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  6. Removal of sinter agent residue + tack agent, joint research with Mr. McDermid.

Removal of sinter agent residue + tack agent, joint research with Mr. McDermid.

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last updated:Apr 15, 2025

ゼストロンジャパン
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Explaining the cleaning effect of complex organic substances after using the currently popular sintering agent! Joint research with Mr. McDermid.

In recent years, the advancement of electronic devices has led to a demand for advanced bonding technologies that can withstand high heat, large currents, and high voltages. In particular, in power devices, there are increasing cases where conventional solder types do not provide sufficient performance. While high Pb solder and Au/Sn solder can be applied, the use of "sintered bonding" is expanding due to environmental regulations and cost considerations, as it can form a high-density bonding layer. This article examines effective cleaning methods utilizing spray cleaning and ultrasonic cleaning, and introduces the features and application examples of cleaning agents VIGON PE 305N and VIGON PE 216A for power electronics. *For detailed content of the article, please refer to the related links. For more information, you can download the PDF or feel free to contact us.

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【共同研究】シンター剤残渣+タック剤の除去.png

Removal of sinter agent residue + tack agent, joint research with Mr. McDermid.

【共同研究】シンター剤残渣+タック剤の除去.png
【共同研究】シンター剤残渣+タック剤の除去.png シンター剤残渣+タック剤2.png シンター剤残渣+タック剤3.png シンター剤残渣+タック剤4.png シンター剤残渣+タック剤5.png シンター剤残渣+タック剤6.png
  • Related Link - https://www.zestron.com/jp/know-how/case-study-mac…
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Cleaning technology required for sintered joint devices [Materials]

Cleaning technology required for sintered joint devices [Materials]

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Exploring the Current State of Solder Cleaning: The Evolution of Solder and Cleaning

Exploring the Current State of Solder Cleaning: The Evolution of Solder and Cleaning

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Added a page on the removal of "sintering agent residue + tackifier" composite organic matter [joint research with Mr. McDermid].

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In recent years, the advancement of electronic devices has led to a demand for advanced bonding technologies that can withstand high temperatures, large currents, and high voltages. In particular, in power devices, there are increasing cases where conventional solder types do not provide sufficient performance. While high Pb solder and Au/Sn solder can be applied, the use of "sintered bonding" is expanding due to considerations such as environmental regulations and costs, as it can form a high-density bonding layer. This article will examine effective cleaning methods utilizing spray cleaning and ultrasonic cleaning, and introduce the features and application examples of the cleaning agents VIGON PE 305N and VIGON PE 216A for power electronics.

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Zestron is a global standard "flux cleaning agent manufacturer" based in Germany, with eight locations worldwide. Our cleaning agents are primarily environmentally friendly water-based cleaners that achieve a balance between cleaning performance and safety, while also enabling the reduction of organic solvents, VOCs, and overall usage to lower costs. At our technical center in Kanagawa, customers can choose from inline and batch-type spray cleaning equipment, as well as jet and ultrasonic devices, tailored to their needs, allowing them to test work cleaning under conditions equivalent to those in production environments. In parallel with the cleaning tests, we analyze cleanliness at our analysis center. Utilizing digital microscopes, FT-IR, ion chromatography, and SEM-EDX/EDS, we can detect flux residues that are often overlooked by visual inspection. After the tests are completed, our engineers will provide a technical report detailing recommended processes. *We generally offer support for cleaning process issues free of charge. If you have any requests or challenges related to flux cleaning, please feel free to contact us.

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