We will be exhibiting at TCT Asia 2025, which will be held in Shanghai, China from March 17 (Monday) to March 19 (Wednesday), 2025.

[Form Next Exhibition] True spherical, high fluidity, high density, high temperature high strength, high fatigue strength, high rigidity, aluminum alloy for 3D printers!

We have prepared aluminum alloy powder that is optimal for 3D additive manufacturing. Based on aluminum, it is possible to blend various metals such as scandium, zirconium, titanium, silicon, nickel, copper, iron, and zinc. Additionally, we can also discuss blends with non-metal compositions such as ceramics. We will propose specifications for particle size according to the equipment you are using. For any inquiries regarding aluminum alloy powder, please consult us. We are also working on the recycling of used powder. 【Search Keywords】 #Spheralloy #SPHERALLOY #3DAdditiveManufacturing #3DPrinter #3DPrint #Metal3DPrinter #Microstructure3DPrinter

• Other machine elements

From semiconductor substrates to powder applications. A lineup of grades tailored to diverse needs!

"Toyaru Night" is a sintering-grade aluminum nitride powder that combines high thermal conductivity and insulation properties. It is a unique material with high thermal conductivity and insulation, primarily used in electronic devices and semiconductor manufacturing equipment. Due to its ultra-high purity, it is characterized by high thermal conductivity after sintering. Additionally, it is possible to adjust the particle size distribution during the grinding process, which allows for a higher density of the molded body, resulting in a smaller shrinkage rate and increased strength of the sintered body. [Features] ■ Achieves ultra-high purity by minimizing impurities ■ Ability to adjust particle size distribution during the grinding process ■ Thorough quality control through consistent production from aluminum raw material procurement *For more details, please refer to the PDF document or feel free to contact us. [Search Keywords] #HighPurityAluminumNitridePowder #Hydrolysis #Substrate #ThermalConductivity #ThermalExpansion

• Other semiconductors

A wide range of incineration grades available! Meeting various needs.

"Toyarunight" is an aluminum nitride powder with high thermal conductivity and electrical insulation properties. By minimizing impurities, ultra-high purity is achieved. Due to its wide particle size distribution, it allows for the production of high-strength sintered bodies. 【Features】 - High thermal conductivity - Good bending strength - Insulation / thermal expansion *For more details, please refer to the PDF document or feel free to contact us.

• aluminum

Grades tailored for incineration, filler use, and other applications are lined up! We meet various needs.

"Toyaru Night" is an aluminum nitride powder that combines high thermal conductivity and insulation properties. It is a unique material with high thermal conductivity and insulation, primarily used in electronic devices and semiconductor manufacturing equipment. Additionally, it is possible to adjust the particle size distribution during the grinding process, and due to its high density in the molded body, the shrinkage rate is reduced, resulting in higher strength of the sintered body. [Features] ■ Achieves ultra-high purity by minimizing impurities in the raw material AIN process ■ Ability to adjust particle size distribution during the grinding process ■ Thorough quality control through consistent production from aluminum raw materials *For more details, please refer to the PDF materials or feel free to contact us.

• aluminum

Powder metallurgy, refractory materials, catalysts, 3D additive manufacturing, rocket fuel.

Aluminum powder is made by spraying molten aluminum into a mist to create fine particles, and the shape of the particles is spherical or close to that shape.

• aluminum

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including our new product, the Pillow Packaging Full Air Tightness Inspection Machine MSQ-2003. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to visit us at this opportunity. 【 Exhibition Name 】 JAPAN PACK 2025 Japan Packaging Industry Exhibition https://www.japanpack.jp/ 【 Dates 】 October 7 (Tuesday) to October 10 (Friday), 2025 *4 days 10:00 AM to 5:00 PM 【 Venue / Booth Number 】 Tokyo Big Sight / East Hall 8, Booth 8-505

Sanei Hitec Co., Ltd. will exhibit at SENSOR EXPO JAPAN 2025, which will be held from September 10 (Wednesday) to September 12 (Friday), 2025. At this Sensor EXPO 2025, we will showcase our semiconductor design technology and high-performance IP (Intellectual Property) that support the evolution of sensors.

Sanei Hightex Co., Ltd. will exhibit at the "Student Formula Japan Championship 2025" at the Shizuoka Prefecture booth in Aichi Sky Expo Exhibition Halls E and F from September 11 to 13, 2025.

We would like to inform you that we will be exhibiting our products at the 63rd Annual Meeting of the Biophysical Society of Japan. If you are planning to attend, please be sure to stop by. ❚ Products to be Exhibited - Auto Patch Clamp System | Port-a-Patch mini This compact system eliminates the need for a microscope, vibration isolation table, manipulator, and Faraday cage, which are typically required for conventional patch clamp experiments. It does not require specialized skills or experience, allowing for easy data acquisition and verification. - Artificial Lipid Bilayer Experiment Device | Orbit mini This device allows for easy measurement of channel activity at the single-molecule level. It enables the formation of lipid membranes, reconstitution of membrane proteins, and single-channel measurements using only a micropipette in experiments utilizing artificial lipid bilayers, facilitating functional and structural analysis of target membrane proteins and evaluation of drug effects. - Liposome Preparation Device | Vesicle Prep Pro This is the world's first device capable of producing giant unilamellar vesicles (GUVs) with diameters ranging from 1 to 30 μm without the use of organic solvents, utilizing the electroporation method (vibrating hydrated lipid films in an alternating electric field).

The success or failure of an AI project depends on the quality and immediacy of the "data infrastructure." By combining no-code and low-code products, it is possible to achieve a seamless process from data collection to integration and AI utilization, efficiently building a data infrastructure that supplies high-quality data to AI. We will explain specific methods for flexibly and quickly constructing a data infrastructure, incorporating case studies and demos, and introduce key points of a data strategy to lead to successful AI utilization.