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  1. Home
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  3. 名菱テクニカ 三菱電機グループ
  4. Improving Productivity? Invitation to the PCB Manufacturing Equipment Webinar
SEMINAR_EVENT
  • Dec 28, 2023
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Dec 28, 2023

Improving Productivity? Invitation to the PCB Manufacturing Equipment Webinar

名菱テクニカ 名菱テクニカ 三菱電機グループ
【January WEB Seminar (Duration: 30 minutes)】 You can easily participate for free in this WEB seminar using ZOOM! In January, we will hold the following two courses. [Course 1] A turntable-type substrate splitting machine that allows parallel operation with external setup, enabling productivity improvement without increasing the number of operators, along with teaching methods. [Course 2] A substrate marking device that does not require an external flipping device due to its built-in flipping mechanism, saving space and allowing for double-sided printing, along with tips on 2D codes and QR codes. ----▼ Click here to apply ▼--------------------------------------------- By clicking the "Details & Application" button below, you can check the details and apply! ------------------------------------------------------------------------
Date and time Wednesday, Jan 31, 2024
01:00 PM ~ 03:00 PM
If the schedule does not work for you, we will hold individual seminars, so please feel free to contact us.
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Entry fee Free
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Related product

(社外秘)基板分割機.png

Supports automation! Achieves high productivity with the 'turntable-type circuit board separator'.

Improvement of productivity through parallel setup in the printed circuit board division process, also accommodating inline production processes!

By being able to prepare the next workpiece in parallel during substrate processing, we can eliminate waiting time during substrate exchanges. Additionally, by shortening the cycle time, productivity can be improved without increasing the number of operators. The entire process of supplying printed circuit boards, cutting the substrates, and palletizing the cut substrates onto discharge trays can also be automated. (Substrate cutting machine + robot transport system) 【Features】 ■ Equipped with a dual-table automatic turn system that allows for parallel setup ■ Adaptable to general inline specifications through the use of robots ■ Reduction of cutting time through Z-axis height settings for each router location ■ Improved operating rate by monitoring the usage distance of bits and automatically replacing them ■ Built-in dust collector for compact device size *For more details, please download the PDF or contact us. ★ For those interested in the single type, click here▽ https://mono.ipros.com/product/detail/2000569194 ★ Free seminar here▽ http://www.mtco-web.co.jp/products/web_seminar.html

  • Circuit board processing machine

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(社外秘)MR2535H2T-IN.png

Automation of factory production leads to labor saving! Circuit board separator "Robot Transport System"

【Monthly Web Seminars Now Held!】Automating the processes from PCB supply to PCB cutting, palletizing onto output trays, and PCB discharge!

The "PCB Cutting Machine Robot Transport System" can accommodate inline PCB cutting by connecting with the preceding and following processes. Additionally, it can handle batch processing by consisting of a magazine for loading PCBs and a magazine for storing the cut PCBs in trays. With the turntable PCB cutting machine (MR2535H2T) and a robot with a traveling axis, it contributes to reducing takt time, while also expanding the flexibility of the line layout and tray packing of printed circuit boards after cutting, thereby aiding in the automation and labor-saving of factory production. 【Features】 - The line configuration can flexibly adapt to factory layouts, including straight, U-shaped, and L-shaped arrangements. - The multi-joint robot allows for the discharge of cut PCBs, enabling the setting of PCB placement positions in the discharge tray, which is effective for PCB positioning in the next automation process. *For more details, please refer to the PDF document or feel free to contact us.

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基板分割機.jpg

Router-type circuit board separator "MR2535H2"

Standalone type with high rigidity and quality, equipped with e-F@ctory utilization error prevention features, automatic router bit exchange, and image teaching capabilities.

The "MR2535H2" is a device that divides multiple small and complex-shaped circuit boards using a router method. It can cut printed circuit boards with low stress, thereby reducing the risk of damage to mounted components (such as multilayer ceramic capacitors) caused by stress in traditional hand-breaking or pressing methods. By utilizing automation and IT technologies cultivated at Mitsubishi Electric's Nagoya Works for equipment design and manufacturing, it supports improvements in factory productivity and quality. 【Features】 ■ Cuts unnecessary parts of complex-shaped printed circuit boards after mounting using a router bit ■ Improves setup efficiency by widening the opening width of the device's access door ■ Achieves space-saving by incorporating a dust collector within the device's lower section ■ Significantly enhances productivity by increasing the movement speed of the X-Y axis (three times faster than our conventional models) ■ Allows for setting the Z-axis position for each cutting point, enabling shorter takt times ■ Supports image teaching functions for setting cutting points on various types of circuit boards *For more details, please download the PDF or contact us.

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インライン基板分割機.jpg

Inline-compatible router-type circuit board splitter

Inline model that automates the printed circuit board cutting process.

Automatically cuts various printed circuit boards in-line on the manufacturing line. It eliminates the need to always have an operator at the board cutting machine, achieving labor savings. 【Features】 ■ Monitors the usage distance of the bit and automatically replaces it to improve operational efficiency. ■ Waste boards are automatically collected into a waste board box located at the bottom of the device. ■ Selecting a twin spindle enables simultaneous cutting, achieving high productivity. *For more details, please download the PDF or contact us.

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基板マーキング装置.jpg

Laser marking device

High-quality fine printing is possible! Laser marking device for substrates compatible with a wide range of materials.

