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  3. TAKAYA Corporation
  4. We will exhibit a corporate booth at the 39th Spring Conference of the Electronics Packaging Society. (Takushoku University, Bunkyo Campus)
SEMINAR_EVENT
  • Dec 23, 2024
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Dec 23, 2024

We will exhibit a corporate booth at the 39th Spring Conference of the Electronics Packaging Society. (Takushoku University, Bunkyo Campus)

TAKAYA Corporation TAKAYA Corporation
Takaya Corporation will exhibit a corporate booth at the 39th Electronics Packaging Society Spring Conference, which will be held from March 11 (Tuesday) to March 13 (Thursday), 2025, at the Bunkyo Campus of Takushoku University. This conference is held annually under the management of the Japan Electronics Packaging Society, providing a platform for the presentation and exchange of the latest research and development results related to electronics packaging technology. Starting in 2023, a hybrid format combining in-person participation and online attendance has been implemented, attracting around 700 participants, primarily from academia and industry related to electronics packaging technology. When you visit, please be sure to stop by Takaya's booth. (Registration and payment of participation fees are required for attendance.)
Date and time Tuesday, Mar 11, 2025 ~ Thursday, Mar 13, 2025
Capital Shizuoka University Bunkyo Campus & Online Hybrid Event 〒112-8585 3-4-14 Kohinata, Bunkyo-ku, Tokyo
Entry fee Charge
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Flying Probe Tester APT-2400F / 2600FD

2025 Electronics Packaging Society Technical Award Winner!" "55th Mechanical Industry Design Award IDEA Winner!

Takaya Corporation has announced a new model of its flying probe tester, the "APT-2400F/APT-2600FD series," which reliably detects various defects in printed circuit boards through ultra-high-speed inspection. Equipped with cutting-edge inspection technology that can check the placement and connections of fine components with high precision, it ensures that even minor defects and risks are not overlooked, strongly supporting the improvement of product quality. Additionally, thanks to the company's unique control mechanisms and sensing technology, reliable inspections can be achieved even in fluctuating environments, contributing to quality management by reducing recall risks. Furthermore, it features a user-friendly interface that anyone can intuitively operate, helping to alleviate burdens in workplaces where labor shortages are becoming serious, while still ensuring high inspection accuracy and contributing to increased productivity. *For more details, please download the PDF document or feel free to contact us.*

  • Circuit Board Inspection Equipment

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Flying Probe Tester APT-2400F

Equipped with a high-performance measurement system and a variety of functions, it contributes to quality improvement from prototyping to mass production!

The APT-2400F is a next-generation flying probe tester that boasts industry-leading probing accuracy capable of inspecting high-density mounted circuit boards. With its unique control mechanisms and sensing technology, it achieves highly reliable electrical testing in all environments. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your circuit boards. We can conduct a series of tests including the creation of inspection programs, testing using actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.

  • Other measurement, recording and measuring instruments

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Flying Probe Tester APT-2400F-SL

Equipped with a high-performance measurement system and a variety of functions, it contributes to quality improvement from prototyping to mass production!

The APT-2400F-SL is a large model that maintains the basic performance of the APT-2400F while expanding the compatible board size to W635×D610mm. Furthermore, by adding an optional split inspection function, it is capable of inspecting long boards up to W985×D610mm. It can accommodate component heights of up to 60mm on the top and 120mm on the bottom, and can handle board weights of up to 15kg, making it suitable for inspecting large and heavy boards such as those used in automotive, aerospace, medical devices, power supply boards, and probe cards. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your boards. A complete testing process is possible, including the creation of inspection programs, testing with actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.

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Dual Side Flying Probe Tester APT-2600FD

A new innovation in substrate manufacturing. Achieving improvements in production efficiency and inspection accuracy!

The APT-2600FD is a next-generation dual-side flying probe tester that can perform combination testing with up to 6 probes using both upper and lower flying probes simultaneously. It improves test coverage while reducing the risk of product damage due to board flipping operations, significantly shortening inspection time. Equipped with a high-performance measurement system and a variety of features, it contributes to quality improvement from prototyping to mass production. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your boards. A complete testing process is possible, including the creation of inspection programs, testing using actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.*

  • Circuit Board Inspection Equipment

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APT-2600FD-SL-768x530.png

Dual Side Flying Probe Tester APT-2600FD-SL

A new innovation in substrate manufacturing. Achieving improvements in production efficiency and inspection accuracy!

