Added a page on the removal of "sintering agent residue + tackifier" composite organic matter [joint research with Mr. McDermid].

In recent years, the advancement of electronic devices has led to a demand for advanced bonding technologies that can withstand high temperatures, large currents, and high voltages.
In particular, in power devices, there are increasing cases where conventional solder types do not provide sufficient performance. While high Pb solder and Au/Sn solder can be applied, the use of "sintered bonding" is expanding due to considerations such as environmental regulations and costs, as it can form a high-density bonding layer.
This article will examine effective cleaning methods utilizing spray cleaning and ultrasonic cleaning, and introduce the features and application examples of the cleaning agents VIGON PE 305N and VIGON PE 216A for power electronics.


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