We will exhibit a corporate booth at the 39th Spring Conference of the Electronics Packaging Society. (Takushoku University, Bunkyo Campus)

2025 Electronics Packaging Society Technical Award Winner!" "55th Mechanical Industry Design Award IDEA Winner!

Takaya Corporation has announced a new model of its flying probe tester, the "APT-2400F/APT-2600FD series," which reliably detects various defects in printed circuit boards through ultra-high-speed inspection. Equipped with cutting-edge inspection technology that can check the placement and connections of fine components with high precision, it ensures that even minor defects and risks are not overlooked, strongly supporting the improvement of product quality. Additionally, thanks to the company's unique control mechanisms and sensing technology, reliable inspections can be achieved even in fluctuating environments, contributing to quality management by reducing recall risks. Furthermore, it features a user-friendly interface that anyone can intuitively operate, helping to alleviate burdens in workplaces where labor shortages are becoming serious, while still ensuring high inspection accuracy and contributing to increased productivity. *For more details, please download the PDF document or feel free to contact us.*

• Other measurement, recording and measuring instruments

Equipped with a high-performance measurement system and a variety of functions, it contributes to quality improvement from prototyping to mass production!

The APT-2400F is a next-generation flying probe tester that boasts industry-leading probing accuracy capable of inspecting high-density mounted circuit boards. With its unique control mechanisms and sensing technology, it achieves highly reliable electrical testing in all environments. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your circuit boards. We can conduct a series of tests including the creation of inspection programs, testing using actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.

• Other measurement, recording and measuring instruments

Equipped with a high-performance measurement system and a variety of functions, it contributes to quality improvement from prototyping to mass production!

The APT-2400F-SL is a large model that maintains the basic performance of the APT-2400F while expanding the compatible board size to W635×D610mm. Furthermore, by adding an optional split inspection function, it is capable of inspecting long boards up to W985×D610mm. It can accommodate component heights of up to 60mm on the top and 120mm on the bottom, and can handle board weights of up to 15kg, making it suitable for inspecting large and heavy boards such as those used in automotive, aerospace, medical devices, power supply boards, and probe cards. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your boards. A complete testing process is possible, including the creation of inspection programs, testing with actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.

• Other measurement, recording and measuring instruments

A new innovation in substrate manufacturing. Achieving improvements in production efficiency and inspection accuracy!

The APT-2600FD is a next-generation dual-side flying probe tester that can perform combination testing with up to 6 probes using both upper and lower flying probes simultaneously. It improves test coverage while reducing the risk of product damage due to board flipping operations, significantly shortening inspection time. Equipped with a high-performance measurement system and a variety of features, it contributes to quality improvement from prototyping to mass production. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your boards. A complete testing process is possible, including the creation of inspection programs, testing using actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.*

• Other measurement, recording and measuring instruments

A new innovation in substrate manufacturing. Achieving improvements in production efficiency and inspection accuracy!

The APT-2600FD-SL is a large model that maintains the basic performance of the APT-2600FD while expanding the compatible board size to W635×D610mm. Furthermore, by adding an optional split inspection function, it can inspect long boards up to W985×D610mm. It can accommodate components with a height of 60mm and board weights of up to 15kg, making it suitable for inspecting large and heavy boards such as those used in automotive, aerospace, medical devices, power supply boards, and probe cards. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your boards. A complete testing process is possible, including the creation of inspection programs, testing with actual boards, and summarizing evaluation results. On July 31, 2025, at the Keidanren Kaikan in Otemachi, Chiyoda-ku, Tokyo, this product received the "Nikkankogyo Shimbun 110th Anniversary Award" at the "55th Mechanical Industry Design Award IDEA" ceremony. The judging committee praised the design philosophy that balances inspection efficiency and reliability, providing an opportunity for our technological and product design capabilities to be widely recognized. *For more details, please feel free to contact us.*

• Other measurement, recording and measuring instruments

We will create new value through the mutual complementarity of ICT and BST.

In-circuit testing with a flying probe tester excels at inspecting the electrical characteristics of implemented electronic components in analog circuits. However, components that cannot be probed make electrical testing difficult, and functional testing of digital circuits is challenging. On the other hand, boundary scan testing allows for quick interconnection testing between LSI pins and on-board programming for FPGAs, but it can only test digital circuits around ICs that comply with the boundary scan standard, and it also requires specialized fixtures for connections. At Takaya Corporation, we possess technology that uses flying probes instead of fixtures to connect 4 to 5 scan-compatible pins and measuring instruments required for boundary scan testing. This allows for boundary scan testing even when the counterpart of a boundary scan-compliant IC is a non-boundary scan-compliant IC or passive components (such as connectors) by enabling the flying probe to function as a virtual boundary scan cell. With a single flying probe tester, it is possible to conduct comprehensive testing of both digital and analog circuits, thereby significantly enhancing testing efficiency compared to before.

• Circuit Board Inspection Equipment

We have received permission to publish the feature article that was included in the only domestic magazine specializing in implementation technology, "Electronics Implementation Technology." You can view it here.

