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  3. ベテル 本社・工場、東京オフィス、ハドソン研究所、ベトナム工場
  4. [Web Seminar for Electronics Manufacturers and Developers] The First Step in Solving Thermal Issues! 'Basics of Thermal Conductivity and Measurement Methods/Measurement Examples'
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  • Nov 11, 2024
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Nov 11, 2024

[Web Seminar for Electronics Manufacturers and Developers] The First Step in Solving Thermal Issues! 'Basics of Thermal Conductivity and Measurement Methods/Measurement Examples'

ベテル ベテル 本社・工場、東京オフィス、ハドソン研究所、ベトナム工場
The "Fundamentals of Thermal Conductivity and Measurement Methods/Case Studies" seminar hosted by Nikkan Kogyo Shimbun will be held soon! In manufacturing and development, thermal issues in electronic devices and materials cannot be avoided. To solve these problems, it is essential to accurately understand the "thermal conductivity" of components and materials and to carry out appropriate thermal design. This seminar will cover the various types of thermal conductive materials used in electronic devices, detailing their measurement methods and specific case studies. By understanding the characteristics and advantages of various thermal conductivity measurement methods, participants will develop the skills to select the optimal method according to the situation. Additionally, actual measurement case studies of thermal conductivity will be introduced, providing knowledge directly applicable to product development and quality control. This seminar is recommended for those who want to acquire advanced thermal property measurement techniques to improve the performance of electronic products and prevent issues. <Knowledge to be Acquired> ◇ Basic knowledge of thermal conductivity ◇ Principles of thermal conductivity measurement instruments ◇ Differences in thermal conductivity measurement methods (which instruments to use for which types of samples) Please click the [Details & Registration] button below to apply.
Date and time Tuesday, Dec 03, 2024
01:00 PM ~ 05:00 PM
12:30 - Login begins
Capital
Entry fee Charge Per person: 37,400 yen (including materials, tax included)
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Betel thermal conductivity measurement device and fiber orientation evaluation system

Introducing devices for measuring the thermal diffusivity of sheet-like and plate-like materials, as well as thermal evaluation devices for fiber orientation distribution!

Introducing Bethel's thermal property measurement devices. The "Thermo Wave Analyzer TA33/35" is a measurement device for the thermal diffusivity of sheet and plate materials, capable of measuring the thermal diffusivity of functional materials. The "Thermal Microscope TM" has been commercialized through joint development with the National Institute of Advanced Industrial Science and Technology's Measurement Standards Division, allowing for measurements in micro-regions and thin films. Additionally, we offer the "Thermal Imaging Scope TSI," which visualizes thermal conduction paths using infrared cameras and lasers, as well as the "Fiber Orientation Evaluation System TEFOD." 【Features of the Thermo Wave Analyzer TA33/35】 ■ High freedom of sample shape ■ Dynamic range from organic films to diamonds ■ Anisotropy evaluation through measurements in horizontal and vertical directions ■ Evaluation of defects and irregularities through distribution measurements *For more details, please refer to the PDF document or feel free to contact us.

  • Other measurement, recording and measuring instruments

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[On-site Seminar] Seminar on Thermal Conductivity Measurement ◇ Held at your desired location

Quickly resolve your questions about heat! A heat professional will visit you at your desired date and location.

The target audience includes professionals in thermal properties as well as students! We will clearly explain case studies, tips, and measurement methods related to thermal property measurements.

  • Laser microscope

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[Measurement Example] <Semiconductor Material> Thermal Conductivity Measurement of Si Wafer [TA]

Measuring the thermal diffusivity of semiconductor material 'Si wafer's thermal properties'!

The thermal diffusivity of "Si wafers," which are essential materials for semiconductors, can be measured.

  • Other metal materials

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[Measurement Example] Evaluation of Thermal Conductivity of Electrode Part of Semiconductor Laser [TM3]

Evaluating the electrode part of the semiconductor laser!!

■Visualizing the thermal conductivity of the insulating layer ■Evaluating the thermal conductivity of thin films ■Evaluating the thermal penetration rate in micro-regions (3μm and above)

  • Microscope

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[Measurement Example] <Heat Sink> Evaluation of Thermal Conductivity of Aluminum Nitride (AlN)

Development of aluminum nitride, known for its use in heat sink materials!

■Evaluation of particles with a micro size (3μm and above) ■Evaluation of thermal conductivity of thin films ■Measurement possible at submicron order

  • Microscope

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[Measurement Example] Thermal Conductivity of Thermoelectric Materials: Strontium Titanate [TA]

It will help in the development of thermoelectric materials!

Energy conservation is a challenge that must be addressed throughout Japan and the world in the future, and it is expected that the development of thermoelectric materials will also accelerate within this context. In fact, our company has received numerous requests for measurements of thermoelectric materials. Since the earthquake, there has been a particularly increasing trend, and if our measurement technology can contribute to the world of energy conservation, we are willing to cooperate in any way possible.

