ■ Significantly enhances productivity by increasing the movement speed of the X-Y axis (three times faster than our conventional models) ■ Allows for setting the Z-axis position for each cutting point, enabling shorter takt times ■ Supports image teaching functions for setting cutting points on various types of circuit boards *For more details, please download the PDF or contact us.

  • Circuit board processing machine

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インライン基板分割機.jpg

Inline-compatible router-type circuit board splitter

Inline model that automates the printed circuit board cutting process.

Automatically cuts various printed circuit boards in-line on the manufacturing line. It eliminates the need to always have an operator at the board cutting machine, achieving labor savings. 【Features】 ■ Monitors the usage distance of the bit and automatically replaces it to improve operational efficiency. ■ Waste boards are automatically collected into a waste board box located at the bottom of the device. ■ Selecting a twin spindle enables simultaneous cutting, achieving high productivity. *For more details, please download the PDF or contact us.

  • Printed Circuit Board
  • Other processing machines
  • Circuit board processing machine

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基板マーキング装置.jpg

Laser marking device

High-quality fine printing is possible! Laser marking device for substrates compatible with a wide range of materials.

The substrate marking device is a laser-based substrate marking machine capable of directly marking serial numbers, origin, and two-dimensional codes or characters for process management using a laser marker. In addition to being equipped with a variety of functions, it also offers a range of options that enable integration with traceability systems. 【Features】 ■ High-speed marking of fine characters, 2D codes, and shapes at any position on printed circuit boards ■ More stable print quality compared to stamping methods ■ In the case of fiber lasers, it can accommodate a variety of materials such as metals and ceramics, allowing for higher precision printing compared to CO2 lasers ■ Creation of flexible printing programs in parallel with production at a workstation away from the PCB manufacturing line using Excel * Fiber lasers do not require permission applications as they are not subject to high-frequency utilization equipment regulations, making them easier to implement compared to conventional machines. * Microsoft and Excel are registered trademarks or trademarks of Microsoft Corporation in the United States and other countries. * For more details, please download the PDF or contact us.

  • Marking machine
  • Laser marker
  • Other markings

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Related catalog(4)

Turntable Circuit Board Splitter "MR2535H2T"

Turntable Circuit Board Splitter "MR2535H2T"

PRODUCT
  • E-book viewing
  • Catalog download

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Inline compatible router-type board splitter

Inline compatible router-type board splitter

PRODUCT
  • E-book viewing
  • Catalog download

Contact this catalog

Router-type circuit board cutting machine 'MR2535H2'

Router-type circuit board cutting machine 'MR2535H2'

PRODUCT
  • E-book viewing
  • Catalog download

Contact this catalog

Laser-based substrate marking devices 'ML-PM20F3' and 'ML-PM30C3'

Laser-based substrate marking devices 'ML-PM20F3' and 'ML-PM30C3'

PRODUCT
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  • Catalog download

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[Notice of Exhibition Participation by Fukuda Co., Ltd.] 2025 YOKOHAMA Automotive Technology Exhibition

[Notice of Exhibition Participation by Fukuda Co., Ltd.] 2025 YOKOHAMA Automotive Technology Exhibition

  • NEW
  • SEMINAR_EVENT

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely invite you to visit us during this busy time. 【 Exhibition Name 】 Automotive Technology Exhibition 2025 YOKOHAMA https://aee.expo-info.jsae.or.jp/ja/yokohama/ (An "online exhibition" will also be held during and around the event period) 【 Dates 】 May 21 (Wednesday) - 23 (Friday), 2024 10:00 AM - 6:00 PM *On the final day, 9:00 AM - 4:00 PM (Online exhibition: May 14 (Wednesday) - June 4 (Wednesday)) 【 Venue 】 Pacifico Yokohama (1-1-1 Minatomirai, Nishi-ku, Yokohama, Kanagawa Prefecture) Our booth number: "Concourse 505"

Mar 24, 2026

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[Notice of Exhibition Participation by Fukuda Co., Ltd.] 27th Interphex Week Tokyo

