We will exhibit a corporate booth at the 39th Spring Conference of the Electronics Packaging Society. (Takushoku University, Bunkyo Campus)

2025 Electronics Packaging Society Technical Award Winner!" "55th Mechanical Industry Design Award IDEA Winner!

Takaya Corporation has announced a new model of its flying probe tester, the "APT-2400F/APT-2600FD series," which reliably detects various defects in printed circuit boards through ultra-high-speed inspection. Equipped with cutting-edge inspection technology that can check the placement and connections of fine components with high precision, it ensures that even minor defects and risks are not overlooked, strongly supporting the improvement of product quality. Additionally, thanks to the company's unique control mechanisms and sensing technology, reliable inspections can be achieved even in fluctuating environments, contributing to quality management by reducing recall risks. Furthermore, it features a user-friendly interface that anyone can intuitively operate, helping to alleviate burdens in workplaces where labor shortages are becoming serious, while still ensuring high inspection accuracy and contributing to increased productivity. *For more details, please download the PDF document or feel free to contact us.*

• Circuit Board Inspection Equipment

Equipped with a high-performance measurement system and a variety of functions, it contributes to quality improvement from prototyping to mass production!

The APT-2400F is a next-generation flying probe tester that boasts industry-leading probing accuracy capable of inspecting high-density mounted circuit boards. With its unique control mechanisms and sensing technology, it achieves highly reliable electrical testing in all environments. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your circuit boards. We can conduct a series of tests including the creation of inspection programs, testing using actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.

• Other measurement, recording and measuring instruments

Equipped with a high-performance measurement system and a variety of functions, it contributes to quality improvement from prototyping to mass production!

The APT-2400F-SL is a large model that maintains the basic performance of the APT-2400F while expanding the compatible board size to W635×D610mm. Furthermore, by adding an optional split inspection function, it is capable of inspecting long boards up to W985×D610mm. It can accommodate component heights of up to 60mm on the top and 120mm on the bottom, and can handle board weights of up to 15kg, making it suitable for inspecting large and heavy boards such as those used in automotive, aerospace, medical devices, power supply boards, and probe cards. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your boards. A complete testing process is possible, including the creation of inspection programs, testing with actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.

• Other measurement, recording and measuring instruments

A new innovation in substrate manufacturing. Achieving improvements in production efficiency and inspection accuracy!

The APT-2600FD is a next-generation dual-side flying probe tester that can perform combination testing with up to 6 probes using both upper and lower flying probes simultaneously. It improves test coverage while reducing the risk of product damage due to board flipping operations, significantly shortening inspection time. Equipped with a high-performance measurement system and a variety of features, it contributes to quality improvement from prototyping to mass production. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your boards. A complete testing process is possible, including the creation of inspection programs, testing using actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.*

• Circuit Board Inspection Equipment

A new innovation in substrate manufacturing. Achieving improvements in production efficiency and inspection accuracy!

The APT-2600FD-SL is a large model that maintains the basic performance of the APT-2600FD while expanding the compatible board size to W635×D610mm. Furthermore, by adding an optional split inspection function, it can inspect long boards up to W985×D610mm. It can accommodate components with a height of 60mm and board weights of up to 15kg, making it suitable for inspecting large and heavy boards such as those used in automotive, aerospace, medical devices, power supply boards, and probe cards. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your boards. A complete testing process is possible, including the creation of inspection programs, testing with actual boards, and summarizing evaluation results. On July 31, 2025, at the Keidanren Kaikan in Otemachi, Chiyoda-ku, Tokyo, this product received the "Nikkankogyo Shimbun 110th Anniversary Award" at the "55th Mechanical Industry Design Award IDEA" ceremony. The judging committee praised the design philosophy that balances inspection efficiency and reliability, providing an opportunity for our technological and product design capabilities to be widely recognized. *For more details, please feel free to contact us.*

• Circuit Board Inspection Equipment

We will create new value through the mutual complementarity of ICT and BST.

In-circuit testing with a flying probe tester excels at inspecting the electrical characteristics of implemented electronic components in analog circuits. However, components that cannot be probed make electrical testing difficult, and functional testing of digital circuits is challenging. On the other hand, boundary scan testing allows for quick interconnection testing between LSI pins and on-board programming for FPGAs, but it can only test digital circuits around ICs that comply with the boundary scan standard, and it also requires specialized fixtures for connections. At Takaya Corporation, we possess technology that uses flying probes instead of fixtures to connect 4 to 5 scan-compatible pins and measuring instruments required for boundary scan testing. This allows for boundary scan testing even when the counterpart of a boundary scan-compliant IC is a non-boundary scan-compliant IC or passive components (such as connectors) by enabling the flying probe to function as a virtual boundary scan cell. With a single flying probe tester, it is possible to conduct comprehensive testing of both digital and analog circuits, thereby significantly enhancing testing efficiency compared to before.

• Circuit Board Inspection Equipment

We have received permission to publish the feature article that was included in the only domestic magazine specializing in implementation technology, "Electronics Implementation Technology." You can view it here.

