September 16 (Monday) to 20 (Friday): Presentation and exhibition at the 85th Autumn Meeting of the Japan Society of Applied Physics.

An integrated platform that supports the development/analysis of semiconductors and related technologies with high speed and high precision.

We will clearly introduce Schrödinger's integrated platform that supports the development/analysis of semiconductors and related technologies. 【Product Overview】 ■ Prediction and analysis of semiconductor physical properties using quantum mechanical calculations - Electronic properties - Mechanical properties (elastic constant tensor, bulk modulus) - Dielectric properties - Reaction pathway exploration ■ Optimization of semiconductor film deposition processes (CVD, ALD, ALE) - Development of new precursors using quantum mechanical calculations and machine learning ■ Optimization of semiconductor packaging using classical molecular dynamics calculations - Construction of cross-linked structure models for resin encapsulants - Prediction of heat resistance through calculations of glass transition temperature - Prediction of gas barrier properties through calculations of absorption rates and diffusion coefficients of water and gas molecules - Analysis of physical property changes during the absorption of water/gas molecules *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductors
• simulator
• Embedded OS

Support for property prediction, analysis, and design based on molecular structure and nanoscale structure through large-scale statistical analysis of experimental data and high-precision nanoscale simulations.

We will introduce the features of Schrödinger's Materials Science Solutions (MSS) in an easy-to-understand manner. 【Product Features】 ■ Molecular design using quantum calculations ■ Prediction of liquid and polymer physical properties ■ Crystals, surfaces, and interfaces: First-principles calculations for periodic systems, chemical reactions on electrodes and catalysts, and a wide range of applications to semiconductors/molecular crystals/MOFs ■ Statistical analysis and machine learning ■ Flexible and powerful GUI/CUI user interface *For more details, please feel free to contact us.

• simulator
• Embedded OS
• EAI/ETL/WEB application server

Instant answers to your materials informatics concerns! The evolved AI platform LiveDesign accelerates new material development.

Do you have any of the following concerns in materials informatics? Schrödinger's LiveDesign solves these issues and accelerates MI, from data recording, completion, automation of machine learning, to sharing analytical methods and results. 【Concern 1】 Data quality issues: Formats and terminology are inconsistent ➡ We register data in a unified language in the same spreadsheet. 【Concern 2】 Data quantity issues: The data is full of missing values ➡ We complete the data using physical chemistry calculations and machine learning. 【Concern 3】 Undemocratic AI, machine learning, and analytical methods: Not knowing where to start ➡ We automatically generate suitable machine learning models while accumulating data, creating high-precision models without relying on computational chemists. 【Concern 4】 Internal sharing issues: A good predictive model has been created, but there is no mechanism to deploy it internally ➡ Analytical methods and results can be shared within a group via a web interface. *For more details, please feel free to contact us.

• Embedded OS

Next-generation large and high-speed metal 3D printers that offer short lead times, low costs, and high precision are being rapidly introduced to the market. These printers are actively being utilized in the manufacturing of large metal parts and products in the aerospace, automotive, defense, industrial machinery, plant, and civil engineering and construction sectors, as well as for the repair of metal parts and molds, and reverse engineering. In the first lecture of this seminar, we will provide an overview of the Farsoon LPBF method large and high-speed metal 3D printer, which can produce parts up to 1500mm, along with its short lead time, low-cost, and high-quality manufacturing technology and public case studies. The second lecture will cover the short lead time manufacturing technology and examples from Fujikohsai Industries, which has adopted the large metal 3D printer from Meltio, as well as low-cost and material reduction cases utilizing topology optimization. The third lecture will present applicable cases from JFE Engineering, which has introduced a large metal 3D printer from Nidec Machine Tool and is experiencing a surge in requests for manufacturing marine and rocket engine parts, plant equipment parts, and applications in parts and mold repair and reverse engineering. The fourth lecture will showcase the latest manufacturing technology and examples from Sanko Gosei, which is producing high-functionality and high-quality diverse large resin mold parts using a large hybrid 3D printer from Matsuura Machinery. We will provide a clear and detailed explanation of the above topics.

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

[Lecturers] PwC Consulting LLC Senior Manager Yosuke Enomoto Senior Manager Tomoe Ejiri [Key Lecture Content] Against the backdrop of the rapid proliferation of generative AI, the digital infrastructure supporting data processing, communication, and computing resources is undergoing a significant transformation. In this presentation, we will first organize the trends in the terrestrial data center market expanding from AI demand, as well as the structural changes surrounding power, location, and networks. Furthermore, as communication and data processing infrastructure expands into space, we will take a broad view of the future of next-generation digital infrastructure that integrates terrestrial and space elements. Additionally, we will explore new business transformations and opportunities that arise from combining satellite data and internal and external data with AI, and implementing them in business and decision-making through the Forward Deployed Engineer (FDE) approach.

[Speaker] Mr. Takashi Muratani, President and CEO of AnPrenergy Co., Ltd. Mr. Atsushi Nakajima, President and CEO of PandaPower Co., Ltd. [Lecture Topics] 1. The Essentials of Low-Voltage Battery Business / Mr. Takashi Muratani 2. New World Lines Created by Flywheel Batteries / Mr. Atsushi Nakajima 3. Q&A / Business Card Exchange

[Lecture Topics] 1. Why Chemical Recycling Now? ~Preparing for New Management Challenges in the Era of Resource Circulation~ Idemitsu Chemical Recycling Japan Co., Ltd. President and CEO, Yoshihiko Okamura 1. Transition from Linear Economy to Circular Economy 2. Latest Domestic and International Trends in Plastic Resource Circulation 3. Required Corporate Responses 4. Our Company's Initiatives 5. Future Prospects and Challenges of Chemical Recycling 6. Q&A / Business Card Exchange 2. New Markets Created by the Circular Economy Strategies for Building a Recycled Material Supply Chain Boston Consulting Group Associate Director, Ikuya Ueda 1. Changes in the Management Environment Surrounding Resources 2. Policy Trends in Europe, the U.S., and China and the "Circular Economy Action Plan" 3. "Three-Tier Supply Infrastructure" Supporting the Recycled Material Supply Chain ~Collection, Recycling, and Market Infrastructure~ 4. How Access to Supply Infrastructure Affects Corporate Competitiveness 5. Three Management Decisions Required of Companies (1) Pre-investment in Procurement Capability (2) Controlling Key Nodes (3) Viewing CE as a Starting Point for Business Models, Not Just a Cost 6. Q&A / Business Card Exchange