Notice of Joint Research Report and Seminar Presentation with Ehime University (JPCA Show 2024 / 2024 Microelectronics Show)

This is a flagship model that arranges probe heads on both the top and bottom, enabling simultaneous in-circuit testing of the front and back of the substrate.

Four probes are arranged on the top side of the substrate and two on the bottom side. Each probe can move freely and at high speed, achieving an astonishing inspection speed that is world-class in its category. By using the flying probes on both the top and bottom simultaneously, a combination inspection with up to six probes allows for simultaneous contact inspection at both points on the top and bottom sides of the substrate. This significantly expands the inspection range and further accelerates inspection time. It is equipped with a wealth of features and boasts world-class standards in speed and positioning accuracy. ★ You can bring your substrate to our demo room at our Okayama headquarters for evaluation testing ★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Circuit Board Inspection Equipment

Programming for FPGAs and special performance tests such as BST can be handled with a flying probe tester.

This is an option that includes a dedicated fixture lift mechanism on the underside operating axis of the APT-1600FD series. It allows for special inspections connected to external devices, such as Boundary Scan Testing (BST), as well as writing to and reading logs from ICs, to be performed in parallel with in-circuit testing. *For an image of the operation, please refer to the YouTube video.

• Circuit Board Inspection Equipment

The Takaya APT series is a board inspection device capable of industry-leading ultra-fast in-circuit testing.

One method for efficiently mass-producing products is the "line production method," which arranges machinery in order of the production process. This method excels in the productivity of single products and is adopted in many manufacturing sites. The incorporation of an inspection process into this line production method is referred to as "inline inspection." Takaya's flying probe testers have models that can accommodate this "inline inspection" by automatically transporting circuit boards on a conveyor. By collaborating with loaders, unloaders, and inversion machines through SMEMA, it enables automated and unmanned inspection even with large quantities of circuit boards. Additionally, when used in conjunction with other companies' 3D-AOI (automated optical inspection machines), the flying probe testers can detect issues such as microbridges that cannot be identified through visual inspection alone. This synergy leverages the strengths of each system, resulting in the elimination of false reports, improved inspection capabilities, and increased speed. If you are facing challenges with full electrical inspection (ICT) of mass-produced circuit boards, please consider Takaya's APT series, which allows for easy line switching without the need for fixtures.

• Circuit Board Inspection Equipment

Exhibiting at Nepcon 2024 from January 24! Achieving interoperability between industrial equipment and MES systems!

OPC UA (OPC Unified Architecture) is an open international standard developed for safe and reliable data exchange in industries such as industrial automation. It was announced by the OPC Foundation in 2008 and later standardized as IEC62541. It allows for secure and highly reliable data exchange across different types of devices, operating systems, and manufacturers, making it recommended as the standard communication for Industrie 4.0 and increasingly adopted worldwide. Additionally, it is aligned with the international standard for PLCs, IEC61131-3, which provides the advantage of reliably exchanging information from the manufacturing site with higher-level monitoring control systems and Manufacturing Execution Systems (MES). In response to this trend, Takaya has prepared an option to equip the APT series of flying probe testers with an OPC UA server. We are working to promote the spread of industrial IoT standards that bridge FA equipment and IT.

• Circuit Board Inspection Equipment

In recent years, the implementation of maintenance DX to achieve "non-stop factories" has become an urgent necessity in manufacturing sites. Amid the trend of factory IoT and data utilization, the use of remote I/O, which can remotely aggregate and collect sensor information and control signals from equipment and sensors dispersed inside and outside the factory, is gaining importance as a foundation for predictive maintenance and condition monitoring. On the other hand, the installation environment for remote I/O is not necessarily limited to control panels or well-conditioned factory interiors. There is an increasing need to collect data in harsh environments, such as outdoor equipment and conditions involving high temperatures, low temperatures, vibrations, and strong electrical noise. Conventional remote I/O systems have struggled to operate stably under such conditions, requiring measures like installation location constraints and additional protective enclosures. Environmentally robust remote I/O with wide temperature support and noise resistance can address these challenges, enabling the expansion of the scope of factory IoT and predictive maintenance to outdoor and remote equipment. In this seminar, we will introduce the lineup of Contec's environmentally robust remote I/O, the "CONPROSYS(R) Robust I/O Series," which includes a total of 23 products.

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including our new product, the Pillow Packaging Full Air Tightness Inspection Machine MSQ-2003. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to visit us at this opportunity. 【 Exhibition Name 】 JAPAN PACK 2025 Japan Packaging Industry Exhibition https://www.japanpack.jp/ 【 Dates 】 October 7 (Tuesday) to October 10 (Friday), 2025 *4 days 10:00 AM to 5:00 PM 【 Venue / Booth Number 】 Tokyo Big Sight / East Hall 8, Booth 8-505

Takaya Corporation will exhibit at the 27th Automatic Identification Comprehensive Exhibition, showcasing the latest RFID solution, "Visible RFID." Exhibition Details: ■ RFID Work Performance Collection System No need for a control PC or dedicated software Autonomous reader compatible with HF and UHF bands Cloud transmission with just an internet connection "Visualization" of work performance on a dashboard Integration with BI tools for "visualization of location" is also possible. ■ Newly developed "Visible RFID" autonomous reader Equipped with an LCD touch panel for on-site performance verification Efficient data management with batch transmission Experience the operability through live demonstrations We will also showcase various other products. Please visit the Takaya booth to experience the latest RFID solutions! We look forward to your visit.

[Lecture Topics] 1. Latest Trends in Information and Communication Policy of the Ministry of Internal Affairs and Communications Kei Yano, Deputy Director, Information and Communications Policy Division, Information and Communications Bureau, Ministry of Internal Affairs and Communications 2. Semiconductor and Digital Policies of the Ministry of Economy, Trade and Industry Tomonari Fujishiro, Chief of the General Affairs Section, Commerce and Information Policy Bureau, Ministry of Economy, Trade and Industry / Chief of the Minister's Secretariat 3. DX Vision of the Ministry of Land, Infrastructure, Transport and Tourism Taisuke Okubo, IT Strategy Planning and Coordination Officer, Information Policy Division, Comprehensive Policy Bureau, Ministry of Land, Infrastructure, Transport and Tourism

[Speaker] Mr. Hideo Sugiura, President and CEO of RSI Co., Ltd. [Key Lecture Content] This seminar will provide a clear explanation of data centers, which are becoming increasingly important as a foundation supporting society and economic activities, from the basics. It will organize the roles of data centers and their fundamental business models, illustrating the background of market expansion and the rising demand. Additionally, it will overview the conditions required for location and buildings, as well as the characteristics of the business, highlighting perspectives that differ from conventional real estate. Furthermore, it will address the latest trends such as the proliferation of AI and the introduction of renewable energy, exploring new entry opportunities and future possibilities across various fields. [Lecture Items] 1. What is a Data Center? - The true nature of the "information infrastructure" that supports society 2. Global and Japanese Market Environment - Trends in rapidly expanding demand and investment 3. Business Models of the Industry - From hyperscalers to colocation 4. Location Conditions and Equipment Requirements - From the perspectives of power, communication, cooling, and security 5. Challenges in the Age of AI - Power, cooling, cost, and carbon-free responses 6. Future Outlook - The future of next-generation digital infrastructure and decentralized data centers 7. Q&A / Business Card Exchange