The substrate marking device is a laser-based substrate marking machine capable of directly marking serial numbers, origin, and two-dimensional codes or characters for process management using a laser marker. In addition to being equipped with a variety of functions, it also offers a range of options that enable integration with traceability systems. 【Features】 ■ High-speed marking of fine characters, 2D codes, and shapes at any position on printed circuit boards ■ More stable print quality compared to stamping methods ■ In the case of fiber lasers, it can accommodate a variety of materials such as metals and ceramics, allowing for higher precision printing compared to CO2 lasers ■ Creation of flexible printing programs in parallel with production at a workstation away from the PCB manufacturing line using Excel * Fiber lasers do not require permission applications as they are not subject to high-frequency utilization equipment regulations, making them easier to implement compared to conventional machines. * Microsoft and Excel are registered trademarks or trademarks of Microsoft Corporation in the United States and other countries. * For more details, please download the PDF or contact us.

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Related catalog(4)

Turntable Circuit Board Splitter "MR2535H2T"

Turntable Circuit Board Splitter "MR2535H2T"

PRODUCT
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Inline compatible router-type board splitter

Inline compatible router-type board splitter

PRODUCT
  • E-book viewing
  • Catalog download

Contact this catalog

Router-type circuit board cutting machine 'MR2535H2'

Router-type circuit board cutting machine 'MR2535H2'

PRODUCT
  • E-book viewing
  • Catalog download

Contact this catalog

Laser-based substrate marking devices 'ML-PM20F3' and 'ML-PM30C3'

Laser-based substrate marking devices 'ML-PM20F3' and 'ML-PM30C3'

PRODUCT
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We will exhibit at POWTEX Powder Technology Exhibition Osaka 2025.

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Our company will be exhibiting at "POWTEX Powder Technology Exhibition Osaka 2025" held at Intex Osaka. During the event, we will showcase various products. We invite all related parties to come and visit us. 【Suppliers】 ・Hielscher

Sep 15, 2025

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We will exhibit at the Powder Industry Exhibition Osaka 2025.

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Our company will be exhibiting at the "Powder Technology Exhibition Osaka 2025" held at Intex Osaka. During the event, we will showcase various products. We invite all related parties to come and visit us. 【Suppliers】 ・Hielscher

Sep 15, 2025

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We will exhibit at the 12th Annual Meeting of the Japanese Society for Extracellular Vesicles.

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Our company will be exhibiting at the "12th Annual Meeting of the Japanese Society for Extracellular Vesicles" to be held at the Senri Life Science Center. We will be showcasing various products during the event. We invite all relevant parties to come and visit us. 【Suppliers】 - Partical Metrix - Dynamic Biosensors

Sep 14, 2025

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Okayama University Microbial Industry Course Symposium

[10/31 Free, Online Available] 4th Okayama University Donation Course Microbial Industry Course Symposium

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  • SEMINAR_EVENT

Theme: "Bringing Japan's Fermentation Technology to the World - Exploring the Essence of Koji Mold and Solid-State Cultivation, and Considering the Future Opened by Fermentation" [Content] Afternoon (13:00–17:00): Lectures and General Discussion ◆ Keynote Lecture 1: "Expansion of Koji Fermentation Applications Overseas" Takashi Sato, President, SAN-J International, Inc. ◆ Keynote Lecture 2: "Exploring the Diverse Functions Hidden in Koji Mold from a Genomic Perspective - Towards Understanding and Utilizing Solid-State Cultivation" Junichi Maruyama, Professor, Graduate School of Agricultural and Life Sciences, The University of Tokyo ◆ Lecture 1: "Initiatives of the Microbial Industry Course at Okayama University" Takashi Hara, Specially Appointed Assistant Professor, Microbial Industry Course, Okayama University ◆ General Discussion Panelists: Takashi Sato, President, SAN-J International, Inc. Junichi Maruyama, Professor, Graduate School of Agricultural and Life Sciences, The University of Tokyo Sanzaemon Murai, President, Bioc Co., Ltd. Masahiro Kariyama, Executive Director, Fujiwara Technoart Co., Ltd. Katsuya Gomi, Specially Appointed Professor, Graduate School of Agricultural Science, Tohoku University Coordinator: Hiroshi Kanzaki, Professor, Microbial Industry Course, Okayama University

Sep 12, 2025

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[Seminar] Fiscal Year 2025 AI-Related Policy Frontlines

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[Lecture Items] 1. Initiatives on AI Law and Policy Cabinet Office, Office for Science and Technology Innovation, Artificial Intelligence Policy Promotion Office Deputy Director, Shiho Maeda 2. Initiatives by the Ministry of Internal Affairs and Communications for the Development and Utilization of Trustworthy Domestic AI Ministry of Internal Affairs and Communications, International Strategy Bureau, Technology Policy Division, Research Promotion Office, Deputy Director, Wataru Kumahara 3. Initiatives by the Ministry of Education, Culture, Sports, Science and Technology regarding AI for Science Ministry of Education, Culture, Sports, Science and Technology, Research Promotion Bureau, Advisor (Information), Deputy Director, Seiichiro Todoroki 4. Guidelines for AI Businesses Ministry of Economy, Trade and Industry, Commerce and Information Policy Bureau, Information Economy Division, International Coordination Officer for Governance Strategy, Sho Utagawa

Sep 12, 2025

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  • PFAS規制に対応 PFASフリー コーティング剤 ・潤滑性を付与 摩擦低減、耐摩耗性向上 ・離型性を付与 撥水・撥油性、非粘着 など、多様の用途で提案が可能 素材は、金属・プラスチック・ゴムなど問いません!
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