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  3. オルテコーポレーション 本社
  4. We will exhibit at the 1st Semiconductor Industry Exhibition to be held in Kyushu in 2024.
SEMINAR_EVENT
  • Aug 09, 2024
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Aug 09, 2024

We will exhibit at the 1st Semiconductor Industry Exhibition to be held in Kyushu in 2024.

オルテコーポレーション オルテコーポレーション 本社
We are Orte Corporation, a limited company. We will be exhibiting at our booth at the "1st Kyushu Semiconductor Industry Exhibition," which will be held from September 25 in the attention-grabbing region of Kyushu. In recent years, interest in semiconductor manufacturing in Japan has been rekindled against the backdrop of the establishment of semiconductor factories in Kumamoto Prefecture. We encourage you to visit the event during this opportunity. Our exhibition will feature various products, including the new "white and gray rubber collets" and "ultrasonic cleaning machines" that can be applied to various purposes and processes. Exhibition Contents: - Pickup collets (rubber/resin/metal/others) - Ultrasonic cleaning machines and ultrasonic oscillators - Consumables and maintenance parts for post-semiconductor manufacturing (third-party products) - Die bonding related parts (upward needles, dispense nozzles) - Wire bonding related parts (window clampers, finger clamps) - Outsourced parts cleaning services (capillaries, wedges, maintenance parts) - Transport parts (magazine racks, IC chip trays) - Micro 3D printer BMF MicroArch
Date and time Wednesday, Sep 25, 2024 ~ Thursday, Sep 26, 2024
10:00 AM ~ 05:00 PM
Reservation required in advance.
Capital Marine Messe Fukuoka B Hall (7-1 Okihama-cho, Hakata Ward, Fukuoka City)
Entry fee Free
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0830メルマガキャンペーン画像2.jpg

Prevention of semiconductor chip removal: "Replaceable Rubber Collet"

Standard products available in a variety of sizes, customization is also OK! *Currently offering product samples to 10 people by lottery.

Our company offers "rubber collets" that are less likely to cause semiconductor chip carry-out errors due to their low adhesion and are easy to replace. We have a wide range of standard sizes available and can also accommodate customizations according to your needs. Additionally, we strive for reasonable pricing. Currently, we are giving away product samples to 10 people through a lottery. If you are interested, please feel free to apply via the [Contact Form]. [Features] ■ Available in round, square, and rectangular tip shapes ■ We generally cover the mold costs for custom tip sizes ■ Made of rubber to avoid scratches on chip surfaces ■ Compliant with RoHS directives <Please consider adopting ORUTE as your partner!> (1) We have unique products with excellent functionality and extensive experience and track record. (2) We provide products that can address and solve your company's challenges. (3) We comply with regulations on chemical substances contained in products, such as RoHS. *For more details, please refer to the comprehensive catalog of our products available for download. *Our company will be exhibiting at the "1st Semiconductor Industry Exhibition" held at Marine Messe Fukuoka B Hall on September 25 (Wednesday) to 26 (Thursday).

  • Other semiconductor manufacturing equipment

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jyushi-collet.jpg

Resin collet (replaceable)

For cost reduction purposes, it is possible to reuse the metal shank and replace only the resin tip with a new one.

Orte Corporation manufactures low-impact resin collets and pickup tools for chip pickup, where even the slightest chip is unacceptable. For resource conservation and cost reduction, we offer a service to reuse metal shanks and replace only the resin tips with new ones. 【Features】 Material: Shank part - SUS Tip part: Can be processed with various engineering plastics such as polyimide, Teflon, and Duracon Minimum hole diameter: 70μm~ *For more details, please refer to the PDF document or feel free to contact us.

  • Other semiconductor manufacturing equipment

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オルテコーポレーション
Electronic Components and Semiconductors
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[Notice of Exhibition Participation by Fukuda Co., Ltd.] TOKYO PACK 2026 Tokyo International Packaging Exhibition

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  • SEMINAR_EVENT

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

Oct 09, 2026

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We will be exhibiting at the PIAB Manufacturing Fair 2026 [Booth Number: AS-43].

