Technical Show Yokohama 2024 from February 7 (Wed) to February 9 (Fri)

Our products are used in industrial magnetrons, analyzers, X-ray devices, catheters, semiconductor manufacturing equipment, electric propulsion systems, air purifiers, sterilization lamps, and more.

Rare metal materials such as tungsten, molybdenum, and tantalum, which possess properties like heat resistance, corrosion resistance, and high strength. These materials are difficult to process, and there are only a few companies that handle them. Our company develops and manufactures "functional components" using these rare metal materials, aiming for further improvements in low work function, long lifespan, and high-performance stabilization. ◆ Achievements - Analysis - Mass spectrometers (electron guns, electron sources) - Semiconductor manufacturing equipment - (ion implantation) - Medical - CT scanners (X-ray sources) (catheters) - Space - Ion engines, Hall thrusters (heaters) - High-temperature furnaces - (reflectors) (heaters) (structural components) and more ◆ Technology - Coating (yttria, alumina, PTFE, etc.) - Material development using heat treatment furnaces with a maximum temperature of 2700°C - High-precision, high-aspect-ratio precision machining - Coils of various shapes - Joining of metals and more

• Other inspection equipment and devices

Metals and ceramics: We will propose the optimal heat treatment tailored to your needs!

Generally, high-temperature heat treatment takes several hours, which can be costly and time-consuming. Gakuseki Electric has been conducting heat treatment of high melting point metals and ceramics, including tungsten. In particular, to quickly and efficiently perform heat treatment for small, low-volume, and diverse products, we have repeatedly conducted various experiments and successfully developed a high-speed high-temperature vacuum furnace capable of reaching approximately 2700°C. With this equipment, ■2500°C for 30 minutes ⇒ The entire process from the start of heating to cooling down is completed in about 2 hours! We have achieved efficiency and cost reduction. Additionally, substances that cannot be completely removed in general furnaces can also be heated and removed. ーーー We also accommodate various high-temperature heat treatments, including multi-atmosphere sintering furnaces and forming gas flushing furnaces. Through these high-temperature heat treatments, it is possible to ultimately prevent the residue and contamination of impurities. With decades of accumulated experience and know-how in heat treatment, please leave the heat treatment of metals to Gakuseki Electric. ーーー

• Processing Contract

From prototyping to mass production of difficult-to-machine materials such as tungsten, molybdenum, and tantalum.

We perform precision machining of difficult-to-cut and difficult-to-process materials such as tungsten, molybdenum, and tantalum. For mass production, we automate the process using feeding machines, while for prototypes ranging from one to a few pieces, we respond quickly with manual operations. In particular, precision machining of small products with tolerances in the micron or millimeter range is our specialty. ◆ Precision machining using NC lathes and other machine tools We utilize NC lathes, MC multi-tasking machines, milling machines, centerless grinders, automatic precision cutting machines, wire-cut and electrical discharge machines, automatic surface grinders, injection molding machines, extrusion molding machines, and presses. ◆ In-house automatic assembly and processing machines We have a wide range of in-house developed fully automatic machines, including fully automatic hot press machines, automatic heater coil assembly machines, and fully automatic electrode assembly machines. Gakuseki Electric often takes on the manufacturing of products that other companies are reluctant or unable to produce. If there are no machines available in the market for manufacturing, we design and build our own processing machines. ◆ Processing - Cutting - Machining - Milling - Cutting - Tapering - Drilling *Sizes, precision, and handled materials are detailed in the "Basic Information" section.

• Contract manufacturing

Contributing to cost reduction with 45 years of technological expertise and original automated equipment.

Tungsten and similar materials have a significant coil back (spring back), but with our years of expertise, we can accommodate various designs and shapes. ◆ We can manufacture a wide variety of coils, from fine wires of a few microns to thick materials. Supported sizes (example): Wire diameter Φ0.01 to 5mm (subject to consultation) ◆ Coiling machine with automatic tension adjustment feature Due to changes in material weight, the back tension differs between the start and end of winding. To produce uniform filaments, a consistent tension must be maintained, and we have our original coiling machine that automatically controls the back tension. ◆ Cost reduction with servo-controlled mandrel-less forming machine For various coil shapes, our NC-type coiling machine allows control simply by inputting design values, making fine adjustments easy. We essentially design all equipment in-house, ranging from fully automatic to semi-automatic machines. ◆ Reliable technological capabilities trusted overseas We have a long history of exporting coils related to lighting and analytical instruments to European and American countries.

• Spring

"I want conductive alumina ceramic!" Background and an overview of the development will be introduced.

