Photonix Tokyo 2024: Light and Laser Technology Exhibition

Area sensor for internal defect inspection after welding as a substitute for X-rays, with over 15,000 units of monitoring systems during welding in operation.

1. Area sensor for internal defect inspection in welding - Field sensor Capable of simultaneous measurement of 110,000 points with image output. Replaces electron microscopes that require X-ray, CT scans, and work cuts. 2. Non-contact thickness measurement sensor for opaque materials - Enovasense Capable of measuring the thickness of resins, coatings, and metal coatings. Measurement range is 10nm to 1mm, with a measurement speed of 1 second or more, and measurement variation is approximately 0.5% to 3%. 3. Line camera for burr inspection after battery foil cutting - CVC A line camera with a maximum of 100kHz, capable of inline burr detection. 4. Insulation layer thickness measurement sensor - FSS Measures the thickness profile of battery insulation layers inline with a resolution of a few nm. 5. Dual point sensor for electrode thickness measurement - DPS Enables high-precision thickness measurement with a distance sensor of a few nm resolution. ■ Others 6. Line sensor for 3D shape measurement of battery can welds - CLS 7. - LWM

• Defect Inspection Equipment

High-speed opaque film thickness mapping and area detection of internal defects using a laser photothermal sensor.

The sensors from the French company Enovasense are high-performance sensors that use laser photothermal technology to measure the thickness of opaque materials non-contactly. This new product is an area sensor that can simultaneously measure approximately 110,000 points, unlike conventional single-point sensors. It can detect not only the thickness mapping of opaque materials but also the presence of defects, chips, and delaminations beneath the surface layer. ■ Features - Non-contact measurement of the following: ☆ Thickness mapping of opaque materials ☆ Detection of defects beneath opaque surface material layers No destructive testing is required. - As an area sensor, it can measure approximately 110,000 points simultaneously in one second. - It can also be applied to detect defects in areas such as welds, where conventional X-ray or CT scans are typically required. - Measurement is possible with various combinations of materials, regardless of the base material. ■ Applications Automotive industry, aerospace industry, consumer goods, industrial products, medical industry, semiconductor field. It can be used in various applications such as coating thickness, metal plating thickness, paint films, and welds. *For more details, please check the PDF download or contact us.

• Defect Inspection Equipment

It is possible to obtain the quality assessment results of the product simultaneously with the completion of laser welding. It is equipped with a user-friendly GUI that facilitates easy operations such as data linking, review, and analysis.

■ Monitoring plasma light, radiation temperature, and laser reflection light during laser welding to determine product quality. ■ The software used for judgment and analysis has improved its judgment capability, performance, and functionality through over 20 years of sales experience and customer feedback. ■ Easy to add not only to new equipment but also to existing equipment. ■ Proven track record as an inspection device for various laser welding applications in the automotive industry, EVs, home appliances, and more. We have demo units available and look forward to your inquiries. Whether you are familiar with the previous LWM or are trying it for the first time, we encourage you to experience the latest LWM.

• Welding Machine

Introducing the measurement principles of each sensor, corresponding sensors, product information, and ease of use!

This document introduces the performance of various sensors for component inspection handled by PreciTech Japan Co., Ltd. It includes the measurement principles, compatible sensors, and ease of use for each sensor, such as the "Chromatic Aberration Confocal Single Point Sensor" and "Optical Point Sensor." Our company provides intelligent and reliable solutions for laser material processing and optical measurement technology. [Overview] ■ Measurement with the Chromatic Aberration Confocal Single Point Sensor ■ Shape and thickness measurement inspection with the Chromatic Aberration Line Sensor ■ Quality control of welding ■ Area scan measurement of thickness, flatness, and shape in specified areas *For more details, please refer to the PDF document or feel free to contact us.

• Sensors
• Welding Machine

For high-precision thickness measurement of opaque materials, Enovasense's laser photo-thermal sensor can measure thickness from a minimum of 10nm, regardless of the material.