Special Feature Content ■ Latest Trends in BGA Implementation Board Inspection Hybrid Inspection of Flying Probe Testers and JTAG Testing Andor System Support Co., Ltd. / Masayuki Taniguchi Takaya Co., Ltd. / Kohei Yanagida Overview BGA (Ball Grid Array) components are now used in all types of electronic devices, from consumer products to industrial equipment, and more recently, automotive devices. However, a reliable method for inspecting boards with BGA components (hereafter referred to as BGA implementation boards) has not been established. This is because every inspection method has its advantages and disadvantages, making it impossible to conduct a complete test using only one inspection method. Therefore, inspecting BGA implementation boards has become a challenge for many companies. In this article, we will introduce the latest technological trends in hybrid inspection that combines flying probe testers and JTAG (Joint Test Action Group) boundary scan as one solution to this issue. 1. Introduction 2. Inspection and Challenges of BGA Implementation Boards 3. Possibilities of Electrical Testing 4. In-Circuit Testing 5. JTAG Boundary Scan Testing 6. Hybrid Testing 7. Conclusion

• Circuit Board Inspection Equipment

We have published a joint research report with Ehime University.

Takaya Corporation is conducting joint research with the Graduate School of Science and Engineering at Ehime University on accelerating the inspection of flying probe testers using deep reinforcement learning. At the Ehime University booth during the JPCA Show 2023 / 2023 Microelectronics Show held at Tokyo Big Sight from May 31 (Wednesday) to June 2 (Friday), we displayed and introduced a report on this research. You can download and view the report that was exhibited on that day from here. We encourage everyone to take a look.

• Circuit Board Inspection Equipment

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including our new product, the Pillow Packaging Full Air Tightness Inspection Machine MSQ-2003. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to visit us at this opportunity. 【 Exhibition Name 】 JAPAN PACK 2025 Japan Packaging Industry Exhibition https://www.japanpack.jp/ 【 Dates 】 October 7 (Tuesday) to October 10 (Friday), 2025 *4 days 10:00 AM to 5:00 PM 【 Venue / Booth Number 】 Tokyo Big Sight / East Hall 8, Booth 8-505

In recent years, the implementation of maintenance DX to achieve "non-stop factories" has become an urgent necessity in manufacturing sites. Amid the trend of factory IoT and data utilization, the use of remote I/O, which can remotely aggregate and collect sensor information and control signals from equipment and sensors dispersed inside and outside the factory, is gaining importance as a foundation for predictive maintenance and condition monitoring. On the other hand, the installation environment for remote I/O is not necessarily limited to control panels or well-conditioned factory interiors. There is an increasing need to collect data in harsh environments, such as outdoor equipment and conditions involving high temperatures, low temperatures, vibrations, and strong electrical noise. Conventional remote I/O systems have struggled to operate stably under such conditions, requiring measures like installation location constraints and additional protective enclosures. Environmentally robust remote I/O with wide temperature support and noise resistance can address these challenges, enabling the expansion of the scope of factory IoT and predictive maintenance to outdoor and remote equipment. In this seminar, we will introduce the lineup of Contec's environmentally robust remote I/O, the "CONPROSYS(R) Robust I/O Series," which includes a total of 23 products.

[Speaker] Miyamoto Mariko, Senior Researcher, Public Policy Research Department, SOMPO Institute Plus Inc. [Lecture Items] 1. Overview and Latest Trends of Green Infrastructure (1) Background of Growing Attention and Market Expansion Outlook (2) Current Situation and Challenges for Promotion 2. Economic Effects of Green Infrastructure (1) Domestic Examples (Parks, Road Facilities, etc.) (2) International Examples 3. Evaluation and Certification Systems (1) Systems Related to Buildings (2) Systems Related to Sites and Urban Spaces 4. Financing Methods for Green Infrastructure (1) PPP/PFI (2) Sustainable Finance 5. Q&A / Business Card Exchange

[Lecturers] Nishimura & Asahi Law Offices, Foreign Law Joint Enterprise Attorney and Associate Iku Akamatsu Attorney and Associate Yasukazu Yamazaki (Note: "Saki" is a variant character) [Key Lecture Content] In the logistics sector and other areas, discussions are underway regarding the social implementation of drone flight routes. Drone flight routes involve various stakeholders, including drone route operators, drone operation businesses, surrounding municipalities, and ground-related parties, who collaborate and divide roles to realize these routes. Therefore, drone route operators and businesses utilizing drone routes need to enter into contracts regarding the use of drone routes with relevant parties, clarify roles, and implement appropriate risk management. This lecture will explain the legal points that must be considered when entering into contracts for the use of drone flight routes. [Lecture Items] 1. Overview of drone flight routes and recent examination status 2. Stakeholders and their roles related to drone flight routes 3. Items to consider specifying in contracts for the use of drone flight routes 4. Legal points to be aware of in contracts for the use of drone flight routes 5. Q&A / Business card exchange

[Speaker] Keiichi Koga, Senior Development Manager, Innovation Strategy Center, Japan Research Institute, Ltd. [Key Lecture Content] After the transition to the Trump administration, significant changes have emerged in the global business environment concerning the oceans, particularly regarding decarbonization and nature conservation. On the other hand, considering the accumulation of knowledge and shared understanding of the realities of the marine environment, what growth strategies should companies outline? In the financial sector, which is focusing on the expansion of the blue economy, there is a growing recognition that advancing nature-positive businesses can lead to sustainable corporate value enhancement. The sectors related to the ocean encompass not only fisheries and shipping but also a wide range of areas such as water pollution, plastic waste, tourism, and energy-related industries. This lecture will discuss the seeds for considering how businesses can transform. [Lecture Items] 1. The Blue Economy so far 2. International Trends 3. Financing Trends related to the Blue Economy 4. Directions for Business Transformation based on the Blue Economy 5. Case Studies 6. Q&A / Business Card Exchange