This case study collection includes solutions to problems related to tungsten and high melting point metals. We introduce numerous cases such as "I want an alternative to thorium tungsten," "I want tungsten that is easy to process," and "I want conductive alumina ceramic." We also provide background information and an overview of the development for each case. Please take a moment to read through it. [Contents (excerpt)] ■ I want an alternative to thorium tungsten ■ I want tungsten that is easy to process ■ I want conductive alumina ceramic ■ I want tungsten that can discharge even at low energy ■ Ultra-high temperature! Development of a 2800°C vacuum furnace *For more details, please refer to the PDF document or feel free to contact us.

• Technical and Reference Books

We will hold an online seminar as follows. The corporate perspective on the introduction of monitoring systems is changing year by year. We will explain the monitoring systems for machine tools that are currently needed, using various case studies to discuss the changes in the industry environment, what challenges customers perceive, their expectations for monitoring systems, and the effects of their implementation. This seminar will provide insights into specific approaches for your company's introduction of monitoring systems. Date and Time: February 12, 2025 (Thursday) 14:00 - 15:00 Instructor: Monitoring System Representative, ARTIS (MARPOSS Corporation Sales Development Department) Target Audience: - Customers considering the introduction of monitoring systems who want to know the specific process leading to implementation. - Customers interested in what challenges other companies have identified that led to the introduction of monitoring systems. - Customers researching the latest trends in monitoring systems for machine tools. We sincerely look forward to your participation.

A systematic explanation from the basics of semiconductor packaging to the design and evaluation of encapsulation materials. A leading expert thoroughly organizes practical perspectives from WLP/PLP to high thermal conductivity materials. ■ Title: Basic Information on Semiconductor Packaging Technology: Comprehensive Explanation ■ Date and Time: April 10, 2026 (Friday) 10:30 AM - 4:30 PM ■ Target Audience for the Seminar - Individuals involved in semiconductor packaging (sales, technology) - Those interested in semiconductor packaging technology - Those interested in semiconductor resin encapsulation and encapsulation materials ■ Knowledge Gained from the Seminar - Development history of semiconductor packaging (PKG) - Development history of semiconductor packaging technology (methods, materials) - Specifications of semiconductor encapsulation materials (raw materials, composition, manufacturing equipment, evaluation methods, etc.)

■Title: "Fluorine-Free Water and Oil Repellent Treatment Technology Achievable - Guidelines and Examples for Surface Design to Improve Wetting Fundamentals and Liquid Sliding Properties" As PFAS regulations accelerate, surface designs that achieve water and oil repellency without fluorine are gaining attention. This seminar will systematically explain the fundamentals of wetting, dynamic wettability evaluation, design guidelines for improving sliding properties, and the latest examples of fluorine-free surface treatments by leading researchers. ■Date and Time: April 14, 2026 (Tuesday) 13:30 - 16:30 ■Target Audience for the Seminar - Individuals engaged in surface treatment and modification operations - Those involved in research and development related to imparting water and oil repellency, stain resistance, and anti-adhesion properties to various substrate surfaces - Individuals engaged in research and development of fluorine (PFAS) alternative technologies and fluorine-free surface treatment and modification technologies ■Knowledge Gained from the Seminar - Fundamental knowledge/theory regarding wettability - Correct knowledge of wettability evaluation techniques (static/dynamic contact angle, contact angle hysteresis, sliding/falling angle) - Know-how for creating surfaces/interfaces with excellent water and oil repellency, stain resistance, and anti-adhesion properties without fluorine

The "Jumbo Surprise Exhibition," which solves the challenges faced by the manufacturing industry all at once, will be held again this year. In the FA zone, the latest FA equipment, control and drive devices, and energy-saving and labor-saving proposals will be displayed all in one place. You can experience concrete solutions that are immediately useful on-site, such as automation, productivity improvement, equipment renewal, and maintenance efficiency. Representatives from each manufacturer will be available to provide direct explanations, making it a great opportunity to learn about the latest trends and case studies. If you are looking for hints to solve your challenges or considering new equipment investments, please come and visit us. We will provide encounters that will lead your business to the next stage.

■Title: "Flexible Substrates and FPC Formation Technology for 5G/6G - LCP-FCCL and Its Development" ――A must-see for developers of high-frequency FPCs. Provides knowledge useful for future FPC substrate design, from the key technologies for LCP multilayering to examples of new low-dielectric films. ■Date and Time: April 15, 2026 (Wednesday) 13:30 - 16:30 ■Target Audience for the Seminar 　Development engineers engaged in the development of high-frequency FPCs and their substrates ■Knowledge Gained from the Seminar 　・Basic properties required for FPC substrates 　・Reasons for using LCP and polyimide films in FPCs 　・Key technologies for LCP multilayering 　・Points to consider when processing LCP films 　・Examples of hybridization methods between LCP and low-dielectric materials