  • NEW
  • SEMINAR_EVENT

We will showcase our new product "BLFF," a palletizing foam gripper that weighs only 1.9 kg and measures 350mm×250mm, ideal for bulk picking. We will also introduce various products that cater to different work applications, including durable suction cups and solutions for bag handling. Additionally, we are implementing energy-saving proposals by replacing ejectors to reduce compressed air consumption, which has become a challenge in many industries. If you have any issues with adhesion or transport, please feel free to consult with us at the venue. ■ Lightweight Foam Gripper for Collaborative Robots "CVGC Series" Despite weighing only 1.9 kg, this gripper has a theoretical lifting force of 100 kg, maximizing the payload capacity of collaborative robots. ■ Gripper for Films This gripper is designed to transport thin films gently, minimizing marks left on the surface. By utilizing 3D printing, we can accommodate highly flexible shape designs tailored to specific workpieces and applications. ■ Energy Saving Comparison Panel "Why does a single ejector consume less compressed air compared to a multi-stage ejector?" You can actually verify the differences in compressed air consumption through a comparative display using a flow meter and actual equipment.

Oct 09, 2026

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Starting from November 18 (Wednesday): Announcement of participation in Smart Factory JAPAN! Booth number "F-20"

  • NEW
  • SEMINAR_EVENT

We will be exhibiting at Smart Factory JAPAN, held at Tokyo Big Sight from November 18 (Wednesday) to November 20 (Friday), 2026. We will introduce the 'Dr. Process Navi Series', 'Dr. Mold Cloud', and AI solutions that integrate with both products! <Introducing the latest solutions that innovate productivity in manufacturing sites!> ● 'Dr. Process Navi' Series ● 'Dr. Mold Cloud' ● 'AI Solutions' For more details, please check the related products. ■■ Smart Factory JAPAN 2026 Overview ■■ Dates: November 18 (Wednesday), 19 (Thursday), 20 (Friday), 2026 Opening Hours: 10:00 AM - 5:00 PM Venue: Tokyo Big Sight, East Hall 1-3 Our Booth Number: F-20 Registration: Nikkan Kogyo Shimbun 6 Exhibition Joint Site When visiting, please register in advance from your My Page and bring a printed admission ticket. Business meeting requests are also possible, so please make use of this opportunity.

Oct 09, 2026

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Announcement of participation in the "Monozukuri World Fukuoka Design and Manufacturing Solutions Exhibition": December 2nd - @ Marine Messe Fukuoka

  • NEW
  • SEMINAR_EVENT

We will be exhibiting at the Monozukuri World Fukuoka Design and Manufacturing Solutions Exhibition, held at Marine Messe Fukuoka from December 2 (Wednesday) to December 4 (Friday), 2026. We will introduce the 'Dr. Process Navi Series', 'Dr. Mold Cloud', and AI solutions that help improve efficiency and reform in manufacturing sites! <Introducing the latest solutions that innovate productivity in manufacturing sites!> ● 'Dr. Process Navi' Series ● 'Dr. Mold Cloud' ● 'AI Solutions' For more details, please check the related products. ■■ Overview of the 4th Monozukuri World Fukuoka Design and Manufacturing Solutions Exhibition ■■ Dates: December 4 (Wednesday), 5 (Thursday), 6 (Friday), 2026 Opening hours: 10:00 AM to 5:00 PM Venue: Marine Messe Fukuoka Our booth number: 14-18 When visiting, please register in advance through the dedicated page and bring your printed visitor badge.

Oct 09, 2026

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【November 27, 2026 - November 28, 2026】Notice of Participation in the 12th Robot and Aerospace Festival Fukushima 2026 / 5th Drone Summit

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  • SEMINAR_EVENT

Announcement of participation in the "12th Robot and Aerospace Festival Fukushima 2026 / 5th Drone Summit." 【Date and Time】  November 27, 2026 (Wednesday) 10:00 AM - 5:00 PM Business Exhibition  November 28, 2026 (Thursday) 10:00 AM - 4:00 PM General Exhibition 【Venue】  Big Palette Fukushima (52 Minami 2-chome, Koriyama City, Fukushima Prefecture) 【Exhibits】  Cardboard Insulated Box  Craft Cooler Cube

Oct 09, 2026

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