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  1. Home
  2. Electronic Components and Semiconductors
  3. オーギャ 事務所
  4. Information on exhibiting at "SENSOR EXPO JAPAN 2024"
SEMINAR_EVENT
  • Aug 29, 2024
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Aug 29, 2024

Information on exhibiting at "SENSOR EXPO JAPAN 2024"

オーギャ オーギャ 事務所
We will be exhibiting at "SENSOR EXPO JAPAN 2024" (from September 18 (Wed) to September 20 (Fri), 2024). You will also have the opportunity to experience our sensors, which are about to be released. Please take this opportunity to stop by.
Date and time Wednesday, Sep 18, 2024 ~ Friday, Sep 20, 2024
10:00 AM ~ 05:00 PM
Capital Tokyo Big Sight East Hall 2 Booth: S-12
Entry fee Free Completely pre-registration system (please register from the link below)
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Related Documents

最新_20240902_ワイヤレス面圧ソールちらし.pdf[4217992]

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Measurement of 70-point foot pressure distribution [Wireless pressure distribution measurement insole]

Wireless & flexible. Demonstrating potential in various fields such as sports, healthcare, and automotive, etc. [Video available]

At Ougya Co., Ltd., we are developing the "Pressure Distribution Measurement Insole," which demonstrates potential in a wide range of fields such as sports and caregiving. We introduce an insole sensor that can measure the load distribution on the sole of the foot "in real-time." It features a thin design with a sheet thickness of 3.0mm. It is wireless, easy to use, and boasts excellent detection speed for real-time performance. This sensor can be inserted into your existing shoes to dynamically record the load distribution on the sole of the foot during walking or exercise. It is very compact and lightweight, allowing for measurement without discomfort during use. It can be utilized in various scenarios, including improving footwork and customizing insole shapes. 【Features】 ■ Capacitive detection sensor sheet ■ Thin design with a sheet thickness of 3.0mm ■ Excellent detection speed for real-time performance ■ User-friendly wireless type ■ Can be used in athletic shoes or ski boots for measuring weight transfer *For more details, please download the related catalog (PDF) or feel free to contact us.

  • Other measurement, recording and measuring instruments

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Ultra-thin tactile film kit "OTF-KA202"

Stick it on the surface for analog input! We offer a signal processing board for applications that require precise output adjustments.

The "OTF-KA202" is a set of tactile film sensors and analog output signal processing circuits. The thickness of the sensor head is 0.5mm, making it ultra-thin. It can be mounted on cylindrical surfaces without the need for soldering, and can be fixed simply by sticking it on. Additionally, because it has a discrete circuit board, customers can also adjust the output, and the output voltage changes linearly according to the applied pressure. **Features** - Tactile film sensor capable of detecting from low load ranges - Ultra-thin sensor head with a thickness of 0.5mm - Fixed simply by sticking (no soldering required, can be mounted on cylindrical surfaces) - Output adjustment possible by customers due to the discrete circuit board - Recommended for applications where output adjustment is not possible with our conventional product "OTF-KA103" *For more details, please refer to the PDF document or feel free to contact us.*

  • Sensors

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Strong support for new business! [Sensor Development Support]

We can handle everything from A to Z in sensor development, including sensor element fabrication, signal processing circuits, PC applications, sensor system assembly, etc.!

Our company provides strong support for new business ventures through "Sensor Development Support." We can support everything in-house, from operational demo sets to circuits and applications of the elements. This enables us to achieve low costs and short delivery times without outsourcing. Additionally, we make the most of the know-how gained from experienced engineers in the development of tactile sensors. We fully support the complex sensor integration tasks. 【Ougya can solve these problems!】 ■ I want a demo set to showcase the elements at internal presentations and exhibitions. ■ The elements are ready, but I don't know the necessary signal processing circuits. ■ I can't create communication devices or software.

  • Embedded system design service

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Related catalog(1)

Pressure insole sensor

Pressure insole sensor

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Electronic Components and Semiconductors
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ROAD 2026

ROAD 2026: The 7th Roundtable on the Purpose of Autonomous Driving, Japan

  • NEW
  • SEMINAR_EVENT

About ROAD: The "Roundtable on the Purpose of Autonomous Driving (ROAD)" conference series has evolved into a unique platform for interdis-ciplinary dialogue and international collaboration in the field of autonomous driving and autonomous mobility. Established in 2016, ROAD has brought together researchers, industry leaders, and public sector stakeholders from six countries across three continents. Based on this background, the upcoming ROAD 2026 will focus on "safety” and "driving AI”—the final pieces of the autonomous driving puzzle—to advance discussions on establishing the foundational framework for ensuring safety quality and obtaining regular-tory approval for autonomous driving. We also intend to discuss the international commonalities and differences regarding the social value brought about by ADS vehicles in terms of automation, intelligent driving, and mobility. We have established a total of five compelling themes for the Round Workshops, consisting of two topics related to “The Last Piece” and three topics related to the social value of ADS, as shown below. 1) Round Workshop 1 - Horizons of E2E Driving AI → Can AI Understand the Driving Environment Like Humans? 2) Round Workshop 2 - Beyond the Unknown: Safety Cases for ADS → Can Safety Ever Be Proven? 3) Round Workshop 3 - Envisioning Smart City Mobility → Can Smart City Mobility Bridge the Mobility Divide? 4) Round Workshop 4 - Logistics Enhancement Through Autonomous Tracking → Will Logistics Become Human-Free? 5) Round Workshop 5 - The Evolution of CASE: SDV/AIDV → Will Automakers Become AI Companies? We hope you’ll all join us!

