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  1. Home
  2. Testing, Analysis and Measurement
  3. 穂高電子
  4. April 24th Event: MATLAB JMAG Integrated MBD Solution Seminar - Achieving Front-Loading with Domestic Manufacturer's Toolchain -
SEMINAR_EVENT
  • Apr 03, 2025
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Apr 03, 2025

April 24th Event: MATLAB JMAG Integrated MBD Solution Seminar - Achieving Front-Loading with Domestic Manufacturer's Toolchain -

穂高電子 穂高電子
We have organized a joint seminar by three domestic companies that provide MBD tools in the field of power electronics. This seminar will introduce a toolchain that covers everything from the upstream design of power electronic systems using MATLAB and JMAG to functional verification on actual devices in a seamless manner. Additionally, Murata Manufacturing Co., Ltd. will present case studies on the application of MBD in power systems, including the definition of requirements, the transition to MILS, and the purposes and considerations for using RCP and HILS, along with several application examples. This seminar will provide valuable content for those who are currently engaged in MBD development as well as those who are looking to start.
Date and time Thursday, Apr 24, 2025
01:00 PM ~ 03:30 PM
*We kindly ask that companies in the same industry and competing firms refrain from participating. We apologize for the inconvenience and appreciate your understanding.
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Entry fee Free
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Scideam.jpg

Circuit simulator Scideam equipped with SiC/GaN device models.

"Front-loading" realized with the high-speed circuit simulator Scideam, equipped with a SiC/GaN device model, enabling loss analysis.

We would like to introduce Scideam, a domestic high-speed circuit simulator equipped with a SiC/GaN device model. It provides a comfortable simulation environment through over 25 years of historical computational algorithms and newly developed circuit editors and waveform viewers. By utilizing it in the early stages of development, you can preemptively eliminate factors such as specification failures and defects, thereby reducing design time and costs. This enables the realization of what is known as "front-loading."

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[MBD Case Study] Verification of ECU Fail Detection during Inverter Switch Failure

Verification of whether failure detection during inverter malfunction can be performed within the detection time (within 100 ms).

This document verifies whether a failure can be detected within 100 ms of the occurrence of an open fault in the U-phase upper arm. Failure detection is determined by extracting components of fourth order or higher from the current waveform using a high-pass filter. 【Contents】 ■ System Configuration ■ Controller Specifications ■ Motor Specifications ■ Verification Details ■ Verification Results ■ Discussion *For more details, please download the PDF or feel free to contact us.

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MATLAB/Compatible High-Speed Simulator RCP Device DT-0007

MATLAB/Simulink compatible high-speed motor support rapid prototyping controller

This is a rapid prototype controller that can execute models created in MATLAB/Simulink in real-time. It achieves a simulation cycle on the order of microseconds using dedicated hardware with an ARM core and FPGA. It is an ideal product for prototyping motor control controllers that require high-speed control calculations. The hardware utilizes a high-speed FPGA and multi-core CPU, featuring: - Minimal response time - High-speed, low-latency I/O with external peripherals - Large-capacity memory available for user use - Fundamental review of simulation management applications - Significant improvement in computation speed while maintaining calculation accuracy - Dramatic improvement in reproducibility - Improvement in reproducibility through the subdivision of calculation steps - Capability to implement solvers that require particularly fast calculations on the internal FPGA*1 System specifications: - Implementation method: Simulink Coder - Minimum step time: 1 [μsec] - Vector control current loop for PMSM*2: 0.6 [μsec] - Memory freely available for user use: 512 [MB]

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Scideam High-Speed Circuit Simulator Compatible with MATLAB and JMAG

30 years of supported computational power - High-speed circuit simulator for power electronics, Scideam.

Scideam is a domestic high-speed circuit simulator specialized in power generation development and power electronics development. It provides a comfortable simulation environment with over 30 years of historical computational algorithms and newly developed circuit editors and waveform viewers. ◆ Three features of Scideam 1. High-speed stable analysis By utilizing a unique analysis algorithm, it resolves both analysis time and convergence issues. It is capable of high-speed stable analysis of switching converters. 2. Loss analysis It can perform loss analysis automatically and at high speed. It displays losses for all components in a list, and switching losses are also measured automatically. 3. Model-based development It connects with MATLAB Simulink and JMAG to build a model-based development environment. *For new download PCs, you can try the full package, including the Scideam product version and the loss analysis option PowerPalette, for 30 days.