The APT-2600FD-SL is a large model that maintains the basic performance of the APT-2600FD while expanding the compatible board size to W635×D610mm. Furthermore, by adding an optional split inspection function, it can inspect long boards up to W985×D610mm. It can accommodate components with a height of 60mm and board weights of up to 15kg, making it suitable for inspecting large and heavy boards such as those used in automotive, aerospace, medical devices, power supply boards, and probe cards. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your boards. A complete testing process is possible, including the creation of inspection programs, testing with actual boards, and summarizing evaluation results. On July 31, 2025, at the Keidanren Kaikan in Otemachi, Chiyoda-ku, Tokyo, this product received the "Nikkankogyo Shimbun 110th Anniversary Award" at the "55th Mechanical Industry Design Award IDEA" ceremony. The judging committee praised the design philosophy that balances inspection efficiency and reliability, providing an opportunity for our technological and product design capabilities to be widely recognized. *For more details, please feel free to contact us.*

  • Circuit Board Inspection Equipment

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スクリーンショット 2023-02-24 112144.jpg

Collaboration with boundary scan testing using a flying probe tester.

We will create new value through the mutual complementarity of ICT and BST.

In-circuit testing with a flying probe tester excels at inspecting the electrical characteristics of implemented electronic components in analog circuits. However, components that cannot be probed make electrical testing difficult, and functional testing of digital circuits is challenging. On the other hand, boundary scan testing allows for quick interconnection testing between LSI pins and on-board programming for FPGAs, but it can only test digital circuits around ICs that comply with the boundary scan standard, and it also requires specialized fixtures for connections. At Takaya Corporation, we possess technology that uses flying probes instead of fixtures to connect 4 to 5 scan-compatible pins and measuring instruments required for boundary scan testing. This allows for boundary scan testing even when the counterpart of a boundary scan-compliant IC is a non-boundary scan-compliant IC or passive components (such as connectors) by enabling the flying probe to function as a virtual boundary scan cell. With a single flying probe tester, it is possible to conduct comprehensive testing of both digital and analog circuits, thereby significantly enhancing testing efficiency compared to before.

  • Circuit Board Inspection Equipment

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Implementation Technology Journal Electronics Implementation Technology Special Feature Article Published

We have received permission to publish the feature article that was included in the only domestic magazine specializing in implementation technology, "Electronics Implementation Technology." You can view it here.

Special Feature Content ■ Latest Trends in BGA Implementation Board Inspection Hybrid Inspection of Flying Probe Testers and JTAG Testing Andor System Support Co., Ltd. / Masayuki Taniguchi Takaya Co., Ltd. / Kohei Yanagida Overview BGA (Ball Grid Array) components are now used in all types of electronic devices, from consumer products to industrial equipment, and more recently, automotive devices. However, a reliable method for inspecting boards with BGA components (hereafter referred to as BGA implementation boards) has not been established. This is because every inspection method has its advantages and disadvantages, making it impossible to conduct a complete test using only one inspection method. Therefore, inspecting BGA implementation boards has become a challenge for many companies. In this article, we will introduce the latest technological trends in hybrid inspection that combines flying probe testers and JTAG (Joint Test Action Group) boundary scan as one solution to this issue. 1. Introduction 2. Inspection and Challenges of BGA Implementation Boards 3. Possibilities of Electrical Testing 4. In-Circuit Testing 5. JTAG Boundary Scan Testing 6. Hybrid Testing 7. Conclusion

  • Circuit Board Inspection Equipment

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Accelerating the inspection of flying probe testers using deep reinforcement learning.

We have published a joint research report with Ehime University.

Takaya Corporation is conducting joint research with the Graduate School of Science and Engineering at Ehime University on accelerating the inspection of flying probe testers using deep reinforcement learning. At the Ehime University booth during the JPCA Show 2023 / 2023 Microelectronics Show held at Tokyo Big Sight from May 31 (Wednesday) to June 2 (Friday), we displayed and introduced a report on this research. You can download and view the report that was exhibited on that day from here. We encourage everyone to take a look.

  • Circuit Board Inspection Equipment

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Related catalog(6)

[Press Release] Takaya Corporation Announces New Models of Flying Probe Tester "APT-2400F/APT-2600FD Series"

[Press Release] Takaya Corporation Announces New Models of Flying Probe Tester "APT-2400F/APT-2600FD Series"

TECHNICAL
  • E-book viewing
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Flying Probe Tester APT-2400F

Flying Probe Tester APT-2400F

PRODUCT
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Latest Trends in Hybrid Testing Systems Combining JTAG Testing and Flying Probe Testers

Latest Trends in Hybrid Testing Systems Combining JTAG Testing and Flying Probe Testers

TECHNICAL
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  • Catalog download

Contact this catalog

Hybrid inspection system combining JTAG testing and flying probe testers.