The sensors from the French company Enovasense are high-performance sensors that use laser photothermal technology to measure the thickness of opaque materials non-contactly. ■Features - Non-contact measurement of the thickness of opaque materials is possible, eliminating the need for destructive testing. - A wide measurement range from a minimum of 10nm to a maximum of 1mm. - High precision measurements of 0.5% to 3% or less are achievable, recommended for those lacking accuracy. - Capable of measuring various combinations of materials regardless of the base material. ■Applications Used in a wide range of fields including the automotive industry, aerospace industry, consumer goods, industrial products, medical industry, and semiconductors, for various applications such as coating thickness, metal plating thickness, and paint film thickness. *Currently, Enovasense is a group company of the German optical sensor manufacturer Precitec. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Coating thickness gauge

Non-contact line sensor CLS. High precision, high speed, and wide range 3D shape measurement. High tolerance for angles suitable for edges and slopes. Numerous achievements in wafer edge measurement.

The "CHROCODILE CLS2" and "CHROCODILE CLS2 PRO" can achieve non-contact high-speed three-dimensional shape measurement at a maximum of 48 million points per second (standard is 16.8 million points per second). The resolution is also extremely high, with a maximum of Y1um and Z0.025um, allowing for very precise measurements. Compared to previous generations, there has been a significant reduction in measurement time, and improvements have been made for high NA and increased light volume suitable for wafer edges, wire bonding, and micro bump measurements. There are numerous applications including shape, surface roughness, step height (thickness), flatness, and TTV. It is suitable not only as a tabletop device but also for use as a sensor for in-situ, monitoring, and inline equipment integration. 【Features】 - Three-dimensional shape measurement over a wide area Maximum line width of 20mm - Wide tolerance angle Can accommodate ±53° on reflective surfaces, suitable for edges and steep slopes - Contributes to reduced development costs and shortened development lead times, with a compact unit and a software development kit for equipment integration (such as DLLs) also available - Rich track record across multiple industries Semiconductor industry, consumer electronics, glass manufacturing, medical field *For more details, please refer to the documentation.

• 3D measuring device

High-speed area scanning unaffected by vibrations. For online, offline, quality control, and wafer inspection applications.

The "Flying Spot Scanner" is an optical measuring device that can perform wide-area scans (up to φ80) using XY2-axis galvanometer mirrors. Since stage scanning is not required, there is no influence from vibrations of the stage. Thanks to the principle of spectral interference, it can measure thickness, dimensional shapes, and inspect surface defects. Additionally, because the incident and reflected light are in a coaxial optical system, good results can be obtained even on glossy surfaces. 【Features】 ■ Wide-area scanning ~φ80mm ■ High resolution XY 6.5μm~, Z 1nm~ Minimum beam spot diameter 13μm, high Z resolution due to spectral interference method ■ No XY stage required, no stage vibrations Area scanning using galvanometer mirrors ■ Reduced development costs and shortened development lead times Software development kit (DLL, etc.) available for device integration ■ Applications Thickness measurement of glass substrates for FPD and LCD, measurement of wafer warp (distortion), lens shape inspection, PCB board shape inspection, height measurement of small precision parts, etc. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Other inspection equipment and devices
• Optical Measuring Instruments

This is a high-speed, high-precision line camera for inline appearance inspection, also suitable for wafer inspection applications.