  • NEW
  • SEMINAR_EVENT

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to attend this event. 【 Exhibition Name 】 27th INTERPHEX Week Tokyo https://www.interphex.jp/tokyo/ja-jp.html 【 Dates 】 July 9 (Wednesday) - 11 (Friday), 2025 10:00 AM - 5:00 PM 【 Venue 】 Tokyo Big Sight (3-11-1 Ariake, Koto-ku, Tokyo 135-0063)

Mar 24, 2026

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[Seminar] Key Points of the Simultaneous Market and Outlook for the Power Business

  • NEW
  • SEMINAR_EVENT

[Lecturer] Taku Ito, Partner, Mori Hamada & Matsumoto Foreign Law Joint Enterprise Yoshifumi Nagakubo, Senior Associate [Key Lecture Content] As we move towards a carbon-neutral society, the large-scale introduction of renewable energy sources is progressing, making the enhancement of market design that balances stable electricity supply and economic efficiency an urgent issue. In this context, the "simultaneous market," which integrates the trading of electricity (kWh) and adjustment capacity (ΔkW), is being discussed as a core component of future electricity systems, and serious considerations for its implementation are underway. In this lecture, a lawyer who has led discussions at the forefront of national system design will explain in an easy-to-understand manner the background and necessity of the simultaneous market, as well as the overall picture of its complex mechanisms, based on practical experience. Furthermore, the lecture will clearly outline the latest developments in current discussions, realistic challenges for implementation, and prospects for future electricity business in Japan, incorporating perspectives and insights as a system designer and practitioner.

Mar 24, 2026

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[Seminar] How to Use Heat Dissipation Devices and Basics of Thermal Design

  • NEW
  • SEMINAR_EVENT

[Instructor] Hirokazu Shibata, President and CEO of ZAZU Design Co., Ltd. [Key Lecture Content] As the importance of heat dissipation design increases in daily operations, it is necessary to study a range of books on thermal engineering to learn the overall picture of heat dissipation design. However, books on thermal engineering typically start with the basics of heat transfer and cover topics such as temperature boundary layers and dimensionless numbers related to heat transfer, making it quite difficult for beginners to grasp the overall picture in a short period. This seminar is aimed at engineers who will begin thermal design in the future, focusing on various heat dissipation devices as specific subjects. The goal is to understand the basics of thermal design while learning about the characteristics and usage of these heat dissipation devices. After attending this seminar, participants are expected to acquire knowledge equivalent to that gained from studying a range of thermal engineering books. [Lecture Topics] 1. Current Status and Challenges of Thermal Design 2. How "Thermal Resistance" Determines Heat Dissipation Pathways 3. Fundamental Laws Governing Heat Transfer 4. Air Cooling through Heat Transfer 5. Heat Diffusion through Thermal Conduction 6. Heat Transfer via Two-Phase Flow of Gas and Liquid 7. Q&A Session

Mar 24, 2026

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[Seminar] Elevating AI-Driven Development to the "Management Agenda"

  • NEW
  • SEMINAR_EVENT

[Lecturers] Accenture Ltd. Business Consulting Division Strategy Group, Technology Strategy Senior Manager Mamoru Yoneshige Accenture Ltd. Technology Consulting Division CDAI Consulting Principal Director Hiromichi Sugiyama [Key Lecture Content] While system development using AI agents is gaining attention, the challenges of AI-driven development in brownfield projects for enterprises with existing assets and technical debt are significantly greater. The introduction of coding support tools alone does not lead to company-wide transformation, and there exists a structural gap between the success of Proof of Concept (PoC) and the success of company-wide deployment. In this lecture, based on practical insights from Accenture's comprehensive support from strategy formulation to implementation, we will systematically explain the essentials for successful company-wide deployment, including the six principles of AI-driven development, categorization of brownfield types and deployment strategies, context engineering, the systematization of methodologies such as harness engineering and specification-driven approaches, promotion systems and in-house production strategies, and KPI design as a management agenda.

Mar 24, 2026

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