Special Feature Content ■ Latest Trends in BGA Implementation Board Inspection Hybrid Inspection of Flying Probe Testers and JTAG Testing Andor System Support Co., Ltd. / Masayuki Taniguchi Takaya Co., Ltd. / Kohei Yanagida Overview BGA (Ball Grid Array) components are now used in all types of electronic devices, from consumer products to industrial equipment, and more recently, automotive devices. However, a reliable method for inspecting boards with BGA components (hereafter referred to as BGA implementation boards) has not been established. This is because every inspection method has its advantages and disadvantages, making it impossible to conduct a complete test using only one inspection method. Therefore, inspecting BGA implementation boards has become a challenge for many companies. In this article, we will introduce the latest technological trends in hybrid inspection that combines flying probe testers and JTAG (Joint Test Action Group) boundary scan as one solution to this issue. 1. Introduction 2. Inspection and Challenges of BGA Implementation Boards 3. Possibilities of Electrical Testing 4. In-Circuit Testing 5. JTAG Boundary Scan Testing 6. Hybrid Testing 7. Conclusion

• Circuit Board Inspection Equipment

We have published a joint research report with Ehime University.

Takaya Corporation is conducting joint research with the Graduate School of Science and Engineering at Ehime University on accelerating the inspection of flying probe testers using deep reinforcement learning. At the Ehime University booth during the JPCA Show 2023 / 2023 Microelectronics Show held at Tokyo Big Sight from May 31 (Wednesday) to June 2 (Friday), we displayed and introduced a report on this research. You can download and view the report that was exhibited on that day from here. We encourage everyone to take a look.

• Circuit Board Inspection Equipment

We will hold a webinar on the theme "What are the appropriate methods to protect intellectual property?" This seminar will explain the key points of intellectual property document management to achieve evidential strength, tampering prevention, and operational efficiency. We will also introduce the solution "WWDS Intellectual Property Archive," which automatically clarifies the location of documents and ensures authenticity through timestamps. ■ Date and Time: December 18, 2025 (Thursday) 13:30 - 14:30 ■ Location: Online Webinar (scheduled to be held via Zoom Webinar)

[Speaker] Yoshimitsu Umabashi, Senior Researcher, Smart Resilience Network Ambassador, Research Coordination Office, Grid Innovation Research Headquarters, Central Research Institute of Electric Power Industry (Former Vice President of TN Cross Corporation) [Lecture Items] 1. What is Watt-Bit? (1) Current state of power supply capacity (2) Changes in power demand and their causes (3) Integration of communication and electricity (the essence of Watt-Bit) 2. Impact of changes in power demand (1) Data centers as a significant factor (2) Supply chain surrounding data centers 3. Data centers as large-scale demand (1) Demand control and data centers (2) Perspectives of stakeholders surrounding data centers (3) Impact of data centers on the grid (4) Expectations from stakeholders surrounding data centers (5) New technologies anticipated in data centers 4. Current state and future of Watt-Bit (1) Watt-Bit Public-Private Liaison Council (2) Direction of international initiatives (3) Relation to the MESH concept (4) What can be achieved with Watt-Bit 5. Q&A / Business card exchange

[Speaker] Mr. Kei Nishishita, Senior Researcher, Advanced Technology Lab, Japan Research Institute, Ltd. [Key Lecture Content] Neurotech is a collective term for technologies that utilize insights from neuroscience, and in recent years, it has also been referred to as brain tech, with accelerated research and development and commercialization efforts both domestically and internationally. This seminar will systematically organize the foundational technologies and latest trends in the neurotech field, while also highlighting advanced initiatives underway in Japan and abroad, explaining their characteristics and implications. Additionally, considering the current state of neurotech being implemented in society, we will also address changes in the surrounding environment, such as ethics, legal frameworks, and social acceptance. Furthermore, as the integration with the AI field progresses, we will explore what developments can be anticipated in the future and what opportunities and risks may arise in business development from a multifaceted perspective. [Lecture Items] 1. Overview and Current Status of Neurotech 2. Advanced Examples of Neurotech 3. Social Trends Surrounding Neurotech 4. Future Outlook and Strategies for Business Applications 5. Q&A

[Speaker] Takuki Nakani, Representative and Analyst, Nakanishi Automotive Industry Research Co., Ltd. Author of "Toyota vs. Chinese EVs" [Key Lecture Content] A powerful group of the strongest EV manufacturers in the Chinese market and their robust supporting ecosystem are emerging prominently. This is organically linked to China's digital national strategy. As the competitive landscape of the global automotive industry changes with the evolution of SDVs and AI, can Japanese manufacturers chart a path to victory? With an eye on the fragmentation of industrial hegemony, we will examine the future structure of the automotive industry. [Lecture Items] 1. The structure of the battle over intelligence 2. Competitiveness of the strongest Chinese EV manufacturers 3. Japan's OEM strategy against China 4. Japan's path to victory – SDV value chain strategy 5. Evolution of manufacturing accompanying the SDV shift 6. Q&A / Business card exchange

Sansin Manufacturing Co., Ltd. will be exhibiting at the "SURTECH 2026 Surface Technology Elements Exhibition" held at Tokyo Big Sight. At our booth, we plan to showcase wastewater treatment equipment utilizing IoT technology. We look forward to your visit. <Event Overview> ■ Venue: Tokyo Big Sight, South Hall 4 ■ Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 ■ Booth Number: 3S-U22 ■ Nearest Stations: - Rinkai Line: Kokusai Tenjijo Station (approximately 7 minutes on foot) - Yurikamome: Tokyo Big Sight Station (approximately 3 minutes on foot)