  • Other metal materials

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[Measurement Example] Measurement of Thermal Conductivity of Carbon Nanotube (CNT) TIM

It will help in the development of high thermal conductivity materials! 【Cooling of semiconductor devices / heat sinks】

■Measurement of thermal properties of carbon nanotube (CNT) applied materials ■Surface treatment is unnecessary (in the case of carbon-based materials) ■Essential for the development of high thermal conductivity materials! ■Non-contact measurement

  • Composite Materials

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[Measurement Example] Measurement of Thermal Conductivity of Graphite Sheet [TA]

The anisotropy of the graphite sheet (in-plane direction and thickness direction) has become measurable!

○ Anisotropy of graphite sheets (in-plane direction and thickness direction) ○ Thermal diffusivity ○ Thermal conductivity

  • Optical microscope

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[Measurement Field] Thermal Conductivity of Microscopic Sizes [TM3]

For measuring thermal properties of thin films and micro-regions. Micro-sized particles can also be measured freely.

The Thermal Microscope TM3 deposits a metal thin film on the sample and periodically heats it using a heating laser. It can now measure tiny particles that were previously difficult to analyze. For more details, please contact us.

  • Microscope

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Measurement of thermal conductivity of thermal pads

Are you measuring the correct thermal conductivity of the thermal pad?

A thermal pad is a type of thermal interface material used for heat dissipation in CPUs and power devices. Due to its flexibility and relatively high thermal conductivity, it effectively reduces contact thermal resistance by filling the gaps between the heat sink and the device. Do you accurately understand the thermal conductivity of thermal pads? Thermal pads have elasticity, so their contact state changes with pressure. In other words, the effective thermal conductivity varies with pressure. Additionally, many materials exhibit temperature dependence in thermal conductivity, meaning that as the temperature increases, the thermal conductivity decreases. In this instance, we measured a commercially available thermal pad with a specification of 1.5W/mK. This is a soft type referred to as a soft thermal pad. The measurement device used is our steady-state thermal conductivity measurement device, the SS-H40.

  • Thermo-fluid analysis

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Measurement of thermal conductivity of conductive diamond

Even thin and small samples, as well as samples with high thermal conductivity, can be measured!

We are also able to measure the thermal conductivity of conductive diamonds. Normally, diamonds are insulators, but by doping with boron, they can be made conductive, allowing for the creation of high-performance electrodes. This enables redox reactions that are impossible with electrodes made from other materials due to a wide potential window, and they can be used in harsh environments such as strong acids and strong alkalis, offering significant advantages. Personally, I am particularly interested in their potential use in the recycling of CFRP. The measurements will be conducted using the ThermoWave Analyzer TA35. [About the Samples] The samples this time have thicknesses of 30μm and 300μm, and with a sample size of 10mm x 10mm, it can be said that measurement with ordinary thermal conductivity measurement devices is nearly impossible. Measurement is only possible with the ThermoWave Analyzer. The 30μm thick sample is matte black with a smooth surface. The 300μm thick sample is also matte black, but its surface was slightly rough. However, this level of roughness has no effect on the measurements at all.

  • Thermo-fluid analysis

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Measurement of thermal conductivity of carbon fiber reinforced plastic (CFRP)

Leave the measurement of the thermal conductivity of carbon fiber reinforced plastic (CFRP) to us.

Carbon fiber reinforced plastics (CFRP), used in electric vehicles, aircraft, satellites, and rockets, require precise knowledge of thermal conductivity. For instance, when used in electric vehicles, understanding thermal conductivity is essential for heating performance and battery thermal management. Changes in electricity consumption due to heating performance and thermal management significantly affect driving range. Similarly, when used in satellites and rockets in the harsh environment of space, it is necessary to understand thermal conductivity to ensure heat resistance performance. With Bethel, you can accurately measure the thermal conductivity of this carbon fiber reinforced plastic (CFRP).

  • Thermo-fluid analysis

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[Seminar] Data Center: Expanding Market and Investment Opportunities

  • NEW
  • SEMINAR_EVENT

[Speaker] CBRE, Inc. Research Senior Director, Mr. Arishi Iwama [Key Lecture Content] Due to the spread of cloud computing and AI, the supply and demand for data centers in the metropolitan area is tightening. There are numerous development plans for data centers, and it is expected that the market size in the metropolitan area will expand by approximately 3.3 times in the future. However, securing the necessary power for the establishment of data centers in the metropolitan area can take up to 10 years in some cases. As a result, securing power has become the biggest bottleneck in data center development. On the other hand, it is anticipated that the decentralization of data centers will progress in the future, supported by government policies and aimed at securing power. This lecture will explain the trends in the data center market, future outlook, and characteristics as an investment target. [Lecture Items] 1. Overview of the data center market in the metropolitan area 2. Outlook for data center power demand and measures to alleviate power supply and demand tightness 3. Overview and location conditions of data centers 4. Potential of AI data centers in regional decentralization 5. Data centers as an investment target 6. Q&A / Business card exchange