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Scideam loss analysis possible with Simulink! High-speed circuit simulator

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[Notice of Exhibition Participation by Fukuda Co., Ltd.] TOKYO PACK 2026 Tokyo International Packaging Exhibition

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We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

Oct 08, 2026

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Creating an environment that thrives even in extreme heat: Introducing the results of closed-type greenhouse demonstrations and summer cooling methods - Exhibiting at the 14th Agricultural WEEK (commonly known as J-AGRI)

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Yazaki Energy System will be exhibiting at the "14th Agricultural WEEK (commonly known as J-AGRI)" held at Makuhari Messe. In response to challenges surrounding agriculture, such as record heat and soaring energy prices, our company proposes an agricultural system that utilizes surplus solar heat and waste heat from factories during the summer to support stable cultivation throughout the year, from winter heating to summer cooling. ■ Exhibition Details (Booth Number: 25-47) <Closed-type Agricultural House> Results from the second season and initiatives for the third season <Localized Cooling in Solar-Powered Agricultural Houses> Mechanism of substrate cooling, comparison of energy consumption with spatial cooling, growth conditions this summer <Cooling and Heating with Solar Heat> Examples of crown heating and house cooling, utilization of surplus heat in summer <Cooling of Crops and Workers with Well Water> Exhibition of a prototype well water cooler and proposals for the use of cooling jackets When you visit, please be sure to stop by our booth.

Oct 06, 2026

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Information on Autumn/Winter Internships for the Class of 2028

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We would like to inform you about the autumn and winter internship opportunities for the 2028 graduates. 1. Open Company Dates: October 23, 2026 (Friday), November 11, 2026 (Wednesday), December 10, 2026 (Thursday), January 21, 2027 (Thursday) Time: 13:30 - 15:30 Location: Online (Microsoft Teams) 2. 1-Day Job Experience Dates: November 17, 2026 (Tuesday), December 16, 2026 (Wednesday) January 15, 2027 (Friday), January 27, 2027 (Wednesday), February 4, 2027 (Thursday), February 10, 2027 (Wednesday), February 18, 2027 (Thursday) Time: 10:00 - 17:30 (tentative) Location: Takaya Corporation Headquarters (661-1 Ibara-cho, Ibara City, Okayama Prefecture)

Oct 06, 2026

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Notice of Participation in FOOD Expo 2026 (November 11-13, 2026)

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Notice of participation in the "FOOD Expo 2026." 【Date and Time】  November 11 (Wednesday) - 13 (Friday), 2026  Opening hours: 10:00 AM - 5:00 PM 【Venue】  Tokyo Big Sight  East Hall 2, Booth Number B-36 【Exhibits】  Cardboard insulated boxes  Craft cooler cubes  Vacuum insulated panel  Pallet cubes

Oct 06, 2026

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[Seminar] From Generative AI to Physical AI: The Cutting Edge of Market and Industry Structure and Technology Development

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[Lecture Topics] 1. Co-creation Strategy to Deliver AI to the Field - Business Development and Joint Ventures in the Era of Generative AI and Physical AI Mr. Haruto Suzuki, Industrial and Regional Research Department, Development Bank of Japan 1. The Mechanism of Generative AI and Its Current Utilization by Companies 2. Expansion of the Generative AI Market and AI Infrastructure 3. Transition from Generative AI to Physical AI 4. Bottlenecks in Social Implementation and Solutions through Joint Ventures 5. Formation of an Implementation Ecosystem through Policy and Finance 6. Q&A / Business Card Exchange 2. Needs, Development Trends, Future Possibilities, and Challenges of Physical AI Mr. Kazushi Asama, Senior Researcher, Next-Generation Robot Research Organization, Waseda University / Emeritus Professor, University of Tokyo 1. What Physical AI Means 2. Needs for Physical AI and the Technological Trends of Generative AI Behind It 3. Development Trends of Physical AI 4. Future Possibilities and Challenges of Physical AI 5. Q&A / Business Card Exchange

Oct 06, 2026

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  • 技術・製品展示会 新技術創出交流会2026 入場無料 来場登録受付中 開催日時10月22日木・23日金 会場東京たま未来メッセ
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