Jun 28, 2026

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[Seminar] Practical Implementation of Liquid Cooling Design and Energy-saving Operations for AI Data Centers

  • NEW
  • SEMINAR_EVENT

[Speaker] Masashi Sugita, President and CEO of LEX Style Co., Ltd. [Key Lecture Content] The power consumption of AI servers used in data centers has significantly increased, making traditional air cooling insufficient for operation. This lecture will organize the requirements for introducing a liquid cooling system into air-cooled data centers and explain the implementation method using free cooling with specific design details. When handling high-density AI servers, energy efficiency is required, and the widely used energy efficiency indicator, as well as the Ministry of Economy, Trade and Industry's Resource and Energy Agency's PUE regulation of "1.3 or below," will be explained along with practical operational insights. [Lecture Items] 1. Heat dissipation methods for high-density, high-heat AI servers 2. Basics and importance of PUE/pPUE 3. PUE regulation of "1.3 or below" by the Ministry of Economy, Trade and Industry's Resource and Energy Agency 4. AI server implementation and requirements for new data centers 5. Summary and future outlook 6. Q&A / Business card exchange

Jun 26, 2026

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[Seminar] Measures for Promoting SAF and the Frontlines of Aviation Decarbonization

  • NEW
  • SEMINAR_EVENT

[Key Lecture Content] 1. Promotion of SAF Introduction Yasushi Yamashita, Director, Carbon Neutral Promotion Office, Aviation Bureau, Ministry of Land, Infrastructure, Transport and Tourism 1. Importance of SAF in the decarbonization of the aviation sector 2. Initiatives to promote the introduction of SAF 3. Q&A / Business card exchange 2. Japan Airlines' Challenge Towards Net Zero CO2 Emissions by 2050 Kazuki Hirotani, Group Leader, GX Planning Group, Sustainability Promotion Department, Japan Airlines Co., Ltd. 1. Introduction of our five initiatives for CO2 emission reduction 2. Initiatives for reducing fuel consumption (introduction of fuel-efficient aircraft, operational improvements) 3. Initiatives for fuel transition (sustainable aviation fuel SAF) 4. Initiatives for reductions outside the value chain (carbon credits, new removal technologies) 5. Initiatives to deepen collaboration with society 6. Q&A / Business card exchange

Jun 26, 2026

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[Seminar] Design and Operation of Civil Liability and Governance in AI Development and Use

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  • SEMINAR_EVENT

[Instructor] Yuichiro Kabushiki, Partner Lawyer at TMI Comprehensive Law Office [Key Lecture Content] With the spread of AI, there is growing attention on the civil liability of developers, providers, and users of AI. The Ministry of Economy, Trade and Industry will publish "Guidelines on the Interpretation and Application of Civil Liability in AI Utilization" in April 2026, and the Ministry of Justice will also establish an expert meeting to examine civil liability related to unauthorized use of images and voices generated by AI in the same month. As the full enforcement of the AI Promotion Act and the revision of AI guidelines are underway, it is necessary to design and operate governance based on the potential responsibilities that may arise retrospectively. In this seminar, based on the guidelines from the Ministry of Economy, Trade and Industry and drawing on litigation practice experience as a judge and lawyer, we will organize the basic framework for assessing civil liability and explain fundamental methods for designing and operating governance based on risk analysis. Furthermore, we will examine the framework for civil liability and the design and operation of governance using hypothetical cases that are likely to pose practical issues.

Jun 26, 2026

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Winning Through Era-Defining On-Site Improvements! AI Utilization Seminar for Automotive Parts Suppliers in Manufacturing Sites

  • NEW
  • SEMINAR_EVENT

In this seminar, we will welcome Mr. Satoru Hayami from Waseda University, who will explain the latest trends in AI utilization in manufacturing, as well as the evolution of technologies such as agent-based AI and physical AI, and the opportunities and key points for practical application in the manufacturing industry. Furthermore, Mr. Tsubasa Shibata, representative of Next Opt, will introduce processes aimed at practical implementation, incorporating actual case studies from manufacturing sites. We hope you will envision the "potential for AI utilization in your company" and take home hints that will lead to improvements in your operations starting tomorrow. We look forward to your participation.

Jun 26, 2026

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