We will exhibit at the MEMS Engineer Forum 2025.

Remote source ion beam sputtering device manufacturer for remote plasma sources.

PlasmaQuest is a reputable company with a 25-year history in the development and sales of helicon-type high-density ion sources and related application products. The gridless helicon plasma source generates high-density plasma and continues to provide OEM supply to many equipment manufacturers. Utilizing this high-quality plasma source as an ion source, the groundbreaking "HiTUS" system applies bias to the target, enabling sputtering under various conditions and with different targets. It allows for sputtering of high magnetic targets and high dielectric targets, which are considered difficult with conventional magnetron sputtering devices, as well as co-sputtering using heterogeneous targets such as metals and ceramics, making it suitable for a wide range of applications. The company is equipped to flexibly respond to both research applications and production-scale equipment.

• Sputtering Equipment

We achieve film formation by freely controlling reactive sputtering and alloy sputtering.

Independent current control is performed for the ion source, target, and substrate. With independent control, not only the sputter rate but also various reactive sputtering processes such as oxide and nitride films can be freely controlled. This device strongly supports advanced material research and process development, enabling the deposition of difficult-to-deposit materials such as ferromagnetic films, Co-sputtering of metal and ceramic targets, and dielectric/insulating films from metal targets. Independent control of ion supply and sputter rate → Control of sputter rate, film quality, and crystal structure → Control of ionization rate of target materials High-directionality film deposition → High-directionality film deposition characteristic of ion beam sputtering Multi-target mechanism → Wide-ranging multilayer film deposition Independent control of multiple targets → Co-sputtering alloy deposition by controlling the sputter rate of each target → Multilayer deposition by switching targets Conformal film deposition through bias application control to the substrate → Conformal film deposition even under adverse conditions such as deep trenches and overhangs.

• Sputtering Equipment
• Plasma Generator
• Other surface treatment equipment

High-rate and high-quality film formation of dielectric and ferromagnetic materials.

This is a high-speed ion beam sputtering (IBD) device that excels in the deposition of dielectrics such as Al2O3 and SiO2, which typically have low deposition rates in conventional magnetron sputtering, as well as ferromagnetic materials like Fe. By using a helicon plasma source as the ion source and a groundbreaking method that accelerates the high-density ions obtained from it through the application of bias voltage to the target, it achieves high-rate and highly directional film deposition. It also contributes to cost reduction in deposition processes using valuable and rare targets by efficiently utilizing the entire target surface. <Features> ■ High-speed, high-efficiency ion beam sputtering Optimal solution for dielectric and ferromagnetic targets ■ Helicon plasma ion source and target application Achieving both high-speed sputtering and low contamination Reduction of running costs through improved target utilization efficiency Maintenance reduction due to gridless structure Sputtering while keeping the substrate at low temperature through remote plasma configuration ■ Wafer processing Improved step coverage Composite film deposition using cluster tools ■ Excellent directionality Uniform film thickness can be achieved with a highly directional ion beam, resulting in excellent step coverage in film deposition.

• Sputtering Equipment

This valve is designed in accordance with Japanese standards for applications in chemicals, petrochemicals, reactive monomers, fire-resistant and flammable substances, paper pulp, and more. Main Features Adopts a stem protrusion prevention structure. The seat features a lip structure that enhances the durability of the seat. Additionally, even in the event of seat burn-through, it quickly prevents seat leakage through metal touch. The E seat is excellent in pressure resistance and heat resistance, and its white color eliminates concerns about color contamination. To prevent gland leakage, a re-tightenable gland flange type is adopted. Complies with JIS flange specifications. Electrostatic discharge prevention design according to ISO 17292. Achieves reliable airtightness with a bidirectional flow valve design according to API 598. Fire-safe structure based on ISO 10497:2022 / API 607 8th edition (certified). Atmospheric pollution prevention structure certified to ISO 15848-1 Class BH C03 (certified). Body materials of SCS13A and SCS14A are available. Precision casting. Adopts ISO 5211 top mount, allowing actuator installation without touching the pressure-resistant component, the gland bolt.

IsoLite Industrial 1600SF Blanket with 3mm thickness has arrived. ■ This product is not subject to the Specific Chemical Substances Hazard Prevention Regulations (Tokka Regulations) by the Ministry of Health, Labour and Welfare. For more details, please contact us.

Fukuda Co., Ltd. has been pursuing leak detection for 60 years and is committed to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing properties. We will propose the appropriate testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)

Thank you for always using Paper Logic. We would like to inform you about our support system during the year-end and New Year holidays. ■ Holiday Period: December 27, 2025 (Saturday) to January 4, 2026 (Sunday) During the above period, customer support via inquiry forms and emails will be suspended. Inquiries will be accepted, but responses will be provided sequentially starting from January 5, 2026 (Monday). Please note that various functions, including electronic contracts, can still be used as usual during the holiday period. ■ Contact Information for This Matter Please contact us via the [Inquiry Form]. https://paperlogic.co.jp/contact/ We sincerely apologize for any inconvenience this may cause and appreciate your understanding. We look forward to your continued use of Paper Logic.

We would like to express our sincere gratitude for your continued support. We regret to inform you that our company will be closed for the year-end and New Year holidays during the period mentioned below. We kindly ask for your understanding. Please note that during the year-end and New Year period, we expect congestion in shipping services, and depending on the product, it may take longer than usual for delivery. We apologize for the inconvenience and ask that you place your orders with ample lead time. ■ Year-end and New Year Holiday Period From Saturday, December 27, 2025, afternoon to Sunday, January 4, 2026. *Normal operations will resume on Monday, January 5, 2026. ■ Regarding Year-end Shipments - For in-stock items, orders placed by the morning of Thursday, December 25, will be shipped on Friday, December 26. - For made-to-order items, we will handle them after the New Year. - Please note that there will be no shipping operations on Saturday, December 27. We apologize for any inconvenience this may cause our customers and appreciate your understanding and cooperation.