Hybrid inspection system combining JTAG testing and flying probe testers.

TECHNICAL
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  • Catalog download

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Accelerating Inspection of Flying Probe Testers Using Deep Reinforcement Learning (Joint Research Report with Ehime University)

Accelerating Inspection of Flying Probe Testers Using Deep Reinforcement Learning (Joint Research Report with Ehime University)

TECHNICAL
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Company Profile Takaya Corporation

Company Profile Takaya Corporation

COMPANY
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TAKAYA Corporation
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We will exhibit at P-MEC Japan 2025, the Pharmaceutical Ingredients and Equipment Exhibition.

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  • SEMINAR_EVENT

We will be exhibiting at the "P-MEC Japan 2025 Pharmaceutical Ingredients and Equipment Exhibition" held at Tokyo Big Sight. During the event, we will showcase various products. We invite all relevant parties to come and visit us. 【Suppliers】 ・LAUDA

Mar 21, 2026

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[April 8 (Wednesday) to April 10 (Friday), 2026] Notice of participation in the 11th Manufacturing World Nagoya

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  • SEMINAR_EVENT

Seiko Co., Ltd. will be exhibiting at the "11th Monozukuri World Nagoya" held at Port Messe Nagoya. This exhibition features approximately 630 companies showcasing advanced technologies that contribute to shortening development and manufacturing periods, promoting DX and IT, reducing costs, and enhancing energy efficiency and automation in factories, including IT and DX products, parts, equipment, devices, and measurement products. We plan to display the actual cabinet for equipment management, "SMART BEE," so please be sure to visit us. 【Model Numbers】 ■ Vending Machine Type Tool Management Cabinet Smart Bee X, Smart Bee S, Cute Bee, Smart Bee Pro ■ Locker Shelf Type Tool and Consumables Management Cabinet T Series: T57, T100, T108 TW Series (with electronic scale): TW45, TW68, Hyper S, Hive

Mar 19, 2026

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We will exhibit at Japan DX Week Spring 2026.

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  • SEMINAR_EVENT

We will be exhibiting at "Japan DX Week Spring 2026," which will be held at Tokyo Big Sight from April 8 (Wednesday) to April 10 (Friday). At the Marble booth, we plan to showcase how AI can improve work efficiency and lead to business automation in on-site operations. Additionally, we will provide an opportunity to experience a demonstration utilizing the latest technology, AR. Furthermore, for our manufacturing industry customers, we will present proposals under the theme "Utilizing Drawings to Drive DX," promoting the digitalization of design and quality areas, and introducing packaged products and custom services aimed at enhancing productivity in the manufacturing sector.

Mar 19, 2026

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The optimal solution for business systems in the DX era - Strengthening core systems with kintone and data integration.

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  • SEMINAR_EVENT

Core systems are the foundational support for corporate management, and their importance is increasingly heightened in the DX era, where data becomes a source of competitive advantage. To respond swiftly and flexibly to the rapidly changing business environment, a transformation in the nature of systems is required. We will introduce a method to realize a highly flexible and scalable business system that promotes operational efficiency and data utilization through the combination of kintone and ASTERIA Warp, using examples and demonstrations.

Mar 19, 2026

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The Cutting Edge of Utilizing "AI Agents" to Accelerate Business Growth - Achieving Business Transformation and Strengthening Competitiveness with Autonomous Execution AI!

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  • SEMINAR_EVENT

The widespread adoption of generative AI is rapidly evolving from traditional "conversational AI" to "autonomous execution AI (AI agents)." The AI agents that have recently garnered attention are not limited to merely generating responses; they can incorporate an autonomous processing flow of "planning → task decomposition → execution → evaluation," serving as new partners that can substitute and expand users' business operations. In this seminar, we will clearly introduce the following topics, incorporating examples of the AI solution "AIdea Suite AGENT +plus" and the data integration tool "ASTERIA Warp": - Why "AI agents" are becoming essential for corporate competitiveness now - The mechanisms of AI agents and specific use cases - Methods for establishing business efficiency, creating new value, and gaining a competitive edge - Specific steps for implementing AI agents - Data integration and its methods, which are essential for utilizing AI *This is a re-broadcast of the seminar held on October 30, 2025 (Thursday).

Mar 19, 2026

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