[Completed] Massivit Open House at Selcom Co., Ltd. Tokyo Workflow Studio

Massivit's ultra-fast, large-scale 3D printer series - 2 print heads - lineup of high-precision, flame-retardant, heat-resistant, and impact-resistant materials.

■ Main Features The Massivit 5000 is the latest and top model from Massivit 3D Printing Technologies Ltd., characterized by ultra-fast and large-scale additive manufacturing using the GDP (Gel Dispensing Printing) method. It offers a wide range of materials with various properties such as high precision, flame resistance, heat resistance, and impact resistance. By using two print heads that simultaneously print with different materials, it achieves even faster production speeds. Its applications are diverse, including the production of large parts, prototype creation, and three-dimensional modeling for signs and displays. *In the GDP (Gel Dispensing Printing) method, a viscous gel-like resin is extruded from the print head and instantly cured with UV light, enabling significantly faster manufacturing compared to other methods.

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Direct printing of molds used for forming composite materials - Ultra-fast, large 3D printer - Features heat resistance, low thermal expansion coefficient, and isotropy.

■ Main Features (Massivit 10000) The Massivit 10000 is a molding system created using the CIM (Cast In Motion) method by Massivit 3D Printing Technologies Ltd., characterized by ultra-fast and large-scale additive manufacturing. It significantly reduces the time and cost of producing molds used for large and complex shapes made from composite materials (CFRP). The produced molds feature heat resistance, a low thermal expansion coefficient, and isotropy, making them suitable for autoclave molding. The higher model, Massivit 10000-G, can also be used as a 3D printer with materials similar to those of the Massivit 1800 / 5000 series, in addition to mold production.

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3D Printer Flame Retardant Materials - Applications for Theme Parks and Other Sculptures (Large Scale & High Speed)

■ Main Features CIM 84 is a 3D printing material that complies with ASTM E84 Class A (highest grade) fire resistance standards. The Massivit 10000 3D printer enables ultra-large and high-speed manufacturing.

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3D Printer High Heat-Resistant Materials - Composite Molding Applications (Large Scale & High Speed)

■ Main Features CIM 220 is a 3D printing material that possesses high heat resistance (HDT 220°C), low thermal expansion coefficient, and isotropy (isotropic thermal and mechanical properties), making it suitable for composite material molding applications such as autoclave molding. It enables ultra-large and high-speed fabrication with the Massivit 10000 3D printer.

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3D Printer Impact-Resistant and Heat-Resistant Resin - High-Speed Integrated Molding for Large Prototypes, Actual Products, and Master Molds

■ Main Features Dimengel 400 is a 3D printing material with excellent impact resistance and heat resistance, designed for industrial applications. It enables ultra-large and high-speed modeling with the Massivit 5000 and Massivit 10000-G 3D printers. * For a lineup of other resin materials that can be used with Massivit 3D printers (such as high precision, flame retardant, transparent, etc.), please refer to the related links.

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[Lecturers] Daisuke Tateno, Partner, Arthur D. Little Japan K.K. Akihiro Nagayama, Principal [Key Lecture Content] Drones, AI, software, satellites, and electronic warfare are fundamentally changing the way wars are fought, and the defense industry is currently transitioning from a heavy and traditional model to one centered around AI, software, data, and unmanned systems. In the United States, emerging companies like Palantir and Anduril, which are software-driven, are challenging existing defense firms. In Japan, structural changes are beginning with the Defense Capability Development Plan, the Defense Industry Base Strengthening Act, and the entry of startups. This seminar will discuss the changes in the global security environment and industrial structure, the strategies of advanced players both domestically and internationally, and the areas where Japanese companies can succeed, including dual-use, collaboration with software companies, M&A and alliances, and talent strategies. We will consider how to view change not as a threat but as a growth opportunity, and how to construct a new Japanese defense industry from a management perspective.