The "CHRomatic Vision Camera" is a line camera for high-speed appearance inspection. Utilizing the principle of chromatic aberration confocal, it has a wide depth of field of up to 3mm. Focusing is unnecessary, allowing for high-contrast images to be captured even on uneven surfaces. It can obtain two-dimensional images. Additionally, with a high-speed scan of up to 140kHz, inline appearance inspection (for shape defects such as cracks and scratches, as well as foreign object inspection) is possible. 【Features】 ■ High resolution XY 0.9um~2.9um (the 3mm depth of field type is 2.9um) ■ High contrast for various materials ■ High speed and resistant to vibration ■ Contributes to reduced development costs and shortened development lead times, with a software development kit (DLL, etc.) available for device integration. Interfaces such as CameraLink and GigE are supported. ■ Proven results in appearance inspection for semiconductors, consumer electronics, and glass. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Sensors
• Optical Measuring Instruments

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

We will showcase our new product "BLFF," a palletizing foam gripper that weighs only 1.9 kg and measures 350mm×250mm, ideal for bulk picking. We will also introduce various products that cater to different work applications, including durable suction cups and solutions for bag handling. Additionally, we are implementing energy-saving proposals by replacing ejectors to reduce compressed air consumption, which has become a challenge in many industries. If you have any issues with adhesion or transport, please feel free to consult with us at the venue. ■ Lightweight Foam Gripper for Collaborative Robots "CVGC Series" Despite weighing only 1.9 kg, this gripper has a theoretical lifting force of 100 kg, maximizing the payload capacity of collaborative robots. ■ Gripper for Films This gripper is designed to transport thin films gently, minimizing marks left on the surface. By utilizing 3D printing, we can accommodate highly flexible shape designs tailored to specific workpieces and applications. ■ Energy Saving Comparison Panel "Why does a single ejector consume less compressed air compared to a multi-stage ejector?" You can actually verify the differences in compressed air consumption through a comparative display using a flow meter and actual equipment.

We will be exhibiting at Smart Factory JAPAN, held at Tokyo Big Sight from November 18 (Wednesday) to November 20 (Friday), 2026. We will introduce the 'Dr. Process Navi Series', 'Dr. Mold Cloud', and AI solutions that integrate with both products! <Introducing the latest solutions that innovate productivity in manufacturing sites!> ● 'Dr. Process Navi' Series ● 'Dr. Mold Cloud' ● 'AI Solutions' For more details, please check the related products. ■■ Smart Factory JAPAN 2026 Overview ■■ Dates: November 18 (Wednesday), 19 (Thursday), 20 (Friday), 2026 Opening Hours: 10:00 AM - 5:00 PM Venue: Tokyo Big Sight, East Hall 1-3 Our Booth Number: F-20 Registration: Nikkan Kogyo Shimbun 6 Exhibition Joint Site When visiting, please register in advance from your My Page and bring a printed admission ticket. Business meeting requests are also possible, so please make use of this opportunity.

We will be exhibiting at the Monozukuri World Fukuoka Design and Manufacturing Solutions Exhibition, held at Marine Messe Fukuoka from December 2 (Wednesday) to December 4 (Friday), 2026. We will introduce the 'Dr. Process Navi Series', 'Dr. Mold Cloud', and AI solutions that help improve efficiency and reform in manufacturing sites! <Introducing the latest solutions that innovate productivity in manufacturing sites!> ● 'Dr. Process Navi' Series ● 'Dr. Mold Cloud' ● 'AI Solutions' For more details, please check the related products. ■■ Overview of the 4th Monozukuri World Fukuoka Design and Manufacturing Solutions Exhibition ■■ Dates: December 4 (Wednesday), 5 (Thursday), 6 (Friday), 2026 Opening hours: 10:00 AM to 5:00 PM Venue: Marine Messe Fukuoka Our booth number: 14-18 When visiting, please register in advance through the dedicated page and bring your printed visitor badge.

We will be exhibiting at "CEATEC 2026," which will be held at Makuhari Messe from October 13 to 16. We provide information technology and process informatics (PI) that optimize "how to create" by utilizing physical simulations, AI, and machine learning in process development. We look forward to your visit to our booth. 【Seminar Information】 "Process Informatics for Exploring Optimal Manufacturing Conditions" Date and Time: October 16, 2026 (Friday) 12:45 - 13:00 Venue: Makuhari Messe Exhibition Hall 4 P Stage Speaker: CEO Takaishi Please check the link below for details on our exhibition.