Oct 15, 2026

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[Seminar] Strategy Analysis of Major OEMs including Toyota, Honda, and Suzuki

  • NEW
  • SEMINAR_EVENT

[Speaker] Hideo Hakomori, Chief Analyst, Equity Research Department, Daiwa Securities Co., Ltd. [Key Lecture Content] For Japan's automotive industry, which has expanded through globalization, global divisions such as U.S. tariffs and conflicts in the Middle East present headwinds. Additionally, responding to the rise of Chinese competitors is urgent, making it difficult to steer growth strategies. Nevertheless, a "once-in-a-century transformation" is occurring. The axis of competition has shifted from a "two-dimensional world map" to a "three-dimensional map with a time axis." Rather than Renault-Nissan, Nissan's collaboration with Honda seems inevitable despite various twists and turns. This lecture will explore this background while considering changes in the industry structure. In the U.S., rising gasoline prices are driving demand for HEVs and compact cars. This is a tailwind for Japanese manufacturers, but at the same time, demand for BEVs is expanding again in Europe and other regions. It is also important to confirm that BEVs are a growing market.

Oct 15, 2026

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[November 6, 2026 (Friday)] Invitation to participate in "Oume Open Factory 2026"

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  • SEMINAR_EVENT

Nomura DS Corporation will participate in the "Oume Open Factory 2026" held in Oume City. The Oume Open Factory is a four-day limited "on-site experience event" where manufacturing companies in Oume City open their factories to the public. Our company plans to showcase CNC automatic lathes and factory tours, as well as the recently highlighted robot for post-processing efficiency, the "N-ROBO." The "N-ROBO" is a device that uses a small robot to prevent damage to workpieces processed (cut) by NC automatic lathes and conducts various inspections (overall length, outer diameter, inner diameter), serving as a labor-saving robot to address labor shortages. Since it is not often that one can experience seeing large machines and robots, we encourage you to take this opportunity to participate in the "Oume Open Factory 2026 at Nomura DS Corporation." We look forward to your visit. Our event will take place only on Friday, November 6th. Please come dressed in clothes that can get dirty. We have parking available, but if it is full, please use nearby coin parking.

Oct 15, 2026

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Notice of participation in the "Okayama Technology Exhibition (OTEX) 2026" (November 11-12, 2026 / Convex Okayama)

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  • SEMINAR_EVENT

F.I.T. Pacific Co., Ltd. will exhibit at the "Okayama Technology Exhibition (OTEX) 2026," which will be held locally from November 11 (Wednesday) to November 12 (Thursday), 2026, and online from October 30 (Friday), 2026, to December 18 (Friday), 2026, at Convex Okayama. At our booth, we will showcase heat-resistant and wear-resistant hoses. We sincerely look forward to your visit. 【Event Overview】 Name: Okayama Technology Exhibition (OTEX) 2026 Date: Local: November 11, 2026 (Wednesday) 10:00 AM - 5:00 PM November 12, 2026 (Thursday) 10:00 AM - 4:30 PM Online: October 30, 2026 (Friday) - December 18, 2026 (Friday) Venue: Convex Okayama Large, Medium, and Small Exhibition Halls Our Booth: Large Exhibition Hall, Booth Number: 114 Admission Fee: Free (registration on the official website is required) Organizer: Okayama Prefecture, Okayama Prefectural Industrial Promotion Foundation Official Website: https://www.optic.or.jp/otex/

Oct 15, 2026

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Notice of Participation in "POWTEX(R) 2026 (46th International Powder Technology Exhibition)" (November 25 - November 27 / Tokyo Big Sight)

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  • SEMINAR_EVENT

F.I.T. Pacific Co., Ltd. will exhibit at "POWTEX(R)2026 (46th International Powder Technology Exhibition)" held at Tokyo Big Sight from November 25 (Wednesday) to November 27 (Friday), 2026. At our booth, we will showcase heat-resistant and wear-resistant hoses. We sincerely look forward to your visit. 【Event Overview】 Name: POWTEX(R)2026 (46th International Powder Technology Exhibition) Date: On-site: November 25 (Wednesday) to November 27 (Friday), 2026, 9:30 AM to 5:00 PM Venue: Tokyo Big Sight, Halls 1, 2, and 3 Our Booth: 3-T65 Admission Fee: Free (Pre-registration required) *Admission is allowed for high school students and above. Middle school students and below are not permitted. Organizer: Japan Powder Technology Association Official Website: https://www.powtex.com/tokyo/

Oct 15, 2026

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