[Speaker] Kazuki Miyamoto, Representative/Analyst, VentureClef, USA [Key Lecture Content] The frontier model in the United States is evolving at an unexpected speed. AI agents based on the frontier model have completely transformed business forms in companies. Chinese companies are developing large-scale open source projects, and their performance is approaching that of the U.S. model. Meanwhile, U.S. companies have begun developing open source, leading to a direct confrontation between the U.S. and China. The seminar will examine the frontier models of both countries and explain the latest technologies and important trends. It will organize points on how Japanese companies should perceive the U.S.-China AI development competition from technological and business perspectives. It will also consider strategies for companies to succeed in the AI era, including the differentiation between the U.S. and Chinese models, as well as the advantages and challenges of open source versus closed source. [Lecture Items] <1> Frontier Model (USA) <2> Frontier Model (China) <3> Technology Trends and AI Strategies for Japanese Companies <4> Q&A

[Speaker] Chief Expert Ji Hui, Future Creation Center, Nomura Research Institute, Inc. [Key Lecture Content] *We plan to update with the latest information based on field research as necessary.* At the World Artificial Intelligence Conference held in Shanghai in July 2026, Huawei unveiled its next-generation computing infrastructure products based on its proprietary AI chips, attracting significant attention. Amid ongoing U.S. export restrictions on advanced semiconductors, Huawei demonstrated its approach to overcoming the performance limits of standalone chips through "systems engineering," showcasing its commitment to leading the development of an autonomous AI ecosystem in China, encompassing computing infrastructure, cloud, OS, and AI models. Based on the latest field research results, this lecture will explain the latest trends in Huawei's AI strategy (computing infrastructure, AI models: AI social implementation, AI ecosystem, etc.) in the context of the overall landscape of China's AI industry. [Lecture Topics] 1. Current State of China's AI Industry 2. Progress in Domestic Production of Infrastructure 3. Huawei's Full-Stack AI Ecosystem 4. Future Prospects 5. Q&A

[Key Lecture Content] 1. Overview of the Law Amending Part of the Act on the Protection of Personal Information (Amendment of 2023) Kento Kido, Deputy Director, Personal Information Protection Commission 1. Background leading to the enactment of the amended law 2. Amendment Content [1] (Promotion of Proper Data Utilization) 3. Amendment Content [2] (Regulations Responding Appropriately to Risks) 4. Amendment Content [3] (Prevention of Improper Use, etc.) 5. Amendment Content [4] (Regulations to Ensure the Effectiveness of Compliance) 6. Towards the Implementation of the Amended Law (Status of Consideration for Ordinances, Regulations, Guidelines, etc.) 7. Q&A / Business Card Exchange 2. Key Points for Practical Response to the Implementation of the Amended Law Jun Okada, Partner Attorney, Mori Hamada & Matsumoto Law Firm 1. Overall Perspective on Practical Response Based on the Amended Law 2. Specific Discussion [1]: Statistical Exceptions and AI 3. Specific Discussion [2]: Handling of Children's Personal Information, etc. 4. Specific Discussion [3]: Administrative Fines 5. Specific Discussion [4]: Other Individual Issues 6. Timeline and To-Do List for Full Implementation 7. Q&A / Business Card Exchange

The ODU-MAC Silver-Line industrial automatic disconnect connector is widely adopted in various applications such as production equipment and medical devices, not only in the EU market but also in Japan. In this webinar, we will provide a detailed explanation of new products, including the P4+ frame with an increased floating width, the EBP module that accommodates fiber core misalignment, and the thermocouple module. We will also introduce improvements to the ODU-MAC/DOCK series catalog, which has become easier to use and select products from. We will explain everything clearly, making it accessible for both those who are already using the ODU-MAC/DOCK series and those who are interested but have not used it before, so please join us. ------------ Date: September 3, 2026 (Thursday) 14:00 - 14:35 Venue: Online (A URL for the venue will be sent via email after registration) Speakers: Masaru Kimura, Sales Manager, ODU Japan Co., Ltd. Miho Kato, Sales Department, Chemex ONE Co., Ltd. ------------